TW200504349A - Automatic optical inspection system and method - Google Patents
Automatic optical inspection system and methodInfo
- Publication number
- TW200504349A TW200504349A TW092136716A TW92136716A TW200504349A TW 200504349 A TW200504349 A TW 200504349A TW 092136716 A TW092136716 A TW 092136716A TW 92136716 A TW92136716 A TW 92136716A TW 200504349 A TW200504349 A TW 200504349A
- Authority
- TW
- Taiwan
- Prior art keywords
- optical inspection
- inspection system
- automatic optical
- aoi
- verification
- Prior art date
Links
- 238000007689 inspection Methods 0.000 title abstract 2
- 230000003287 optical effect Effects 0.000 title abstract 2
- 238000000034 method Methods 0.000 title 1
- 238000012795 verification Methods 0.000 abstract 2
- 230000007547 defect Effects 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/327,115 US7203355B2 (en) | 2002-12-24 | 2002-12-24 | Automatic optical inspection system and method |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200504349A true TW200504349A (en) | 2005-02-01 |
TWI333058B TWI333058B (en) | 2010-11-11 |
Family
ID=32594173
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092136716A TWI333058B (en) | 2002-12-24 | 2003-12-24 | Automatic optical inspection system and method for manufacture of printed circuit boards |
Country Status (7)
Country | Link |
---|---|
US (2) | US7203355B2 (zh) |
JP (1) | JP2006515112A (zh) |
KR (1) | KR20050088416A (zh) |
CN (1) | CN100401312C (zh) |
AU (1) | AU2003288508A1 (zh) |
TW (1) | TWI333058B (zh) |
WO (1) | WO2004059567A2 (zh) |
Cited By (1)
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---|---|---|---|---|
CN104568959A (zh) * | 2013-10-15 | 2015-04-29 | 由田新技股份有限公司 | 一种检测混合类型待测物的方法 |
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US7397939B2 (en) * | 2002-08-30 | 2008-07-08 | Hewlett-Packard Development Company, L.P. | Method and apparatus for automatic removal of optical artifacts in scanning |
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JP2008509011A (ja) * | 2004-08-04 | 2008-03-27 | カムテック エルティーディー. | 物体を分配するためのシステム |
US8290239B2 (en) * | 2005-10-21 | 2012-10-16 | Orbotech Ltd. | Automatic repair of electric circuits |
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US7372632B2 (en) * | 2006-09-07 | 2008-05-13 | Hitachi Via Mechanics, Ltd. | Apparatus and methods for the inspection of microvias in printed circuit boards |
WO2008120182A2 (en) * | 2007-03-29 | 2008-10-09 | Camtek Ltd. | Method and system for verifying suspected defects of a printed circuit board |
US7951697B1 (en) | 2007-06-20 | 2011-05-31 | Amkor Technology, Inc. | Embedded die metal etch stop fabrication method and structure |
US7923645B1 (en) | 2007-06-20 | 2011-04-12 | Amkor Technology, Inc. | Metal etch stop fabrication method and structure |
US7958626B1 (en) | 2007-10-25 | 2011-06-14 | Amkor Technology, Inc. | Embedded passive component network substrate fabrication method |
CN101576594B (zh) * | 2008-05-06 | 2011-05-04 | 大元科技股份有限公司 | 自动光学检查设备及其光源模块 |
CN101398462B (zh) * | 2008-07-04 | 2012-07-25 | 深圳市达鑫自动化有限公司 | 贴片焊线自动检测系统 |
DE102009014008B4 (de) * | 2009-03-19 | 2011-02-17 | Siemens Electronics Assembly Systems Gmbh & Co. Kg | Anordnung zur optischen Inspektion von Bestückungsvorgängen |
JP5542360B2 (ja) * | 2009-03-30 | 2014-07-09 | 太陽ホールディングス株式会社 | プリント配線板 |
US20120244273A1 (en) * | 2009-07-06 | 2012-09-27 | Camtek Ltd. | system and a method for solder mask inspection |
US9035673B2 (en) * | 2010-01-25 | 2015-05-19 | Palo Alto Research Center Incorporated | Method of in-process intralayer yield detection, interlayer shunt detection and correction |
US10664940B2 (en) | 2010-03-05 | 2020-05-26 | Digimarc Corporation | Signal encoding to reduce perceptibility of changes over time |
US8477990B2 (en) | 2010-03-05 | 2013-07-02 | Digimarc Corporation | Reducing watermark perceptibility and extending detection distortion tolerances |
US8971567B2 (en) | 2010-03-05 | 2015-03-03 | Digimarc Corporation | Reducing watermark perceptibility and extending detection distortion tolerances |
WO2011147434A1 (en) * | 2010-05-28 | 2011-12-01 | Abb Ag | System for moving a sensor or actuator in a three dimensional s pace |
KR101830679B1 (ko) * | 2010-07-29 | 2018-02-22 | 삼성디스플레이 주식회사 | 표시 패널 검사 장치 및 그 방법 |
KR101158680B1 (ko) * | 2010-10-12 | 2012-06-25 | (주)더블유티케이 | 평판형상 프레임용 비전검사기 |
US8791501B1 (en) | 2010-12-03 | 2014-07-29 | Amkor Technology, Inc. | Integrated passive device structure and method |
CN102147375B (zh) * | 2010-12-23 | 2012-10-03 | 东莞市升力智能科技有限公司 | 一种双工作台挠性印制电路表面缺陷自动检测机 |
CN102156357A (zh) * | 2011-02-25 | 2011-08-17 | 深圳市华星光电技术有限公司 | 自动光学检验设备及其校正方法 |
CN102221549B (zh) * | 2011-03-06 | 2013-04-03 | 丘荣意 | 一种pcb电路板全自动进板光学图像检测装置 |
CN102221563B (zh) * | 2011-03-23 | 2013-05-08 | 梅州泰源科技有限公司 | 一种pcb电路板缺陷自动检查设备 |
JP5466686B2 (ja) * | 2011-11-04 | 2014-04-09 | セイコープレシジョン株式会社 | 配線板測定装置及び配線板測定方法 |
KR20200004463A (ko) | 2012-01-02 | 2020-01-13 | 머트락스 인터내셔널 비.브이. | 인쇄회로기판을 인쇄하기 위한 잉크젯 시스템 |
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US10162343B2 (en) | 2014-07-23 | 2018-12-25 | Apple Inc. | Adaptive processes for improving integrity of surfaces |
US10649497B2 (en) | 2014-07-23 | 2020-05-12 | Apple Inc. | Adaptive processes for improving integrity of surfaces |
CN104568985A (zh) * | 2014-12-30 | 2015-04-29 | 东莞市合易自动化科技有限公司 | 一种aoi光学检测设备 |
CN104890372B (zh) * | 2015-05-29 | 2017-03-29 | 歌尔股份有限公司 | Pcb废板打标装置及其打标方法 |
CN105129408A (zh) * | 2015-09-15 | 2015-12-09 | 黄石沪士电子有限公司 | Pcb板自动光学检验装置及方法 |
CN105893670A (zh) * | 2016-03-31 | 2016-08-24 | 国网福建省电力有限公司 | 变电站技改工程自动生成方法 |
CN105894187B (zh) * | 2016-03-31 | 2021-05-04 | 国网福建省电力有限公司 | 一种变电站技改工程自动设计系统 |
CN106323600B (zh) * | 2016-08-31 | 2020-04-24 | 武汉精测电子集团股份有限公司 | 一种级联分布式aoi缺陷检测系统及其检测方法 |
CN109115780A (zh) * | 2017-06-23 | 2019-01-01 | 大陆泰密克汽车系统(上海)有限公司 | 用于监控多个自动光学检测设备的方法及其装置 |
CN107367682B (zh) * | 2017-06-26 | 2019-11-19 | 王俊 | 印制电路板检修方法及系统 |
WO2019037019A1 (zh) * | 2017-08-24 | 2019-02-28 | 深圳市华显光学仪器有限公司 | 自动坐标显微镜 |
US10783629B2 (en) * | 2017-09-29 | 2020-09-22 | Align Technology, Inc. | Aligner image based quality control system |
TWI670469B (zh) * | 2018-08-24 | 2019-09-01 | 超能高新材料股份有限公司 | 一種晶體品質判定方法 |
US11278375B2 (en) | 2018-09-27 | 2022-03-22 | Align Technology, Inc. | Aligner damage prediction and mitigation |
CN109540901A (zh) * | 2018-11-02 | 2019-03-29 | 英业达(重庆)有限公司 | 自动光学检测不良信息反馈系统及方法 |
US11295444B2 (en) | 2019-04-01 | 2022-04-05 | Align Technology, Inc. | Vision and geometric approaches to detect defects in dental appliances |
TW202104876A (zh) * | 2019-07-29 | 2021-02-01 | 由田新技股份有限公司 | 印刷電路板的檢修方法及其系統 |
CN111054638A (zh) * | 2019-11-27 | 2020-04-24 | 奥特斯科技(重庆)有限公司 | 制造部件承载件的方法及在制造期间操控面板的设备 |
TW202208831A (zh) * | 2020-08-21 | 2022-03-01 | 由田新技股份有限公司 | 集中式複判系統及方法 |
KR20220075071A (ko) | 2020-11-27 | 2022-06-07 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 불량 검사 방법 |
CN112669272A (zh) * | 2020-12-22 | 2021-04-16 | 广州广合科技股份有限公司 | 一种aoi快速检测方法及快速检测系统 |
CN114044386A (zh) * | 2021-11-15 | 2022-02-15 | 佛山市坦斯盯科技有限公司 | 一种柔性电路板aoi放卷检测设备 |
CN115988737B (zh) * | 2023-03-21 | 2023-08-25 | 广州添利电子科技有限公司 | 一种检验自动光学检测机检测能力的验证板及其制备方法 |
CN117705813A (zh) * | 2024-02-05 | 2024-03-15 | 宁德时代新能源科技股份有限公司 | 焊接质量检测系统和方法 |
Family Cites Families (10)
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JPH0679325B2 (ja) * | 1985-10-11 | 1994-10-05 | 株式会社日立製作所 | 位置姿勢判定方法 |
US4758888A (en) | 1987-02-17 | 1988-07-19 | Orbot Systems, Ltd. | Method of and means for inspecting workpieces traveling along a production line |
US4956911A (en) * | 1990-05-18 | 1990-09-18 | Ag Communication Systems Corporation | Tool for repairing surface mounted components on printed circuit board |
IL99823A0 (en) * | 1990-11-16 | 1992-08-18 | Orbot Instr Ltd | Optical inspection method and apparatus |
IL101063A (en) | 1992-02-25 | 1995-03-30 | Orbotech Ltd | Verification and repair station for pcbs |
US5657075A (en) * | 1993-02-05 | 1997-08-12 | Teradyne, Inc. | Method and apparatus for locating and facilitating the repair of defects on a printed circuit board |
US5784484A (en) * | 1995-03-30 | 1998-07-21 | Nec Corporation | Device for inspecting printed wiring boards at different resolutions |
ATE246803T1 (de) * | 1997-05-05 | 2003-08-15 | Macrotron Process Technologies | Verfahren und schaltungsanordnung zur prüfung von lötstellen |
US6434264B1 (en) * | 1998-12-11 | 2002-08-13 | Lucent Technologies Inc. | Vision comparison inspection system |
TW468033B (en) | 2000-05-15 | 2001-12-11 | Orbotech Ltd | Microscope inspection system |
-
2002
- 2002-12-24 US US10/327,115 patent/US7203355B2/en not_active Expired - Fee Related
-
2003
- 2003-12-21 JP JP2004563547A patent/JP2006515112A/ja active Pending
- 2003-12-21 WO PCT/IL2003/001095 patent/WO2004059567A2/en active Application Filing
- 2003-12-21 KR KR1020057010390A patent/KR20050088416A/ko not_active Application Discontinuation
- 2003-12-21 CN CNB2003801075005A patent/CN100401312C/zh not_active Expired - Fee Related
- 2003-12-21 AU AU2003288508A patent/AU2003288508A1/en not_active Abandoned
- 2003-12-24 TW TW092136716A patent/TWI333058B/zh not_active IP Right Cessation
-
2007
- 2007-02-27 US US11/711,100 patent/US7295696B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104568959A (zh) * | 2013-10-15 | 2015-04-29 | 由田新技股份有限公司 | 一种检测混合类型待测物的方法 |
CN104568959B (zh) * | 2013-10-15 | 2017-10-13 | 由田新技股份有限公司 | 一种检测混合类型待测物的方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2006515112A (ja) | 2006-05-18 |
US7203355B2 (en) | 2007-04-10 |
WO2004059567A3 (en) | 2004-08-19 |
AU2003288508A1 (en) | 2004-07-22 |
US20040120570A1 (en) | 2004-06-24 |
WO2004059567A2 (en) | 2004-07-15 |
TWI333058B (en) | 2010-11-11 |
CN1732474A (zh) | 2006-02-08 |
US7295696B2 (en) | 2007-11-13 |
CN100401312C (zh) | 2008-07-09 |
KR20050088416A (ko) | 2005-09-06 |
US20070154081A1 (en) | 2007-07-05 |
AU2003288508A8 (en) | 2004-07-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |