TW200711965A - Component placement device for use with electronic components - Google Patents
Component placement device for use with electronic componentsInfo
- Publication number
- TW200711965A TW200711965A TW094132546A TW94132546A TW200711965A TW 200711965 A TW200711965 A TW 200711965A TW 094132546 A TW094132546 A TW 094132546A TW 94132546 A TW94132546 A TW 94132546A TW 200711965 A TW200711965 A TW 200711965A
- Authority
- TW
- Taiwan
- Prior art keywords
- component
- electronic components
- pick
- place
- guide
- Prior art date
Links
Landscapes
- Control And Other Processes For Unpacking Of Materials (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Disclosed is a component placement device for use with electronic components, including: a component manipulation mechanism and a pick-and-place mechanism. A feeding tank of the component manipulation mechanism serves to receive electronic components and causes individual electronic components to slide into a component receiving base. A pressing member then presses the next electronic component in place to cause the component receiving base to drive the electronic component moving downwards, so as to separate the two electronic components thereby facilitating the pick-and-place mechanism to pick up the component. The pick-and-place mechanism is provided with an actuating member having a guide groove. A lateral frame of the actuating member is provided with a second guide groove having a cam curve. Another side of the actuating member is provided with a swing frame having a slide rail assembly, on which slide rail assembly is assembled with a pick-and-place member and a guide member. The guide member is embedded into the first and second guide grooves. The first guide groove of the actuating member urges the guide member to move along the second guide groove, causing the guide member to drive the pick-and-place member moving in a linear direction or swinging in a curved path, for picking up the electronic components in the component receiving base and placing the electronic components in a component carrier to facilitate upcoming operations, so as to provide the benefits of easy pick-up and easy placement of electronic components.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94132546A TWI279376B (en) | 2005-09-20 | 2005-09-20 | Component placement device for use with electronic components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94132546A TWI279376B (en) | 2005-09-20 | 2005-09-20 | Component placement device for use with electronic components |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200711965A true TW200711965A (en) | 2007-04-01 |
TWI279376B TWI279376B (en) | 2007-04-21 |
Family
ID=38645396
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94132546A TWI279376B (en) | 2005-09-20 | 2005-09-20 | Component placement device for use with electronic components |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI279376B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105000377A (en) * | 2015-07-21 | 2015-10-28 | 青岛海泰盛电子科技有限公司 | Material taking mechanism |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI710293B (en) * | 2019-04-18 | 2020-11-11 | 鴻勁精密股份有限公司 | Electronic component placing device and operation classification equipment for its application |
-
2005
- 2005-09-20 TW TW94132546A patent/TWI279376B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105000377A (en) * | 2015-07-21 | 2015-10-28 | 青岛海泰盛电子科技有限公司 | Material taking mechanism |
Also Published As
Publication number | Publication date |
---|---|
TWI279376B (en) | 2007-04-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |