TW200730845A - Substrate inspection apparatus and method thereof - Google Patents

Substrate inspection apparatus and method thereof

Info

Publication number
TW200730845A
TW200730845A TW095148580A TW95148580A TW200730845A TW 200730845 A TW200730845 A TW 200730845A TW 095148580 A TW095148580 A TW 095148580A TW 95148580 A TW95148580 A TW 95148580A TW 200730845 A TW200730845 A TW 200730845A
Authority
TW
Taiwan
Prior art keywords
current supply
probes
wiring
voltage measurement
voltage
Prior art date
Application number
TW095148580A
Other languages
English (en)
Inventor
Michio Kaida
Original Assignee
Nidec Read Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005378357A external-priority patent/JP2007178318A/ja
Priority claimed from JP2006030164A external-priority patent/JP2007212194A/ja
Application filed by Nidec Read Corp filed Critical Nidec Read Corp
Publication of TW200730845A publication Critical patent/TW200730845A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/0092—Arrangements for measuring currents or voltages or for indicating presence or sign thereof measuring current only
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/28—Measuring attenuation, gain, phase shift or derived characteristics of electric four pole networks, i.e. two-port networks; Measuring transient response

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
TW095148580A 2005-12-28 2006-12-22 Substrate inspection apparatus and method thereof TW200730845A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005378357A JP2007178318A (ja) 2005-12-28 2005-12-28 基板検査装置及び方法
JP2006030164A JP2007212194A (ja) 2006-02-07 2006-02-07 基板検査装置及び方法

Publications (1)

Publication Number Publication Date
TW200730845A true TW200730845A (en) 2007-08-16

Family

ID=38505564

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095148580A TW200730845A (en) 2005-12-28 2006-12-22 Substrate inspection apparatus and method thereof

Country Status (2)

Country Link
KR (1) KR20070070069A (zh)
TW (1) TW200730845A (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI422829B (zh) * 2008-09-29 2014-01-11 Nidec Read Corp 檢查治具、電極構造及電極構造之製造方法
TWI596346B (zh) * 2016-08-24 2017-08-21 中華精測科技股份有限公司 垂直式探針卡之探針裝置
CN112098049A (zh) * 2019-05-31 2020-12-18 爱德万测试株式会社 试验装置、试验方法及计算机可读取媒体
US11788885B2 (en) 2021-02-26 2023-10-17 Advantest Corporation Test apparatus, test method, and computer-readable storage medium
US11800619B2 (en) 2021-01-21 2023-10-24 Advantest Corporation Test apparatus, test method, and computer-readable storage medium

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100891531B1 (ko) * 2007-09-10 2009-04-03 주식회사 하이닉스반도체 패턴 정렬 불량 검출 장치
JP2014137231A (ja) * 2013-01-15 2014-07-28 Nidec-Read Corp 検査治具の検査方法
CN104714141A (zh) * 2013-12-13 2015-06-17 台达电子工业股份有限公司 一种顶针板测试系统与方法
JP6975650B2 (ja) * 2018-01-18 2021-12-01 株式会社荏原製作所 検査用基板を用いる電流測定モジュールおよび検査用基板

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI422829B (zh) * 2008-09-29 2014-01-11 Nidec Read Corp 檢查治具、電極構造及電極構造之製造方法
TWI596346B (zh) * 2016-08-24 2017-08-21 中華精測科技股份有限公司 垂直式探針卡之探針裝置
US10060949B2 (en) 2016-08-24 2018-08-28 Chunghwa Precision Test Tech. Co., Ltd. Probe device of vertical probe card
CN112098049A (zh) * 2019-05-31 2020-12-18 爱德万测试株式会社 试验装置、试验方法及计算机可读取媒体
US11293966B2 (en) 2019-05-31 2022-04-05 Advantest Corporation Test apparatus for determining pass or fail of LEDs, test method and computer-readable medium
US11800619B2 (en) 2021-01-21 2023-10-24 Advantest Corporation Test apparatus, test method, and computer-readable storage medium
US11788885B2 (en) 2021-02-26 2023-10-17 Advantest Corporation Test apparatus, test method, and computer-readable storage medium

Also Published As

Publication number Publication date
KR20070070069A (ko) 2007-07-03

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