TW200518306A - Stackable IC package structure and the method of automatically manufacturing the IC module - Google Patents
Stackable IC package structure and the method of automatically manufacturing the IC moduleInfo
- Publication number
- TW200518306A TW200518306A TW092133240A TW92133240A TW200518306A TW 200518306 A TW200518306 A TW 200518306A TW 092133240 A TW092133240 A TW 092133240A TW 92133240 A TW92133240 A TW 92133240A TW 200518306 A TW200518306 A TW 200518306A
- Authority
- TW
- Taiwan
- Prior art keywords
- package unit
- package
- module
- lead frame
- interface layer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/4826—Connecting between the body and an opposite side of the item with respect to the body
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW92133240A TWI233196B (en) | 2003-11-26 | 2003-11-26 | Stackable IC package structure and the method of automatically manufacturing the IC module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW92133240A TWI233196B (en) | 2003-11-26 | 2003-11-26 | Stackable IC package structure and the method of automatically manufacturing the IC module |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI233196B TWI233196B (en) | 2005-05-21 |
TW200518306A true TW200518306A (en) | 2005-06-01 |
Family
ID=36480828
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW92133240A TWI233196B (en) | 2003-11-26 | 2003-11-26 | Stackable IC package structure and the method of automatically manufacturing the IC module |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI233196B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7342308B2 (en) | 2005-12-20 | 2008-03-11 | Atmel Corporation | Component stacking for integrated circuit electronic package |
US7821122B2 (en) | 2005-12-22 | 2010-10-26 | Atmel Corporation | Method and system for increasing circuitry interconnection and component capacity in a multi-component package |
KR20180082133A (ko) * | 2017-01-10 | 2018-07-18 | 에스케이하이닉스 주식회사 | 멀티 플레인을 포함하는 비휘발성 메모리 장치 |
-
2003
- 2003-11-26 TW TW92133240A patent/TWI233196B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI233196B (en) | 2005-05-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |