TW200701260A - Conductive paste and wiring substrate with the same - Google Patents

Conductive paste and wiring substrate with the same

Info

Publication number
TW200701260A
TW200701260A TW095118254A TW95118254A TW200701260A TW 200701260 A TW200701260 A TW 200701260A TW 095118254 A TW095118254 A TW 095118254A TW 95118254 A TW95118254 A TW 95118254A TW 200701260 A TW200701260 A TW 200701260A
Authority
TW
Taiwan
Prior art keywords
conductive paste
same
wiring substrate
viscosity
metal powder
Prior art date
Application number
TW095118254A
Other languages
English (en)
Inventor
Masahiro Yamakawa
Kohei Shimoda
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Publication of TW200701260A publication Critical patent/TW200701260A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/56—Insulating bodies
    • H01B17/62—Insulating-layers or insulating-films on metal bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/56—Insulating bodies
    • H01B17/64—Insulating bodies with conductive admixtures, inserts or layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Powder Metallurgy (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Paints Or Removers (AREA)
TW095118254A 2005-05-25 2006-05-23 Conductive paste and wiring substrate with the same TW200701260A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005152608A JP4934993B2 (ja) 2005-05-25 2005-05-25 導電性ペーストおよびそれを用いた配線基板

Publications (1)

Publication Number Publication Date
TW200701260A true TW200701260A (en) 2007-01-01

Family

ID=37451925

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095118254A TW200701260A (en) 2005-05-25 2006-05-23 Conductive paste and wiring substrate with the same

Country Status (7)

Country Link
US (1) US8007690B2 (zh)
EP (1) EP1884960B1 (zh)
JP (1) JP4934993B2 (zh)
KR (1) KR20080009684A (zh)
CN (1) CN101151682B (zh)
TW (1) TW200701260A (zh)
WO (1) WO2006126499A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI581891B (zh) * 2011-06-13 2017-05-11 Senju Metal Industry Co 焊膏的印刷方法

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JP2007194122A (ja) * 2006-01-20 2007-08-02 Sumitomo Electric Ind Ltd 導電性ペーストおよびそれを用いた配線基板
JP5252473B2 (ja) * 2006-10-19 2013-07-31 独立行政法人産業技術総合研究所 導電パターン形成フィルムと、そのための導電パターン形成方法及び導電パターン形成装置
KR100863408B1 (ko) * 2007-04-03 2008-10-14 주식회사 엘지화학 흑화처리된 전자파 차폐 유리 및 그 제조방법
CN101946405A (zh) * 2008-02-18 2011-01-12 精工电子有限公司 压电振动器的制造方法、压电振动器、振荡器、电子设备及电波钟
US8128846B2 (en) * 2008-05-28 2012-03-06 E. I. Du Pont De Nemours And Company Silver composition for micro-deposition direct writing silver conductor lines on photovoltaic wafers
KR20100085855A (ko) * 2009-01-20 2010-07-29 다이요 잉키 세이조 가부시키가이샤 도전성 페이스트 및 투광성 도전 필름과 그의 제조 방법
WO2010117224A2 (ko) * 2009-04-08 2010-10-14 주식회사 엘지화학 인쇄 페이스트 조성물 및 이로 형성된 전극
CN102123961A (zh) * 2009-08-07 2011-07-13 Lg化学株式会社 制备硅太阳能电池的无铅玻璃料粉末、其制备方法、包含其的金属膏组合物和硅太阳能电池
KR101245278B1 (ko) * 2009-08-07 2013-03-19 주식회사 엘지화학 전도성 기판 및 이의 제조 방법
JP5399193B2 (ja) * 2009-09-30 2014-01-29 太陽ホールディングス株式会社 感光性導電ペーストおよびその製造方法
CN101976591B (zh) * 2010-08-31 2012-07-25 中国乐凯胶片集团公司 一种透明导电膜
KR101428131B1 (ko) * 2010-10-28 2014-08-07 엘지이노텍 주식회사 전도성 페이스트 조성물
CN103260795B (zh) * 2010-11-08 2015-10-07 纳美仕有限公司 金属粒子及其制造方法
TWI532059B (zh) * 2011-03-31 2016-05-01 Taiyo Holdings Co Ltd Conductive paste, conductive pattern formation method and conductive pattern
TWI578099B (zh) * 2012-02-09 2017-04-11 大阪曹達股份有限公司 含有金屬微粒子之光硬化性樹脂組成物及其利用
US20130319496A1 (en) * 2012-06-01 2013-12-05 Heraeus Precious Metals North America Conshohocken Llc Low-metal content electroconductive paste composition
KR20140006152A (ko) * 2012-06-26 2014-01-16 삼성전자주식회사 전극 및 그 형성 방법과 상기 전극을 포함하는 전자 소자
WO2014061765A1 (ja) * 2012-10-19 2014-04-24 ナミックス株式会社 導電性ペースト
JP5960036B2 (ja) * 2012-11-29 2016-08-02 株式会社ノリタケカンパニーリミテド 導電性ペーストの調製条件評価装置
KR102075636B1 (ko) * 2013-02-01 2020-02-12 주식회사 아모그린텍 디스플레이 전극용 전극 패턴 형성방법 및 이에 의해 형성된 전극 패턴을 구비하는 디스플레이 전극
US9892816B2 (en) * 2013-06-27 2018-02-13 Heraeus Precious Metals North America Conshohocken Llc Platinum containing conductive paste
DE202014010576U1 (de) * 2014-06-12 2016-01-07 Pfisterer Kontaktsysteme Gmbh Vorrichtung zum Kontaktieren eines elektrischen Leiters sowie Anschluss- oder Verbindungseinrichtung mit einer solchen Vorrichtung
JP6296315B2 (ja) * 2014-11-06 2018-03-20 株式会社村田製作所 導電性ペースト、及びガラス物品
US10032223B2 (en) * 2015-03-20 2018-07-24 Bank Of America Corporation System for account linking and future event integration into retirement score calculation
JP2017022080A (ja) * 2015-07-13 2017-01-26 Jsr株式会社 ニッケル膜の製造方法、積層型セラミック電子部品の製造方法、およびニッケル膜形成用組成物
US11450447B2 (en) * 2017-10-04 2022-09-20 Solar Paste, Llc Fine silver particle dispersion
US11441010B2 (en) 2017-10-04 2022-09-13 Dowa Electronics Materials Co., Ltd. Fine silver particle dispersion
US20220072607A1 (en) * 2018-12-26 2022-03-10 Shoei Chemical Inc. Silver paste
US11227702B2 (en) 2019-04-04 2022-01-18 Dowa Electronics Materials Co., Ltd. Fine silver particle dispersion
CN114520067B (zh) * 2020-11-20 2024-04-05 常州明耀半导体科技有限公司 一种导电浆料及透明显示装置

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JPH01265405A (ja) * 1988-04-15 1989-10-23 Furukawa Electric Co Ltd:The 導電ペースト及び導電回路
JPH0465011A (ja) * 1990-07-04 1992-03-02 Sumitomo Metal Ind Ltd 銅導体ペースト
JPH04277406A (ja) * 1991-03-04 1992-10-02 Sumitomo Metal Ind Ltd 銅導体ペースト
US5250229A (en) * 1991-10-10 1993-10-05 E. I. Du Pont De Nemours And Company Silver-rich conductor compositions for high thermal cycled and aged adhesion
US5376596A (en) * 1992-08-06 1994-12-27 Murata Manufacturing Co., Ltd. Conductive paste
JPH08306228A (ja) 1995-05-10 1996-11-22 Murata Mfg Co Ltd 銅導電性ペースト
JP2911429B2 (ja) * 1997-06-04 1999-06-23 三井金属鉱業株式会社 銅微粉末の製造方法
JP3511895B2 (ja) 1998-06-05 2004-03-29 株式会社村田製作所 セラミック多層基板の製造方法
JP4277406B2 (ja) 2000-01-26 2009-06-10 株式会社ニコン 画像記録装置
JP4089311B2 (ja) * 2002-07-02 2008-05-28 住友電気工業株式会社 導電性ペースト、導電性膜、及び導電性膜の製造方法
JP2004139838A (ja) * 2002-10-17 2004-05-13 Noritake Co Ltd 導体ペーストおよびその利用
JP4103672B2 (ja) * 2003-04-28 2008-06-18 株式会社村田製作所 導電性ペーストおよびガラス回路構造物
EP1560227B1 (en) * 2003-08-08 2007-06-13 Sumitomo Electric Industries, Ltd. Conductive paste
EP1684559A4 (en) 2003-11-14 2009-08-19 Murata Manufacturing Co Conductive Paste and Multi-Layered Ceramic Substrate
JP2006196246A (ja) 2005-01-12 2006-07-27 Sumitomo Electric Ind Ltd 導電性ペースト及びそれを用いた配線回路基板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10322462B2 (en) 2011-06-08 2019-06-18 Senju Metal Industry Co., Ltd. Method of printing solder paste
TWI581891B (zh) * 2011-06-13 2017-05-11 Senju Metal Industry Co 焊膏的印刷方法

Also Published As

Publication number Publication date
KR20080009684A (ko) 2008-01-29
JP4934993B2 (ja) 2012-05-23
EP1884960B1 (en) 2012-06-27
US20090107707A1 (en) 2009-04-30
CN101151682B (zh) 2010-12-15
EP1884960A1 (en) 2008-02-06
EP1884960A4 (en) 2009-06-17
US8007690B2 (en) 2011-08-30
CN101151682A (zh) 2008-03-26
WO2006126499A1 (ja) 2006-11-30
JP2006331788A (ja) 2006-12-07

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