TW200631084A - Polishing apparatus and polishing method - Google Patents

Polishing apparatus and polishing method

Info

Publication number
TW200631084A
TW200631084A TW094129047A TW94129047A TW200631084A TW 200631084 A TW200631084 A TW 200631084A TW 094129047 A TW094129047 A TW 094129047A TW 94129047 A TW94129047 A TW 94129047A TW 200631084 A TW200631084 A TW 200631084A
Authority
TW
Taiwan
Prior art keywords
polishing
wafer
pressure
retaining ring
top ring
Prior art date
Application number
TW094129047A
Other languages
English (en)
Other versions
TWI386989B (zh
Inventor
Akira Fukuda
Yoshihiro Mochizuki
Kazuto Hirokawa
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of TW200631084A publication Critical patent/TW200631084A/zh
Application granted granted Critical
Publication of TWI386989B publication Critical patent/TWI386989B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW094129047A 2005-02-25 2005-08-25 研磨裝置及研磨方法 TWI386989B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005050481 2005-02-25

Publications (2)

Publication Number Publication Date
TW200631084A true TW200631084A (en) 2006-09-01
TWI386989B TWI386989B (zh) 2013-02-21

Family

ID=36927147

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094129047A TWI386989B (zh) 2005-02-25 2005-08-25 研磨裝置及研磨方法

Country Status (6)

Country Link
US (3) US8002607B2 (zh)
EP (1) EP1851002B1 (zh)
KR (1) KR101282910B1 (zh)
CN (1) CN101128285B (zh)
TW (1) TWI386989B (zh)
WO (1) WO2006090497A1 (zh)

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TWI601599B (zh) * 2014-03-20 2017-10-11 荏原製作所股份有限公司 研磨裝置及研磨方法

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JP5390807B2 (ja) * 2008-08-21 2014-01-15 株式会社荏原製作所 研磨方法および装置
US9238293B2 (en) * 2008-10-16 2016-01-19 Applied Materials, Inc. Polishing pad edge extension
KR101170760B1 (ko) * 2009-07-24 2012-08-03 세메스 주식회사 기판 연마 장치
US20110189856A1 (en) * 2010-01-29 2011-08-04 Kun Xu High Sensitivity Real Time Profile Control Eddy Current Monitoring System
US20110195636A1 (en) * 2010-02-11 2011-08-11 United Microelectronics Corporation Method for Controlling Polishing Wafer
US9254547B2 (en) * 2010-03-31 2016-02-09 Applied Materials, Inc. Side pad design for edge pedestal
US9102033B2 (en) * 2010-11-24 2015-08-11 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for target thickness and surface profile uniformity control of multi-head chemical mechanical polishing process
US8545289B2 (en) * 2011-04-13 2013-10-01 Nanya Technology Corporation Distance monitoring device
TWI492818B (zh) * 2011-07-12 2015-07-21 Iv Technologies Co Ltd 研磨墊、研磨方法以及研磨系統
US20130017762A1 (en) * 2011-07-15 2013-01-17 Infineon Technologies Ag Method and Apparatus for Determining a Measure of a Thickness of a Polishing Pad of a Polishing Machine
WO2013022624A2 (en) * 2011-08-05 2013-02-14 Applied Materials, Inc. Two-part plastic retaining ring
US10857649B2 (en) * 2011-09-22 2020-12-08 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for performing a polishing process in semiconductor fabrication
JP6196858B2 (ja) * 2012-09-24 2017-09-13 株式会社荏原製作所 研磨方法および研磨装置
CN103878678A (zh) * 2012-12-20 2014-06-25 上海华虹宏力半导体制造有限公司 一种晶圆研磨抛光方法
TWI517935B (zh) 2013-04-16 2016-01-21 國立台灣科技大學 氣體添加硏磨液的供應系統及其方法
US8896964B1 (en) 2013-05-16 2014-11-25 Seagate Technology Llc Enlarged substrate for magnetic recording medium
JP6434266B2 (ja) * 2013-12-17 2018-12-05 富士紡ホールディングス株式会社 ラッピング用樹脂定盤及びそれを用いたラッピング方法
KR102173323B1 (ko) 2014-06-23 2020-11-04 삼성전자주식회사 캐리어 헤드, 화학적 기계식 연마 장치 및 웨이퍼 연마 방법
CN107206567B (zh) * 2014-11-23 2020-12-29 M丘比德技术公司 晶片针钉卡盘制造和修理
US9865477B2 (en) * 2016-02-24 2018-01-09 Taiwan Semiconductor Manufacturing Co., Ltd. Backside polisher with dry frontside design and method using the same
JP6575463B2 (ja) * 2016-08-24 2019-09-18 信越半導体株式会社 ウェーハの研磨方法
CN109420969B (zh) * 2017-08-29 2020-12-01 中芯国际集成电路制造(上海)有限公司 一种研磨头和化学机械研磨装置
CN107717718B (zh) * 2017-09-29 2019-05-31 清华大学 化学机械抛光设备及其操作方法
CN109693174A (zh) * 2017-10-23 2019-04-30 中芯国际集成电路制造(上海)有限公司 一种研磨头和化学机械研磨装置
JP7117171B2 (ja) * 2018-06-20 2022-08-12 株式会社荏原製作所 研磨装置、研磨方法、及び研磨制御プログラム
US11081359B2 (en) * 2018-09-10 2021-08-03 Globalwafers Co., Ltd. Methods for polishing semiconductor substrates that adjust for pad-to-pad variance
CN110948378B (zh) * 2018-09-27 2022-03-29 胜高股份有限公司 研磨装置及研磨方法
JP7365282B2 (ja) * 2020-03-26 2023-10-19 株式会社荏原製作所 研磨ヘッドシステムおよび研磨装置
CN112621458A (zh) * 2020-11-29 2021-04-09 厦门理工学院 弹簧式重心可调抛光盘机构及抛光方法
JP2022133042A (ja) * 2021-03-01 2022-09-13 株式会社荏原製作所 研磨装置および研磨方法

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JP2002134448A (ja) 2000-10-24 2002-05-10 Nikon Corp 研磨装置
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JP2002157723A (ja) * 2000-11-21 2002-05-31 Tdk Corp 磁気ヘッドスライダの製造方法およびバーの研磨方法
JP2003229388A (ja) 2002-02-01 2003-08-15 Nikon Corp 研磨装置、研磨方法、半導体デバイス及び半導体デバイス製造方法
JP2004327774A (ja) * 2003-04-25 2004-11-18 Nikon Corp 研磨装置、これを用いた半導体デバイス製造方法およびこの方法により製造される半導体デバイス
DE10341600A1 (de) * 2003-09-10 2005-04-14 Andreas Stihl Ag & Co. Kg Vergaseranordnung eines handgeführten Arbeitsgerätes
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI601599B (zh) * 2014-03-20 2017-10-11 荏原製作所股份有限公司 研磨裝置及研磨方法

Also Published As

Publication number Publication date
WO2006090497A1 (en) 2006-08-31
US7976358B2 (en) 2011-07-12
US20090239446A1 (en) 2009-09-24
KR101282910B1 (ko) 2013-07-05
KR20070104944A (ko) 2007-10-29
CN101128285B (zh) 2010-10-13
US8002607B2 (en) 2011-08-23
US7967660B2 (en) 2011-06-28
EP1851002B1 (en) 2011-10-19
CN101128285A (zh) 2008-02-20
TWI386989B (zh) 2013-02-21
EP1851002A4 (en) 2009-11-25
EP1851002A1 (en) 2007-11-07
US20100076588A1 (en) 2010-03-25
US20110014851A1 (en) 2011-01-20

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