TW200736849A - Exposure apparatus and device manufacturing method - Google Patents

Exposure apparatus and device manufacturing method

Info

Publication number
TW200736849A
TW200736849A TW096107430A TW96107430A TW200736849A TW 200736849 A TW200736849 A TW 200736849A TW 096107430 A TW096107430 A TW 096107430A TW 96107430 A TW96107430 A TW 96107430A TW 200736849 A TW200736849 A TW 200736849A
Authority
TW
Taiwan
Prior art keywords
field region
image
pattern
visual field
exposure apparatus
Prior art date
Application number
TW096107430A
Other languages
English (en)
Inventor
Hiroyuki Nagasaka
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW200736849A publication Critical patent/TW200736849A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70308—Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW096107430A 2006-03-03 2007-03-03 Exposure apparatus and device manufacturing method TW200736849A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006057786 2006-03-03

Publications (1)

Publication Number Publication Date
TW200736849A true TW200736849A (en) 2007-10-01

Family

ID=38459182

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096107430A TW200736849A (en) 2006-03-03 2007-03-03 Exposure apparatus and device manufacturing method

Country Status (6)

Country Link
US (1) US7916270B2 (zh)
EP (1) EP1993121A4 (zh)
JP (1) JP4973652B2 (zh)
KR (1) KR20080107363A (zh)
TW (1) TW200736849A (zh)
WO (1) WO2007100087A1 (zh)

Families Citing this family (19)

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JP5158439B2 (ja) * 2006-04-17 2013-03-06 株式会社ニコン 照明光学装置、露光装置、およびデバイス製造方法
KR101399768B1 (ko) 2006-12-28 2014-05-27 칼 짜이스 에스엠티 게엠베하 기울어진 편향 미러를 갖는 반사굴절식 투영 대물렌즈, 투영 노광 장치, 투영 노광 방법 및 미러
US8665418B2 (en) * 2007-04-18 2014-03-04 Nikon Corporation Projection optical system, exposure apparatus, and device manufacturing method
US20100259768A1 (en) * 2007-10-19 2010-10-14 Koninklijke Philips Electronics N.V. Displacement device with precision measurement
DE102007051669A1 (de) * 2007-10-26 2009-04-30 Carl Zeiss Smt Ag Abbildende Optik, Projektionsbelichtungsanlage für die Mikrolithographie mit einer derartigen abbildenden Optik sowie Verfahren zur Herstellung eines mikrostrukturierten Bauteils mit einer derartigen Projektionsbelichtungsanlage
US20090303454A1 (en) * 2008-06-10 2009-12-10 Nikon Corporation Exposure apparatus with a scanning illumination beam
US8736813B2 (en) * 2008-08-26 2014-05-27 Nikon Corporation Exposure apparatus with an illumination system generating multiple illumination beams
US20100053588A1 (en) * 2008-08-29 2010-03-04 Nikon Corporation Substrate Stage movement patterns for high throughput While Imaging a Reticle to a pair of Imaging Locations
US8705170B2 (en) * 2008-08-29 2014-04-22 Nikon Corporation High NA catadioptric imaging optics for imaging A reticle to a pair of imaging locations
US20100091257A1 (en) * 2008-10-10 2010-04-15 Nikon Corporation Optical Imaging System and Method for Imaging Up to Four Reticles to a Single Imaging Location
US20100123883A1 (en) * 2008-11-17 2010-05-20 Nikon Corporation Projection optical system, exposure apparatus, and device manufacturing method
JP5353456B2 (ja) * 2009-06-10 2013-11-27 株式会社ニコン 投影光学装置、露光装置、露光方法およびデバイス製造方法
CN102612669B (zh) * 2010-02-02 2015-07-22 株式会社尼康 曝光方法、曝光装置、图案形成方法及器件制造方法
US8610878B2 (en) * 2010-03-04 2013-12-17 Asml Netherlands B.V. Lithographic apparatus and method
JP5799304B2 (ja) * 2011-06-10 2015-10-21 株式会社ブイ・テクノロジー 露光ユニット及びそれを用いた露光方法
JP5799305B2 (ja) * 2011-06-10 2015-10-21 株式会社ブイ・テクノロジー 露光装置及び露光方法
JP6590638B2 (ja) * 2015-10-29 2019-10-16 株式会社オーク製作所 露光装置用露光ヘッドおよび露光装置用投影光学系
CN118538834A (zh) * 2017-06-12 2024-08-23 库力索法荷兰有限公司 分立组件向基板上的并行组装
CN114325889A (zh) * 2021-12-30 2022-04-12 拓荆科技股份有限公司 光学照明装置及光学改性设备

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JPH065660B2 (ja) 1985-01-11 1994-01-19 キヤノン株式会社 露光装置
JPH06120108A (ja) 1992-10-06 1994-04-28 Hitachi Ltd 投影露光方法および装置
KR100300618B1 (ko) 1992-12-25 2001-11-22 오노 시게오 노광방법,노광장치,및그장치를사용하는디바이스제조방법
JPH07161603A (ja) 1993-12-02 1995-06-23 Hitachi Ltd 露光装置
JPH08313842A (ja) 1995-05-15 1996-11-29 Nikon Corp 照明光学系および該光学系を備えた露光装置
IL130137A (en) * 1996-11-28 2003-07-06 Nikon Corp Exposure apparatus and an exposure method
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JP4264676B2 (ja) 1998-11-30 2009-05-20 株式会社ニコン 露光装置及び露光方法
US6897963B1 (en) * 1997-12-18 2005-05-24 Nikon Corporation Stage device and exposure apparatus
US6208407B1 (en) * 1997-12-22 2001-03-27 Asm Lithography B.V. Method and apparatus for repetitively projecting a mask pattern on a substrate, using a time-saving height measurement
AU2747999A (en) 1998-03-26 1999-10-18 Nikon Corporation Projection exposure method and system
JP2000021742A (ja) 1998-06-30 2000-01-21 Canon Inc 露光方法および露光装置
JP2000021748A (ja) * 1998-06-30 2000-01-21 Canon Inc 露光方法および露光装置
US6238852B1 (en) * 1999-01-04 2001-05-29 Anvik Corporation Maskless lithography system and method with doubled throughput
TW490596B (en) 1999-03-08 2002-06-11 Asm Lithography Bv Lithographic projection apparatus, method of manufacturing a device using the lithographic projection apparatus, device manufactured according to the method and method of calibrating the lithographic projection apparatus
JP2001291654A (ja) 2000-04-07 2001-10-19 Canon Inc 投影露光装置および方法
JP2001297976A (ja) 2000-04-17 2001-10-26 Canon Inc 露光方法及び露光装置
US6611316B2 (en) * 2001-02-27 2003-08-26 Asml Holding N.V. Method and system for dual reticle image exposure
EP1255162A1 (en) * 2001-05-04 2002-11-06 ASML Netherlands B.V. Lithographic apparatus
TW529172B (en) 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
CN1332267C (zh) * 2002-06-12 2007-08-15 Asml荷兰有限公司 光刻装置和器件的制造方法
TWI242691B (en) 2002-08-23 2005-11-01 Nikon Corp Projection optical system and method for photolithography and exposure apparatus and method using same
JP2004304135A (ja) 2003-04-01 2004-10-28 Nikon Corp 露光装置、露光方法及びマイクロデバイスの製造方法
JP5106858B2 (ja) 2003-12-15 2012-12-26 カール・ツァイス・エスエムティー・ゲーエムベーハー 高開口数と平面状端面とを有する投影対物レンズ
WO2005059645A2 (en) 2003-12-19 2005-06-30 Carl Zeiss Smt Ag Microlithography projection objective with crystal elements
DE102004013886A1 (de) * 2004-03-16 2005-10-06 Carl Zeiss Smt Ag Verfahren zur Mehrfachbelichtung, Mikrolithografie-Projektionsbelichtungsanlage und Projektionssystem
JP2006057786A (ja) 2004-08-23 2006-03-02 Iwatani Industrial Gases Corp 液化ガスタンクの内槽支持装置
US7924406B2 (en) * 2005-07-13 2011-04-12 Asml Netherlands B.V. Stage apparatus, lithographic apparatus and device manufacturing method having switch device for two illumination channels
JP4929762B2 (ja) * 2006-03-03 2012-05-09 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法

Also Published As

Publication number Publication date
JPWO2007100087A1 (ja) 2009-07-23
US20070242244A1 (en) 2007-10-18
EP1993121A1 (en) 2008-11-19
EP1993121A4 (en) 2011-12-07
KR20080107363A (ko) 2008-12-10
JP4973652B2 (ja) 2012-07-11
WO2007100087A1 (ja) 2007-09-07
US7916270B2 (en) 2011-03-29

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