TW200802921A - Light-Emitting Diode and the method of manufacturing the same - Google Patents

Light-Emitting Diode and the method of manufacturing the same

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Publication number
TW200802921A
TW200802921A TW95119528A TW95119528A TW200802921A TW 200802921 A TW200802921 A TW 200802921A TW 95119528 A TW95119528 A TW 95119528A TW 95119528 A TW95119528 A TW 95119528A TW 200802921 A TW200802921 A TW 200802921A
Authority
TW
Taiwan
Prior art keywords
stress
layer
light
led
emitting diode
Prior art date
Application number
TW95119528A
Other languages
Chinese (zh)
Other versions
TWI288980B (en
Inventor
Wen-Chieh Huang
zhao-xin Wang
Ying-Che Song
guang-rong You
Original Assignee
Arima Optoelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arima Optoelectronics Corp filed Critical Arima Optoelectronics Corp
Priority to TW95119528A priority Critical patent/TWI288980B/en
Application granted granted Critical
Publication of TWI288980B publication Critical patent/TWI288980B/en
Publication of TW200802921A publication Critical patent/TW200802921A/en

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  • Led Devices (AREA)

Abstract

The present invention disclosed the structure of a light-emitting diode (LED). There is to form a structured composite stress release buffer layer (SCSRBL) that is horizontally and vertically disposed and compositely formed between a permanent substrate and a LED structure layer. This crossly formed 3-dimensional structure can release and rearrange the stress caused by a LED compression process. The vertical layer can withstand the front stress and the horizontal layer can absorb the heat stress. Moreover, this 3-dimensional structure can be compositely formed by two or more than two types of materials so the coefficient of thermal expansion of the composite material is between that of a temporary substrate and that of a permanent substrate to reduce the influence of strain and stress on a light-emitting active layer.
TW95119528A 2006-06-02 2006-06-02 Light-Emitting Diode and the method of manufacturing the same TWI288980B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95119528A TWI288980B (en) 2006-06-02 2006-06-02 Light-Emitting Diode and the method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95119528A TWI288980B (en) 2006-06-02 2006-06-02 Light-Emitting Diode and the method of manufacturing the same

Publications (2)

Publication Number Publication Date
TWI288980B TWI288980B (en) 2007-10-21
TW200802921A true TW200802921A (en) 2008-01-01

Family

ID=39228509

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95119528A TWI288980B (en) 2006-06-02 2006-06-02 Light-Emitting Diode and the method of manufacturing the same

Country Status (1)

Country Link
TW (1) TWI288980B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8502257B2 (en) 2009-11-05 2013-08-06 Visera Technologies Company Limited Light-emitting diode package
TWI495141B (en) * 2008-08-01 2015-08-01 Epistar Corp Method for forming wafer light-emitting construction and light-emitting device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI427821B (en) * 2008-03-28 2014-02-21 Univ Nat Chunghsing Method for fabricating planar conduction type light emitting diodes with thermal guide substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI495141B (en) * 2008-08-01 2015-08-01 Epistar Corp Method for forming wafer light-emitting construction and light-emitting device
US8502257B2 (en) 2009-11-05 2013-08-06 Visera Technologies Company Limited Light-emitting diode package
TWI496324B (en) * 2009-11-05 2015-08-11 Semileds Optoelectronics Co Light emitting diode package

Also Published As

Publication number Publication date
TWI288980B (en) 2007-10-21

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MM4A Annulment or lapse of patent due to non-payment of fees