TW200709409A - A manufacture method and structure for improving the characteristics of phase change emeory - Google Patents

A manufacture method and structure for improving the characteristics of phase change emeory

Info

Publication number
TW200709409A
TW200709409A TW094128535A TW94128535A TW200709409A TW 200709409 A TW200709409 A TW 200709409A TW 094128535 A TW094128535 A TW 094128535A TW 94128535 A TW94128535 A TW 94128535A TW 200709409 A TW200709409 A TW 200709409A
Authority
TW
Taiwan
Prior art keywords
phase change
improving
manufacture method
emeory
change memory
Prior art date
Application number
TW094128535A
Other languages
English (en)
Other versions
TWI273703B (en
Inventor
Wen-Han Wang
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW094128535A priority Critical patent/TWI273703B/zh
Priority to JP2005357441A priority patent/JP2007053326A/ja
Priority to US11/357,150 priority patent/US20070040159A1/en
Application granted granted Critical
Publication of TWI273703B publication Critical patent/TWI273703B/zh
Publication of TW200709409A publication Critical patent/TW200709409A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20—Multistable switching devices, e.g. memristors
    • H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/841—Electrodes
    • H10N70/8413—Electrodes adapted for resistive heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/011—Manufacture or treatment of multistable switching devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/821—Device geometry
    • H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
TW094128535A 2005-08-19 2005-08-19 A manufacture method and structure for improving the characteristics of phase change memory TWI273703B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW094128535A TWI273703B (en) 2005-08-19 2005-08-19 A manufacture method and structure for improving the characteristics of phase change memory
JP2005357441A JP2007053326A (ja) 2005-08-19 2005-12-12 位相変化メモリの改良方法及び構造
US11/357,150 US20070040159A1 (en) 2005-08-19 2006-02-21 Manufacturing method and structure for improving the characteristics of phase change memory

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094128535A TWI273703B (en) 2005-08-19 2005-08-19 A manufacture method and structure for improving the characteristics of phase change memory

Publications (2)

Publication Number Publication Date
TWI273703B TWI273703B (en) 2007-02-11
TW200709409A true TW200709409A (en) 2007-03-01

Family

ID=37766630

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094128535A TWI273703B (en) 2005-08-19 2005-08-19 A manufacture method and structure for improving the characteristics of phase change memory

Country Status (3)

Country Link
US (1) US20070040159A1 (zh)
JP (1) JP2007053326A (zh)
TW (1) TWI273703B (zh)

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US7319057B2 (en) * 2001-10-30 2008-01-15 Ovonyx, Inc. Phase change material memory device
US7635855B2 (en) * 2005-11-15 2009-12-22 Macronix International Co., Ltd. I-shaped phase change memory cell
US7449710B2 (en) 2005-11-21 2008-11-11 Macronix International Co., Ltd. Vacuum jacket for phase change memory element
TWI291745B (en) * 2005-11-30 2007-12-21 Ind Tech Res Inst Lateral phase change memory with spacer electrodes and method of manufacturing the same
US7772581B2 (en) * 2006-09-11 2010-08-10 Macronix International Co., Ltd. Memory device having wide area phase change element and small electrode contact area
US20080090324A1 (en) * 2006-10-12 2008-04-17 Lee Jong-Won S Forming sublithographic heaters for phase change memories
US7718989B2 (en) * 2006-12-28 2010-05-18 Macronix International Co., Ltd. Resistor random access memory cell device
US7729161B2 (en) 2007-08-02 2010-06-01 Macronix International Co., Ltd. Phase change memory with dual word lines and source lines and method of operating same
US8077505B2 (en) * 2008-05-07 2011-12-13 Macronix International Co., Ltd. Bipolar switching of phase change device
US8134857B2 (en) * 2008-06-27 2012-03-13 Macronix International Co., Ltd. Methods for high speed reading operation of phase change memory and device employing same
US7897954B2 (en) 2008-10-10 2011-03-01 Macronix International Co., Ltd. Dielectric-sandwiched pillar memory device
US8097870B2 (en) * 2008-11-05 2012-01-17 Seagate Technology Llc Memory cell with alignment structure
US8107283B2 (en) * 2009-01-12 2012-01-31 Macronix International Co., Ltd. Method for setting PCRAM devices
US8030635B2 (en) * 2009-01-13 2011-10-04 Macronix International Co., Ltd. Polysilicon plug bipolar transistor for phase change memory
US8064247B2 (en) 2009-01-14 2011-11-22 Macronix International Co., Ltd. Rewritable memory device based on segregation/re-absorption
US8933536B2 (en) 2009-01-22 2015-01-13 Macronix International Co., Ltd. Polysilicon pillar bipolar transistor with self-aligned memory element
US8084760B2 (en) * 2009-04-20 2011-12-27 Macronix International Co., Ltd. Ring-shaped electrode and manufacturing method for same
US8173987B2 (en) * 2009-04-27 2012-05-08 Macronix International Co., Ltd. Integrated circuit 3D phase change memory array and manufacturing method
US8097871B2 (en) * 2009-04-30 2012-01-17 Macronix International Co., Ltd. Low operational current phase change memory structures
US7933139B2 (en) * 2009-05-15 2011-04-26 Macronix International Co., Ltd. One-transistor, one-resistor, one-capacitor phase change memory
US8350316B2 (en) * 2009-05-22 2013-01-08 Macronix International Co., Ltd. Phase change memory cells having vertical channel access transistor and memory plane
US7968876B2 (en) * 2009-05-22 2011-06-28 Macronix International Co., Ltd. Phase change memory cell having vertical channel access transistor
US8809829B2 (en) * 2009-06-15 2014-08-19 Macronix International Co., Ltd. Phase change memory having stabilized microstructure and manufacturing method
US8406033B2 (en) 2009-06-22 2013-03-26 Macronix International Co., Ltd. Memory device and method for sensing and fixing margin cells
US8363463B2 (en) 2009-06-25 2013-01-29 Macronix International Co., Ltd. Phase change memory having one or more non-constant doping profiles
US8238149B2 (en) 2009-06-25 2012-08-07 Macronix International Co., Ltd. Methods and apparatus for reducing defect bits in phase change memory
US8198619B2 (en) 2009-07-15 2012-06-12 Macronix International Co., Ltd. Phase change memory cell structure
US8110822B2 (en) 2009-07-15 2012-02-07 Macronix International Co., Ltd. Thermal protect PCRAM structure and methods for making
US7894254B2 (en) 2009-07-15 2011-02-22 Macronix International Co., Ltd. Refresh circuitry for phase change memory
US8064248B2 (en) 2009-09-17 2011-11-22 Macronix International Co., Ltd. 2T2R-1T1R mix mode phase change memory array
US8178387B2 (en) 2009-10-23 2012-05-15 Macronix International Co., Ltd. Methods for reducing recrystallization time for a phase change material
US8729521B2 (en) 2010-05-12 2014-05-20 Macronix International Co., Ltd. Self aligned fin-type programmable memory cell
US8310864B2 (en) 2010-06-15 2012-11-13 Macronix International Co., Ltd. Self-aligned bit line under word line memory array
US8395935B2 (en) 2010-10-06 2013-03-12 Macronix International Co., Ltd. Cross-point self-aligned reduced cell size phase change memory
US8685783B2 (en) 2010-10-27 2014-04-01 Taiwan Semiconductor Manufacturing Company, Ltd. Phase change memory cell
US8497705B2 (en) 2010-11-09 2013-07-30 Macronix International Co., Ltd. Phase change device for interconnection of programmable logic device
US8467238B2 (en) 2010-11-15 2013-06-18 Macronix International Co., Ltd. Dynamic pulse operation for phase change memory
US9030482B2 (en) * 2012-11-09 2015-05-12 Intel Corporation Hybrid display frame buffer for display subsystem
US9559113B2 (en) 2014-05-01 2017-01-31 Macronix International Co., Ltd. SSL/GSL gate oxide in 3D vertical channel NAND
US9672906B2 (en) 2015-06-19 2017-06-06 Macronix International Co., Ltd. Phase change memory with inter-granular switching
FR3053536B1 (fr) * 2016-07-04 2019-07-05 Commissariat A L'energie Atomique Et Aux Energies Alternatives Commutateur comportant une structure a base de materiau(x) a changement de phase dont une partie seulement est activable
US10505106B1 (en) * 2018-10-18 2019-12-10 Toyota Motor Engineering & Manufacturing North America, Inc. Encapsulated PCM switching devices and methods of forming the same
US11289649B2 (en) * 2020-04-13 2022-03-29 Globalfoundries Singapore Pte. Ltd. Non-volatile memory elements with a narrowed electrode

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US5687112A (en) * 1996-04-19 1997-11-11 Energy Conversion Devices, Inc. Multibit single cell memory element having tapered contact
US6337266B1 (en) * 1996-07-22 2002-01-08 Micron Technology, Inc. Small electrode for chalcogenide memories
US6437383B1 (en) * 2000-12-21 2002-08-20 Intel Corporation Dual trench isolation for a phase-change memory cell and method of making same
US6646297B2 (en) * 2000-12-26 2003-11-11 Ovonyx, Inc. Lower electrode isolation in a double-wide trench
US6545287B2 (en) * 2001-09-07 2003-04-08 Intel Corporation Using selective deposition to form phase-change memory cells
US6670628B2 (en) * 2002-04-04 2003-12-30 Hewlett-Packard Company, L.P. Low heat loss and small contact area composite electrode for a phase change media memory device
US6744088B1 (en) * 2002-12-13 2004-06-01 Intel Corporation Phase change memory device on a planar composite layer

Also Published As

Publication number Publication date
TWI273703B (en) 2007-02-11
JP2007053326A (ja) 2007-03-01
US20070040159A1 (en) 2007-02-22

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MM4A Annulment or lapse of patent due to non-payment of fees