TW200711965A - Component placement device for use with electronic components - Google Patents

Component placement device for use with electronic components

Info

Publication number
TW200711965A
TW200711965A TW094132546A TW94132546A TW200711965A TW 200711965 A TW200711965 A TW 200711965A TW 094132546 A TW094132546 A TW 094132546A TW 94132546 A TW94132546 A TW 94132546A TW 200711965 A TW200711965 A TW 200711965A
Authority
TW
Taiwan
Prior art keywords
component
electronic components
pick
place
guide
Prior art date
Application number
TW094132546A
Other languages
Chinese (zh)
Other versions
TWI279376B (en
Inventor
hui-shan Xu
Liang-Hong Du
Original Assignee
Motech Taiwan Automatic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motech Taiwan Automatic Corp filed Critical Motech Taiwan Automatic Corp
Priority to TW94132546A priority Critical patent/TWI279376B/en
Publication of TW200711965A publication Critical patent/TW200711965A/en
Application granted granted Critical
Publication of TWI279376B publication Critical patent/TWI279376B/en

Links

Landscapes

  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

Disclosed is a component placement device for use with electronic components, including: a component manipulation mechanism and a pick-and-place mechanism. A feeding tank of the component manipulation mechanism serves to receive electronic components and causes individual electronic components to slide into a component receiving base. A pressing member then presses the next electronic component in place to cause the component receiving base to drive the electronic component moving downwards, so as to separate the two electronic components thereby facilitating the pick-and-place mechanism to pick up the component. The pick-and-place mechanism is provided with an actuating member having a guide groove. A lateral frame of the actuating member is provided with a second guide groove having a cam curve. Another side of the actuating member is provided with a swing frame having a slide rail assembly, on which slide rail assembly is assembled with a pick-and-place member and a guide member. The guide member is embedded into the first and second guide grooves. The first guide groove of the actuating member urges the guide member to move along the second guide groove, causing the guide member to drive the pick-and-place member moving in a linear direction or swinging in a curved path, for picking up the electronic components in the component receiving base and placing the electronic components in a component carrier to facilitate upcoming operations, so as to provide the benefits of easy pick-up and easy placement of electronic components.
TW94132546A 2005-09-20 2005-09-20 Component placement device for use with electronic components TWI279376B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94132546A TWI279376B (en) 2005-09-20 2005-09-20 Component placement device for use with electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94132546A TWI279376B (en) 2005-09-20 2005-09-20 Component placement device for use with electronic components

Publications (2)

Publication Number Publication Date
TW200711965A true TW200711965A (en) 2007-04-01
TWI279376B TWI279376B (en) 2007-04-21

Family

ID=38645396

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94132546A TWI279376B (en) 2005-09-20 2005-09-20 Component placement device for use with electronic components

Country Status (1)

Country Link
TW (1) TWI279376B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105000377A (en) * 2015-07-21 2015-10-28 青岛海泰盛电子科技有限公司 Material taking mechanism

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI710293B (en) * 2019-04-18 2020-11-11 鴻勁精密股份有限公司 Electronic component placing device and operation classification equipment for its application

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105000377A (en) * 2015-07-21 2015-10-28 青岛海泰盛电子科技有限公司 Material taking mechanism

Also Published As

Publication number Publication date
TWI279376B (en) 2007-04-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees