TW200626696A - Adhesive sheet and copper-clad laminate - Google Patents

Adhesive sheet and copper-clad laminate

Info

Publication number
TW200626696A
TW200626696A TW094134799A TW94134799A TW200626696A TW 200626696 A TW200626696 A TW 200626696A TW 094134799 A TW094134799 A TW 094134799A TW 94134799 A TW94134799 A TW 94134799A TW 200626696 A TW200626696 A TW 200626696A
Authority
TW
Taiwan
Prior art keywords
adhesive sheet
ppm
insulating layer
copper
clad laminate
Prior art date
Application number
TW094134799A
Other languages
English (en)
Other versions
TWI408202B (zh
Inventor
Hisayasu Kaneshiro
Takashi Kikuchi
Original Assignee
Kaneka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneka Corp filed Critical Kaneka Corp
Publication of TW200626696A publication Critical patent/TW200626696A/zh
Application granted granted Critical
Publication of TWI408202B publication Critical patent/TWI408202B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
TW94134799A 2004-10-05 2005-10-05 Followed by sheet and copper foil laminated board TWI408202B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004292949 2004-10-05

Publications (2)

Publication Number Publication Date
TW200626696A true TW200626696A (en) 2006-08-01
TWI408202B TWI408202B (zh) 2013-09-11

Family

ID=36142609

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94134799A TWI408202B (zh) 2004-10-05 2005-10-05 Followed by sheet and copper foil laminated board

Country Status (6)

Country Link
US (2) US20090011231A1 (zh)
JP (1) JP5064033B2 (zh)
KR (1) KR101096967B1 (zh)
CN (1) CN101035875B (zh)
TW (1) TWI408202B (zh)
WO (1) WO2006038533A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101570679B (zh) * 2008-05-03 2012-10-10 新高电子材料（中山）有限公司 一种适用于一次性涂布的无填料聚酰亚胺黏合剂
US20100086792A1 (en) * 2008-10-03 2010-04-08 Eternal Chemical Co., Ltd. Polyimide precursor, its composition and polyimide laminate
JP5468913B2 (ja) * 2010-01-18 2014-04-09 株式会社カネカ レジスト付き多層ポリイミドフィルム及びその製造方法
CN102529222B (zh) * 2010-12-15 2014-07-02 新高电子材料（中山）有限公司 一种低热阻高绝缘金属基覆铜板及其制备方法
US20130040517A1 (en) * 2011-03-07 2013-02-14 Mitsubishi Gas Chemical Company, Inc. Resin composition for printed circuit board
US20130209788A1 (en) * 2012-02-09 2013-08-15 E. I. Du Pont De Nemours And Company Corona resistant structure and methods relating thereto
US9089071B2 (en) * 2012-06-28 2015-07-21 International Business Machines Corporation Implementing enhanced low loss, thin, high performance flexible circuits
CN104441831B (zh) * 2015-01-09 2016-09-14 广东生益科技股份有限公司 一种低介电常数双面挠性覆铜板
CN106211596A (zh) * 2016-06-30 2016-12-07 杭州福斯特光伏材料股份有限公司 一种双面挠性覆铜板及其制备方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04266082A (ja) * 1991-02-20 1992-09-22 Toray Ind Inc フレキシブル配線基板の製造方法
JP2955724B2 (ja) * 1991-04-24 1999-10-04 鐘淵化学工業株式会社 ポリイミドフィルムの製造方法
JPH06232553A (ja) 1993-01-29 1994-08-19 Hitachi Chem Co Ltd 積層用片面フレキシブル銅張板
JPH0741556A (ja) * 1993-07-29 1995-02-10 Kanegafuchi Chem Ind Co Ltd ポリイミド樹脂及びポリイミドフィルム
US5744286A (en) * 1996-02-12 1998-04-28 Choi; Jin-O Polyimide patterning
JPH10126019A (ja) * 1996-08-27 1998-05-15 Kanegafuchi Chem Ind Co Ltd フレキシブルプリント基板、ｆｃテープ及びそれからなるｔａｂテープ
JP3635384B2 (ja) * 1996-10-29 2005-04-06 株式会社カネカ 耐熱性ボンディングシート
JP2000058989A (ja) * 1998-08-13 2000-02-25 Mitsui Chemicals Inc フレキシブル金属箔積層板
JP2000080178A (ja) 1998-09-02 2000-03-21 Du Pont Toray Co Ltd 共重合ポリイミドフィルム、その製造方法およびこれを基材とした金属配線板
US6548179B2 (en) * 2000-08-24 2003-04-15 Dupont-Toray Co., Ltd. Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate
US6908685B2 (en) * 2000-08-24 2005-06-21 E. I. Du Pont De Nemours And Company Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate
JP3944874B2 (ja) * 2000-08-24 2007-07-18 東レ・デュポン株式会社 ポリイミドフィルム、その製造方法およびこれを基材とした金属配線板
KR20020018078A (ko) * 2000-08-28 2002-03-07 나카히로 마오미 방향족 폴리이미드 필름에서의 관통홀 제조 방법
JP2002201272A (ja) * 2000-12-28 2002-07-19 Nitto Denko Corp ポリイミド複合体の製造方法
JP4508441B2 (ja) * 2001-02-16 2010-07-21 新日鐵化学株式会社 積層体及びその製造方法
JP4739547B2 (ja) * 2001-02-23 2011-08-03 日東電工株式会社 ポリイミド複合体の製造方法
JP2002280684A (ja) 2001-03-16 2002-09-27 Sumitomo Electric Printed Circuit Inc フレキシブル銅張回路基板とその製造方法
JP4457542B2 (ja) 2001-06-22 2010-04-28 宇部興産株式会社 熱圧着性を有する多層ポリイミドフィルム、熱対策銅張り板
JP3932506B2 (ja) * 2002-01-10 2007-06-20 東レ・デュポン株式会社 ポリイミドフィルム、印刷回路および金属配線板
JP4067869B2 (ja) * 2002-05-13 2008-03-26 新日鐵化学株式会社 シロキサン変性ポリイミド樹脂
US6956098B2 (en) 2002-09-20 2005-10-18 E. I. Du Pont De Nemours And Company High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto
US7026436B2 (en) * 2002-11-26 2006-04-11 E.I. Du Pont De Nemours And Company Low temperature polyimide adhesive compositions and methods relating thereto
JP2004269675A (ja) * 2003-03-07 2004-09-30 Kanegafuchi Chem Ind Co Ltd ボンディングシートおよびそれから得られるフレキシブル金属張積層板
JP2005167006A (ja) * 2003-12-03 2005-06-23 Shin Etsu Chem Co Ltd フレキシブル金属箔ポリイミド基板の製造方法
KR100668948B1 (ko) 2004-09-21 2007-01-12 주식회사 엘지화학 금속 적층판 및 그의 제조방법
JP2006188025A (ja) * 2005-01-07 2006-07-20 Ube Ind Ltd 銅張積層板

Also Published As

Publication number Publication date
US8298366B2 (en) 2012-10-30
US20110308725A1 (en) 2011-12-22
TWI408202B (zh) 2013-09-11
WO2006038533A1 (ja) 2006-04-13
JPWO2006038533A1 (ja) 2008-05-15
KR101096967B1 (ko) 2011-12-20
JP5064033B2 (ja) 2012-10-31
US20090011231A1 (en) 2009-01-08
KR20070059168A (ko) 2007-06-11
CN101035875A (zh) 2007-09-12
CN101035875B (zh) 2011-04-06

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