TW200633629A - Liquid-cooling type heat dissipation module - Google Patents

Liquid-cooling type heat dissipation module

Info

Publication number
TW200633629A
TW200633629A TW094107506A TW94107506A TW200633629A TW 200633629 A TW200633629 A TW 200633629A TW 094107506 A TW094107506 A TW 094107506A TW 94107506 A TW94107506 A TW 94107506A TW 200633629 A TW200633629 A TW 200633629A
Authority
TW
Taiwan
Prior art keywords
liquid
cooling type
fan
dissipation module
heat dissipation
Prior art date
Application number
TW094107506A
Other languages
Chinese (zh)
Other versions
TWI279182B (en
Inventor
Lee-Long Chen
Chien-Hsiung Huang
Yu-Shien Lin
Chin-Ming Chen
Original Assignee
Delta Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Electronics Inc filed Critical Delta Electronics Inc
Priority to TW94107506A priority Critical patent/TWI279182B/en
Priority to US11/189,870 priority patent/US7292438B2/en
Priority to JP2006019832A priority patent/JP2006237591A/en
Publication of TW200633629A publication Critical patent/TW200633629A/en
Application granted granted Critical
Publication of TWI279182B publication Critical patent/TWI279182B/en

Links

Landscapes

  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The present invention discloses a liquid-cooling type heat dissipation module for effectively circularly dissipating the heat generated from a heat source. The liquid-cooling type heat dissipation module includes a fan, a pump attached to the fan and driven by the fan, a heat sink coupled to the fan and having a opening for allowing the pump to be disposed therein, and a guiding member disposed in the opening of the heat sink, conducted with the pump and having a through hole and a fluid passage formed on its outer surface. The fan provides a power to enable the working fluid in the liquid-cooling type heat dissipation module to flow via the through hole, the pump and the fluid passage so as to circularly dissipate the heat.
TW94107506A 2005-02-25 2005-03-11 Liquid-cooling type heat dissipation module TWI279182B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW94107506A TWI279182B (en) 2005-03-11 2005-03-11 Liquid-cooling type heat dissipation module
US11/189,870 US7292438B2 (en) 2005-02-25 2005-07-27 Liquid-cooling heat dissipation module
JP2006019832A JP2006237591A (en) 2005-02-25 2006-01-27 Liquid cooling heat dissipation module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94107506A TWI279182B (en) 2005-03-11 2005-03-11 Liquid-cooling type heat dissipation module

Publications (2)

Publication Number Publication Date
TW200633629A true TW200633629A (en) 2006-09-16
TWI279182B TWI279182B (en) 2007-04-11

Family

ID=38645306

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94107506A TWI279182B (en) 2005-02-25 2005-03-11 Liquid-cooling type heat dissipation module

Country Status (1)

Country Link
TW (1) TWI279182B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI449308B (en) * 2011-05-06 2014-08-11

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI449308B (en) * 2011-05-06 2014-08-11

Also Published As

Publication number Publication date
TWI279182B (en) 2007-04-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees