TW200506553A - Photoresist stripping method and its device - Google Patents
Photoresist stripping method and its deviceInfo
- Publication number
- TW200506553A TW200506553A TW093110588A TW93110588A TW200506553A TW 200506553 A TW200506553 A TW 200506553A TW 093110588 A TW093110588 A TW 093110588A TW 93110588 A TW93110588 A TW 93110588A TW 200506553 A TW200506553 A TW 200506553A
- Authority
- TW
- Taiwan
- Prior art keywords
- photoresist
- stripping method
- photoresist stripping
- treated
- applying
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The present invention provides a photoresist stripping method and device that enable photoresist on a substrate surface to be stripped with high efficiency. A method of stripping photoresist on a substrate surface includes at least a step (1) of applying an ozone solution to a surface to be treated and the step (2) of applying an organic solvent to the surface to be treated.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003111997 | 2003-04-16 | ||
JP2003111996 | 2003-04-16 | ||
JP2004024070 | 2004-01-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200506553A true TW200506553A (en) | 2005-02-16 |
Family
ID=33303692
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093110588A TW200506553A (en) | 2003-04-16 | 2004-04-16 | Photoresist stripping method and its device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4373979B2 (en) |
KR (1) | KR20060003346A (en) |
TW (1) | TW200506553A (en) |
WO (1) | WO2004093172A1 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4824395B2 (en) * | 2004-12-13 | 2011-11-30 | 積水化学工業株式会社 | Resist removing method and resist removing apparatus |
JP2006173211A (en) * | 2004-12-13 | 2006-06-29 | Sekisui Chem Co Ltd | Method and device for removing resist |
JP4555729B2 (en) * | 2005-05-17 | 2010-10-06 | 積水化学工業株式会社 | Resist removing method and resist removing apparatus |
KR100672752B1 (en) * | 2006-01-27 | 2007-01-22 | 주식회사 바맥스 | Method of removing photoresist and apparatus for performing the same |
KR101771250B1 (en) * | 2006-05-30 | 2017-08-24 | 호야 가부시키가이샤 | Resist film peeling method, mask blank manufacturing method and transfer mask manufacturing method |
JP5006112B2 (en) * | 2007-06-12 | 2012-08-22 | 国立大学法人 筑波大学 | Photoresist removal method |
JP5006111B2 (en) * | 2007-06-12 | 2012-08-22 | 国立大学法人 筑波大学 | Photoresist removal device |
US11358172B2 (en) * | 2015-09-24 | 2022-06-14 | Suss Microtec Photomask Equipment Gmbh & Co. Kg | Method for treating substrates with an aqueous liquid medium exposed to UV-radiation |
JPWO2020013218A1 (en) * | 2018-07-13 | 2021-08-02 | 富士フイルム株式会社 | Chemical solution, kit, pattern formation method, chemical solution manufacturing method and chemical solution container |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3239998B2 (en) * | 1998-08-28 | 2001-12-17 | 三菱マテリアルシリコン株式会社 | Semiconductor substrate cleaning method |
JP2000277473A (en) * | 1999-03-24 | 2000-10-06 | Mitsubishi Materials Silicon Corp | Cleaning method of silicon wafer |
JP2001035827A (en) * | 1999-07-16 | 2001-02-09 | Memc Kk | High concentration ozone water, preparation method thereof and cleaning method using the same |
JP2001196348A (en) * | 2000-01-12 | 2001-07-19 | Seiko Epson Corp | Method for decomposing organic matter and method of manufacturing semiconductor element |
JP2002100599A (en) * | 2000-09-21 | 2002-04-05 | Mitsubishi Materials Silicon Corp | Washing method for silicon wafer |
-
2004
- 2004-04-16 JP JP2005505465A patent/JP4373979B2/en not_active Expired - Fee Related
- 2004-04-16 TW TW093110588A patent/TW200506553A/en unknown
- 2004-04-16 WO PCT/JP2004/005452 patent/WO2004093172A1/en active Application Filing
- 2004-04-16 KR KR1020057019496A patent/KR20060003346A/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JP4373979B2 (en) | 2009-11-25 |
WO2004093172A1 (en) | 2004-10-28 |
JPWO2004093172A1 (en) | 2006-07-06 |
KR20060003346A (en) | 2006-01-10 |
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