TW200508630A - Method and equipment for inspecting electric characteristics of specimen - Google Patents

Method and equipment for inspecting electric characteristics of specimen

Info

Publication number
TW200508630A
TW200508630A TW093117546A TW93117546A TW200508630A TW 200508630 A TW200508630 A TW 200508630A TW 093117546 A TW093117546 A TW 093117546A TW 93117546 A TW93117546 A TW 93117546A TW 200508630 A TW200508630 A TW 200508630A
Authority
TW
Taiwan
Prior art keywords
load sensor
electrode pad
specimen
equipment
electric characteristics
Prior art date
Application number
TW093117546A
Other languages
English (en)
Other versions
TWI289676B (en
Inventor
Shigekazu Komatsu
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200508630A publication Critical patent/TW200508630A/zh
Application granted granted Critical
Publication of TWI289676B publication Critical patent/TWI289676B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW093117546A 2003-06-20 2004-06-17 Method and equipment for inspecting electric characteristics of specimen TWI289676B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003177024A JP4339631B2 (ja) 2003-06-20 2003-06-20 検査方法及び検査装置

Publications (2)

Publication Number Publication Date
TW200508630A true TW200508630A (en) 2005-03-01
TWI289676B TWI289676B (en) 2007-11-11

Family

ID=33534919

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093117546A TWI289676B (en) 2003-06-20 2004-06-17 Method and equipment for inspecting electric characteristics of specimen

Country Status (5)

Country Link
US (2) US7135883B2 (zh)
JP (1) JP4339631B2 (zh)
KR (1) KR100653028B1 (zh)
TW (1) TWI289676B (zh)
WO (1) WO2004114392A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103245803A (zh) * 2012-02-13 2013-08-14 日本电产理德株式会社 基板检查装置的对准方法以及基板检查装置
TWI427300B (zh) * 2007-06-22 2014-02-21 Tokyo Electron Ltd The registration method of the probe card and the recording medium for recording the program
TWI454704B (zh) * 2008-02-28 2014-10-01 Tokyo Electron Ltd A tilt adjustment method for a probe card, a tilt detection method of a probe card, and a program recording medium for recording a tilt detection method of a probe card

Families Citing this family (25)

* Cited by examiner, † Cited by third party
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JP2006339196A (ja) * 2005-05-31 2006-12-14 Tokyo Seimitsu Co Ltd プローバの移動量演算校正方法、移動量演算校正処理プログラム及びプローバ
JP5032170B2 (ja) * 2007-03-23 2012-09-26 東京エレクトロン株式会社 検査装置
JP4684805B2 (ja) * 2005-08-25 2011-05-18 東京エレクトロン株式会社 プローブ装置及び被検査体とプローブとの接触圧の調整方法
JP4685559B2 (ja) * 2005-09-09 2011-05-18 東京エレクトロン株式会社 プローブカードと載置台との平行度調整方法及び検査用プログラム記憶媒体並びに検査装置
JP2007183193A (ja) * 2006-01-10 2007-07-19 Micronics Japan Co Ltd プロービング装置
JP4451416B2 (ja) 2006-05-31 2010-04-14 東京エレクトロン株式会社 プローブ先端の検出方法、アライメント方法及びこれらの方法を記録した記憶媒体、並びにプローブ装置
JP4695106B2 (ja) * 2007-02-21 2011-06-08 東京エレクトロン株式会社 チャックトップの高さを求める方法及びこの方法を記録したプログラム記録媒体
KR100862638B1 (ko) * 2007-03-13 2008-10-09 (주) 인텍플러스 클리닝 수단이 일체로 구비된 반도체 소자의 검사 장치 및그를 이용한 반도체 소자의 검사 방법
JP2008243861A (ja) * 2007-03-23 2008-10-09 Tokyo Electron Ltd 検査装置及び検査方法
JP4950719B2 (ja) * 2007-03-23 2012-06-13 東京エレクトロン株式会社 プローブの針先位置の検出方法、アライメント方法、針先位置検出装置及びプローブ装置
JP5406480B2 (ja) * 2008-08-08 2014-02-05 東京エレクトロン株式会社 プローブ方法及びプローブ用プログラム
KR101032959B1 (ko) 2009-05-20 2011-05-09 주식회사 쎄믹스 웨이퍼 프로버의 니들 클리너 위치제어장치 및 위치제어방법
JP5529605B2 (ja) * 2010-03-26 2014-06-25 東京エレクトロン株式会社 ウエハチャックの傾き補正方法及びプローブ装置
JP5819880B2 (ja) * 2013-05-08 2015-11-24 本田技研工業株式会社 平行度調整装置および平行度調整方法
KR102396428B1 (ko) 2014-11-11 2022-05-11 삼성전자주식회사 반도체 테스트 장치 및 방법
WO2017009987A1 (ja) * 2015-07-15 2017-01-19 富士機械製造株式会社 検査装置
KR102534364B1 (ko) * 2015-12-02 2023-05-18 세메스 주식회사 프로브 장치 및 상기 프로브 장치의 영점 설정 방법
GB2545496B (en) 2015-12-18 2020-06-03 Teraview Ltd A Test System
TWI631346B (zh) * 2017-03-10 2018-08-01 穩懋半導體股份有限公司 探針機及探針尖端位置定位和獲得探針與清針紙接觸資訊的方法
TWI749134B (zh) * 2017-12-22 2021-12-11 創新服務股份有限公司 植針方法及運用此方法的植針機
JP2020092140A (ja) * 2018-12-04 2020-06-11 東京エレクトロン株式会社 位置測定装置、及び、位置測定方法
US11204383B2 (en) * 2019-09-30 2021-12-21 Formfactor, Inc. Methods for maintaining gap spacing between an optical probe of a probe system and an optical device of a device under test, and probe systems that perform the methods
US11131709B2 (en) 2019-09-30 2021-09-28 Formfactor, Inc. Probe systems for optically probing a device under test and methods of operating the probe systems
US12055563B2 (en) * 2021-08-30 2024-08-06 Taiwan Semiconductor Manufacturing Company, Ltd. Probe card, apparatus and method for detecting contact force of probe card
US20240168058A1 (en) * 2022-11-18 2024-05-23 Formfactor, Inc. Methods of establishing contact between a probe tip of a probe system and a device under test, probe systems that perform the methods, and storage media that directs probe systems to perform the methods

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JPS6386445A (ja) * 1986-09-30 1988-04-16 Canon Inc ウエハプロ−バのｚ軸オ−バドライブ量制御装置および方法
US4929893A (en) * 1987-10-06 1990-05-29 Canon Kabushiki Kaisha Wafer prober
JP3208734B2 (ja) * 1990-08-20 2001-09-17 東京エレクトロン株式会社 プローブ装置
JP2895989B2 (ja) * 1991-06-10 1999-05-31 三菱電機株式会社 プローバ装置およびウエハの検査方法
US5321352A (en) 1991-08-01 1994-06-14 Tokyo Electron Yamanashi Limited Probe apparatus and method of alignment for the same
JPH05198662A (ja) * 1991-08-01 1993-08-06 Tokyo Electron Yamanashi Kk プローブ装置及び同装置におけるアライメント方法
JPH06163651A (ja) 1992-11-18 1994-06-10 Hitachi Ltd 半導体ウェハ検査装置
US5644245A (en) * 1993-11-24 1997-07-01 Tokyo Electron Limited Probe apparatus for inspecting electrical characteristics of a microelectronic element
WO1996029607A1 (fr) * 1995-03-18 1996-09-26 Tokyo Electron Limited Procede et appareil de controle d'un substrat
JP3129935B2 (ja) * 1995-06-09 2001-01-31 株式会社東京精密 ウェーハ検査装置
JP3454610B2 (ja) * 1995-07-14 2003-10-06 古河電気工業株式会社 光モジュールの光軸測定方法
JPH0951023A (ja) 1995-08-04 1997-02-18 Nippon Steel Corp 半導体試験装置
JP2000260852A (ja) * 1999-03-11 2000-09-22 Tokyo Electron Ltd 検査ステージ及び検査装置
JP2004152916A (ja) * 2002-10-29 2004-05-27 Nec Corp 半導体デバイス検査装置及び検査方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI427300B (zh) * 2007-06-22 2014-02-21 Tokyo Electron Ltd The registration method of the probe card and the recording medium for recording the program
TWI454704B (zh) * 2008-02-28 2014-10-01 Tokyo Electron Ltd A tilt adjustment method for a probe card, a tilt detection method of a probe card, and a program recording medium for recording a tilt detection method of a probe card
CN103245803A (zh) * 2012-02-13 2013-08-14 日本电产理德株式会社 基板检查装置的对准方法以及基板检查装置

Also Published As

Publication number Publication date
US7135883B2 (en) 2006-11-14
WO2004114392A1 (ja) 2004-12-29
US20070040549A1 (en) 2007-02-22
JP4339631B2 (ja) 2009-10-07
KR20060024427A (ko) 2006-03-16
JP2005012119A (ja) 2005-01-13
TWI289676B (en) 2007-11-11
KR100653028B1 (ko) 2006-12-01
US7262618B2 (en) 2007-08-28
US20060097743A1 (en) 2006-05-11

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