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Application filed by Hon Hai Prec Ind Co LtdfiledCriticalHon Hai Prec Ind Co Ltd
Priority to TW095104536ApriorityCriticalpatent/TW200731914A/en
Publication of TW200731914ApublicationCriticalpatent/TW200731914A/en
Cooling Or The Like Of Semiconductors Or Solid State Devices
(AREA)
Abstract
A mounting apparatus for connecting a heat dissipating component with a supporting device includes a main body. The main body includes a first mounting member for connecting the heat dissipating component, and a second mounting member for connecting the supporting device.
TW095104536A2006-02-102006-02-10Mounting apparatus for heat dissipating components
TW200731914A
(en)