TW200802912A - Apparatus and method to metalize supports for photovoltaic cells - Google Patents

Apparatus and method to metalize supports for photovoltaic cells

Info

Publication number
TW200802912A
TW200802912A TW096110337A TW96110337A TW200802912A TW 200802912 A TW200802912 A TW 200802912A TW 096110337 A TW096110337 A TW 096110337A TW 96110337 A TW96110337 A TW 96110337A TW 200802912 A TW200802912 A TW 200802912A
Authority
TW
Taiwan
Prior art keywords
metalize
photovoltaic cells
supports
support
conductor tracks
Prior art date
Application number
TW096110337A
Other languages
English (en)
Chinese (zh)
Inventor
Gisulfo Baccini
Original Assignee
Gisulfo Baccini
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gisulfo Baccini filed Critical Gisulfo Baccini
Publication of TW200802912A publication Critical patent/TW200802912A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/16—Printing tables
    • B41F15/18—Supports for workpieces
    • B41F15/26—Supports for workpieces for articles with flat surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H10F77/206—Electrodes for devices having potential barriers
    • H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Photovoltaic Devices (AREA)
  • Screen Printers (AREA)
  • Printing Methods (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW096110337A 2006-03-31 2007-03-26 Apparatus and method to metalize supports for photovoltaic cells TW200802912A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IT2006/000228 WO2007113877A1 (en) 2006-03-31 2006-03-31 Apparatus and method to metalize supports for photovoltaic cells

Publications (1)

Publication Number Publication Date
TW200802912A true TW200802912A (en) 2008-01-01

Family

ID=37668092

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096110337A TW200802912A (en) 2006-03-31 2007-03-26 Apparatus and method to metalize supports for photovoltaic cells

Country Status (5)

Country Link
EP (1) EP2008302A1 (de)
JP (1) JP5193994B2 (de)
CN (1) CN101496155B (de)
TW (1) TW200802912A (de)
WO (1) WO2007113877A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8901010B2 (en) * 2013-03-15 2014-12-02 Sunpower Corporation Methods for improving solar cell lifetime and efficiency
CN106102344A (zh) * 2016-08-16 2016-11-09 成都俱进科技有限公司 可对pcb制板进行稳定夹持的定位工装
CN106102343A (zh) * 2016-08-16 2016-11-09 成都俱进科技有限公司 一种印刷电路板定位装置
CN106211588A (zh) * 2016-08-16 2016-12-07 成都俱进科技有限公司 一种pcb板加工定位组件

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59152766U (ja) * 1983-03-30 1984-10-13 富士通株式会社 基板ホルダ−
JPH01312820A (ja) * 1988-06-10 1989-12-18 Murata Mfg Co Ltd スクリーン印刷用パレット
JP2544962Y2 (ja) * 1990-01-30 1997-08-20 日本電気株式会社 謄写式ペースト印刷機用バキュームパット
JPH04199895A (ja) * 1990-11-29 1992-07-21 Ibiden Co Ltd ハンダ印刷装置におけるプリント基板支持装置
JP3250574B2 (ja) * 1992-12-28 2002-01-28 キヤノン株式会社 光起電力素子及びその製造方法、並びに発電システム
JP3337764B2 (ja) * 1993-07-16 2002-10-21 松下電器産業株式会社 スクリーン印刷方法およびスクリーン印刷機
JPH07178887A (ja) * 1993-12-24 1995-07-18 Toshiba Corp 印刷装置
US5996487A (en) * 1997-04-11 1999-12-07 Matsushita Electric Industrial Co., Ltd. Solder paste screen printing apparatus and solder paste screen printing method
JP4393735B2 (ja) * 2001-12-11 2010-01-06 ヤマハ発動機株式会社 スクリーン印刷機
DE10222119B4 (de) * 2002-05-17 2004-11-11 Asys Automatisierungssysteme Gmbh Vorrichtung und Verfahren zum Einstellen der relativen Lage zwischen einem zu bedruckenden Substrat und einem Druckmuster

Also Published As

Publication number Publication date
CN101496155A (zh) 2009-07-29
JP5193994B2 (ja) 2013-05-08
EP2008302A1 (de) 2008-12-31
CN101496155B (zh) 2010-07-28
JP2009532854A (ja) 2009-09-10
WO2007113877A1 (en) 2007-10-11

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