TW200610160A - Light emitting diode package and its packaging method - Google Patents
Light emitting diode package and its packaging methodInfo
- Publication number
- TW200610160A TW200610160A TW094113941A TW94113941A TW200610160A TW 200610160 A TW200610160 A TW 200610160A TW 094113941 A TW094113941 A TW 094113941A TW 94113941 A TW94113941 A TW 94113941A TW 200610160 A TW200610160 A TW 200610160A
- Authority
- TW
- Taiwan
- Prior art keywords
- electrode
- led
- light
- emitting surface
- light emitting
- Prior art date
Links
- 238000000034 method Methods 0.000 title 1
- 238000004806 packaging method and process Methods 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0756—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094113941A TWI302382B (en) | 2004-09-15 | 2005-04-29 | Light emitting diode package and its packaging method |
US11/302,127 US7635876B2 (en) | 2005-04-29 | 2005-12-14 | LED package structure and method of packaging the same |
US12/492,606 US7858416B2 (en) | 2005-04-29 | 2009-06-26 | LED package structure and method of packaging the same |
US12/703,369 US8242690B2 (en) | 2005-04-29 | 2010-02-10 | Light-emitting diode die packages and illumination apparatuses using same |
US13/538,248 US20120267675A1 (en) | 2005-04-29 | 2012-06-29 | Light-emitting diode die packages and illumination apparatuses using same |
US13/538,228 US8624489B2 (en) | 2005-04-29 | 2012-06-29 | Light-emitting diode die packages and illumination apparatuses using same |
US13/538,279 US20120267649A1 (en) | 2005-04-29 | 2012-06-29 | Light-emitting diode die packages and illumination apparatuses using same |
US13/538,264 US8581490B2 (en) | 2005-04-29 | 2012-06-29 | Light-emitting diode die packages and illumination apparatuses using same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93127798 | 2004-09-15 | ||
TW094113941A TWI302382B (en) | 2004-09-15 | 2005-04-29 | Light emitting diode package and its packaging method |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200610160A true TW200610160A (en) | 2006-03-16 |
TWI302382B TWI302382B (en) | 2008-10-21 |
Family
ID=37233600
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094113941A TWI302382B (en) | 2004-09-15 | 2005-04-29 | Light emitting diode package and its packaging method |
Country Status (2)
Country | Link |
---|---|
US (2) | US7635876B2 (zh) |
TW (1) | TWI302382B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104704632A (zh) * | 2012-10-10 | 2015-06-10 | 欧司朗光电半导体有限公司 | 具有集成的保护二极管的光电子器件和用于其制造的方法 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200737545A (en) * | 2006-03-28 | 2007-10-01 | Joe Yang | Module which utilizes two light-emitting elements to mix light to form white light which is near three-wavelength and said module offers the ability to adjust color temperature |
DE102008047579B4 (de) * | 2008-09-17 | 2020-02-06 | Osram Opto Semiconductors Gmbh | Leuchtmittel |
DE102010031732A1 (de) * | 2010-07-21 | 2012-01-26 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
US8963121B2 (en) | 2012-12-07 | 2015-02-24 | Micron Technology, Inc. | Vertical solid-state transducers and high voltage solid-state transducers having buried contacts and associated systems and methods |
KR20140094752A (ko) | 2013-01-22 | 2014-07-31 | 삼성전자주식회사 | 전자소자 패키지 및 이에 사용되는 패키지 기판 |
TW201631808A (zh) * | 2015-02-25 | 2016-09-01 | 隆達電子股份有限公司 | 發光二極體晶片封裝體 |
DE102015112280A1 (de) | 2015-07-28 | 2017-02-02 | Osram Opto Semiconductors Gmbh | Bauelement mit einem metallischen Träger und Verfahren zur Herstellung von Bauelementen |
US10510722B2 (en) * | 2017-06-20 | 2019-12-17 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor device and method for manufacturing the same |
KR102559097B1 (ko) | 2018-07-27 | 2023-07-26 | 삼성디스플레이 주식회사 | 발광 장치, 그의 제조 방법, 및 이를 구비한 표시 장치 |
US11637219B2 (en) | 2019-04-12 | 2023-04-25 | Google Llc | Monolithic integration of different light emitting structures on a same substrate |
CN117133767B (zh) * | 2023-04-13 | 2024-08-06 | 荣耀终端有限公司 | Ppg封装模组及电子设备 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW591811B (en) * | 2003-01-02 | 2004-06-11 | Epitech Technology Corp Ltd | Color mixing light emitting diode |
JP4458804B2 (ja) * | 2003-10-17 | 2010-04-28 | シチズン電子株式会社 | 白色led |
JP4572312B2 (ja) * | 2004-02-23 | 2010-11-04 | スタンレー電気株式会社 | Led及びその製造方法 |
CN1677702A (zh) * | 2004-03-29 | 2005-10-05 | 斯坦雷电气株式会社 | 发光二极管 |
TWM277111U (en) * | 2004-06-18 | 2005-10-01 | Super Nova Optoelectronics Cor | Vertical electrode structure for white-light LED |
US20060067073A1 (en) * | 2004-09-30 | 2006-03-30 | Chu-Chi Ting | White led device |
-
2005
- 2005-04-29 TW TW094113941A patent/TWI302382B/zh not_active IP Right Cessation
- 2005-12-14 US US11/302,127 patent/US7635876B2/en not_active Expired - Fee Related
-
2009
- 2009-06-26 US US12/492,606 patent/US7858416B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104704632A (zh) * | 2012-10-10 | 2015-06-10 | 欧司朗光电半导体有限公司 | 具有集成的保护二极管的光电子器件和用于其制造的方法 |
CN104704632B (zh) * | 2012-10-10 | 2017-11-24 | 欧司朗光电半导体有限公司 | 具有集成的保护二极管的光电子器件和用于其制造的方法 |
Also Published As
Publication number | Publication date |
---|---|
US7635876B2 (en) | 2009-12-22 |
US20060243999A1 (en) | 2006-11-02 |
TWI302382B (en) | 2008-10-21 |
US7858416B2 (en) | 2010-12-28 |
US20090321756A1 (en) | 2009-12-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |