TW200739843A - Substrate cooling device, substrate cooling method, and computer readable storage medium - Google Patents

Substrate cooling device, substrate cooling method, and computer readable storage medium

Info

Publication number
TW200739843A
TW200739843A TW095147439A TW95147439A TW200739843A TW 200739843 A TW200739843 A TW 200739843A TW 095147439 A TW095147439 A TW 095147439A TW 95147439 A TW95147439 A TW 95147439A TW 200739843 A TW200739843 A TW 200739843A
Authority
TW
Taiwan
Prior art keywords
substrate cooling
substrate
storage medium
computer readable
readable storage
Prior art date
Application number
TW095147439A
Other languages
English (en)
Chinese (zh)
Other versions
TWI325168B (https=
Inventor
Yasutaka Souma
Mitsuhiro Sakai
Norio Wada
Shunichi Yahiro
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200739843A publication Critical patent/TW200739843A/zh
Application granted granted Critical
Publication of TWI325168B publication Critical patent/TWI325168B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Tunnel Furnaces (AREA)
TW095147439A 2006-01-24 2006-12-18 Substrate cooling device, substrate cooling method, and computer readable storage medium TW200739843A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006015251A JP4537324B2 (ja) 2006-01-24 2006-01-24 基板冷却装置、基板冷却方法、制御プログラム、コンピュータ読取可能な記憶媒体

Publications (2)

Publication Number Publication Date
TW200739843A true TW200739843A (en) 2007-10-16
TWI325168B TWI325168B (https=) 2010-05-21

Family

ID=38455307

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095147439A TW200739843A (en) 2006-01-24 2006-12-18 Substrate cooling device, substrate cooling method, and computer readable storage medium

Country Status (4)

Country Link
JP (1) JP4537324B2 (https=)
KR (1) KR101299763B1 (https=)
CN (1) CN100521078C (https=)
TW (1) TW200739843A (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4542577B2 (ja) * 2007-09-19 2010-09-15 東京エレクトロン株式会社 常圧乾燥装置及び基板処理装置及び基板処理方法
JP2009158792A (ja) * 2007-12-27 2009-07-16 Dainippon Screen Mfg Co Ltd 基板処理装置
KR100921523B1 (ko) * 2008-05-30 2009-10-12 세메스 주식회사 평판 디스플레이 제조에 사용되는 기판 처리 장치 및 방법
JP4675401B2 (ja) * 2008-08-29 2011-04-20 東京エレクトロン株式会社 基板搬送装置
JP5635378B2 (ja) * 2010-11-30 2014-12-03 日東電工株式会社 半導体ウエハ搬送方法および半導体ウエハ搬送装置
KR101105387B1 (ko) * 2010-12-13 2012-01-16 주식회사 에스아이이 기판 건조장치
CN102651303B (zh) * 2011-05-09 2014-12-10 京东方科技集团股份有限公司 基板温度管控系统及方法
JP2013098300A (ja) * 2011-10-31 2013-05-20 Tokyo Electron Ltd 熱処理装置および熱処理方法
JP6964005B2 (ja) * 2018-01-09 2021-11-10 東京エレクトロン株式会社 熱処理装置、熱板の冷却方法及びコンピュータ読み取り可能な記録媒体
CN108842143A (zh) * 2018-07-09 2018-11-20 上海新昇半导体科技有限公司 外延炉冷却系统及冷却方法
CN113272462B (zh) * 2019-01-17 2023-03-10 住友电工运泰克株式会社 导体软化处理装置以及导体软化处理方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0715873B2 (ja) * 1983-11-30 1995-02-22 株式会社東芝 レジストパターン形成方法
JPS6119131A (ja) * 1984-07-06 1986-01-28 Toshiba Corp レジスト処理装置
JPS6428918A (en) * 1987-07-24 1989-01-31 Mitsubishi Electric Corp Resist baking device
JP3872535B2 (ja) * 1996-03-14 2007-01-24 株式会社オーク製作所 ワークの電荷の消去中和装置
KR100479642B1 (ko) * 1999-04-27 2005-03-30 미쓰비시덴키 가부시키가이샤 레이저가공기의 가공조건 제어방법 및 이를 위한프로그램을 기록한 컴퓨터 판독가능한 기록매체
JP3416078B2 (ja) * 1999-06-09 2003-06-16 東京エレクトロン株式会社 基板処理装置
TW449802B (en) * 1999-07-19 2001-08-11 Tokyo Electron Ltd Method and apparatus of substrate treatment
JP4380966B2 (ja) * 2002-05-20 2009-12-09 富士フイルム株式会社 感光層転写方法および装置
JP2004299850A (ja) * 2003-03-31 2004-10-28 Dainippon Printing Co Ltd 処理方法及び処理装置

Also Published As

Publication number Publication date
CN101009210A (zh) 2007-08-01
KR101299763B1 (ko) 2013-08-23
KR20070077793A (ko) 2007-07-27
JP2007200994A (ja) 2007-08-09
TWI325168B (https=) 2010-05-21
CN100521078C (zh) 2009-07-29
JP4537324B2 (ja) 2010-09-01

Similar Documents

Publication Publication Date Title
TW200739843A (en) Substrate cooling device, substrate cooling method, and computer readable storage medium
WO2010048237A3 (en) Ultraviolet reflector with coolant gas holes and method
WO2009074788A3 (en) Apparatus for hot and cold processing
SG145670A1 (en) Thin film structure with controlled lateral thermal spreading in the thin film
EA201070253A1 (ru) Курительный продукт на основе возгонки
TW200736719A (en) Display device
SG170651A1 (en) Heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids
BRPI0711034A2 (pt) Processo de redução da formação de dobras de origem térmica sobre tiras metálicas
BR112013006494A2 (pt) sistema de resfriamento para uma tira de aço laminada a quente
TW200713541A (en) Bake unit, method for cooling heating plate used in the bake unit, apparatus and method for treating substrates with the bake unit
TW200737393A (en) Heat treatment unit
EA200970025A1 (ru) Система топливных элементов и способ воздействия на тепловой баланс системы топливных элементов
TW200802531A (en) Heat treatment unit, heat treatment method, and computer-readable recording medium
WO2008043806A3 (en) Method and apparatus for cooling a hydrocarbon stream
TW200741812A (en) Substrate cooling device
TW200802548A (en) Method for continuously forming thin film and strip-shaped glass substrate with thin film
MY168672A (en) Continuous casting device and relative method
TW200712240A (en) Substrate carrier
ATE463456T1 (de) Vorrichtung zur aufnahme und zum transport eines gutes
ATE539172T1 (de) Verfahren zum vorheizen von eisenagglomeraten
MX2007009155A (es) Sistema y metodo de enfriamiento para productos.
AR079753A1 (es) Instalacion transportadora para desbastes
ATE395811T1 (de) Vorrichtung zum transport eines folienschlauches
Regan Pipeline 1 of S4G
藤原淳一郎 Philip Wright gas prices in the UK: Markets and insecurity of supply

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees