TW200421945A - An electrostatic discharge protection structure for a multi-hole structure - Google Patents

Abstract

An electrostatic discharge protection structure for a multi-hole structure is provided. A multi-hole electric conductive layer is configured between a multi-hole structure and an electronic component of an electronic device. The multi-hole electric conductive layer contacts with an electric conductive film on the inside surface of a shell of the electronic device. It disperses the electric charges accumulated because of lacking electric conductive film on the multi-hole structure, and thus prevents the accumulated electric charges from discharging to damage the electronic component.

Description

200421945 2. Description of the invention [Technical field to which the invention belongs] The present invention relates to an electrostatic protection device, and more particularly to an electrostatic discharge protection structure with a hole structure. [Previous technology] General electronic equipment, such as displays, notebook computers, mobile phones, etc., are easily damaged by electrostatic discharge (ESD) and affect the normal working state of the machine or system equipment. The instantaneous potential caused by the electrostatic discharge phenomenon is quite large, and the current 1C component design is becoming smaller. As a result, the electrostatic potential that may cause electrostatic discharge damage is also reduced. In practical applications, some high-speed components have an electrostatic potential of 30V. It can be destroyed from time to time. The cause of electrostatic discharge is the phenomenon that a charged object forms an electric field, which ionizes nearby gas and causes a discharge. Whether it is a conductor or a non-conductor, charges are generated and accumulated. Generally, the lower the resistance value, the faster the static dissipation rate and the less likely it is to accumulate charges. On the other hand, the higher the resistance value, the slower the static dissipation rate. Easy to accumulate high charges. Therefore, non-conductors are more likely to accumulate static charges. Generally, artificial polymers', such as plastic, have the characteristics of high insulation and high resistance, and they can accumulate static charges for a relatively long period of time. For non-conducting substances, the method to avoid a large amount of accumulated charges is to coat the surface with antistatic substances, such as carbon powder, antistatic agents or metal thin film layers, to form a conductive layer on the surface of the non-conducting substances to disperse the accumulated charges to 200421945 elsewhere. Or, carbon powder, antistatic liquid, metal powder, or metal fiber is added during the manufacturing process of the non-conductive substance, so that the non-conductive substance f becomes an antistatic substance or a conductive substance. The electrostatic discharge protection method φ, pull + +% V 7 fork knife 忒 rp, grounding is the most effective and economical method. The charge accumulated on the object will completely release the energy in one discharge, which is the most important cause of electrostatic discharge damage. The protection method is to connect all objects together, then ground them, and keep the grounding resistance low, so that the charges on the objects can quickly dissipate to the ground, avoiding the danger of electrostatic discharge. There are two types of electrostatic discharge: direct electrostatic discharge (direct ESD) and indirect electrostatic discharge (indirect ESD). Among them, direct electrostatic discharge can be divided into contact discharge and air discharge according to the different discharge methods. Indirect discharge can also be divided into horizontal coupling plane (HCP) and vertical coupling plane (VCP) 〇 In order to prevent electrostatic discharge from damaging electronic components, a variety of software and hardware that resist electrostatic discharge are created. In order to improve the ability of the electronic equipment to resist static electricity and allow the system to work in a stable state, manufacturers generally perform an ESD test on the casing of the electronic equipment before leaving the factory to ensure that the electronic equipment has a certain ability to resist static electricity. The general ESD test of the Yuyi environment is: the temperature is 15 C to 3 5 C, the relative humidity is between 30% and 60%; the atmospheric pressure is between 68 Kpa (680 mbar) to 106 Kpa (1060mbar). Therefore, the ESD test is also a test procedure according to the method of electrostatic discharge 'to test whether the shell can be jealous of the prince. In various cases of electrostatic discharge, it can still effectively resist static electricity. Brother 1A is a schematic diagram of the appearance of a conventionally signed ^ 1Δ m pen A computer. Please refer to FIG. 1A, the body part of the notebook lightning β .. 〇〇 can be divided into the housing cover 102, body 104. In general, & achieves the weight of a laptop

For the purpose of reducing the manufacturing cost of the first person, the upper case cover 102 is usually made of artificial materials such as plastic. There is a magic A f electronic component on the machine 104, and the position of the upper cover 102 of the machine housing corresponding to the system 4 has eighteen: exit port 112, so that the speaker 114 can make a sound. Figure: Figure B is a schematic diagram of the back of the casing cover of Figure 1A. ^ Figure 1B, because the material of the housing cover 102 is a non-conductive material such as plastic, so the surface and the valley are easy to accumulate electric charges. A known method to solve the problem of accumulated charge on the upper case cover 2 is to add a conductive film 122 'on its inner surface, such as spraying a layer of conductive paint, so that the electricity on the m surface of the case cover can quickly dissipate to the ground. To avoid the danger of static electricity. .... And, the speaker output port i 丨 2 on the upper cover 102 is a hole structure, and usually has dense and many holes to facilitate the sound of the speaker. This structure will cause the conductive paint to spill out onto the outer surface of the iG2 on the casing when spraying. Therefore, it is known that the conductive material film 122 is usually not added to the inner layer of the remaining πΛ output port 112 to avoid the conductive material film 122 , For example, conductive paint and other spills affect the appearance of notebook-type electrical appliances. However, the inner layer of the output bee 112 by ㈣ 卜 八 lacks a conductive material film 122, so it is 100% in a notebook computer.

Test execution. J's ESD / Minus' taste J Π Eight output support Fu 112 often fails to pass ESD [Summary of the invention] Therefore, the purpose of the present invention is to provide a hole-structured static electricity protection structure using a thunderbolt. In order to solve the static electricity problem of the hole structure of the electronic components of Lei Ling 4 in order to change. According to the present invention, the purpose of the invention is to realize a static structure with a hole structure = a thin structure. The invention provides a hole structure for electronic wounds and electronic components. Into the hole conductive material layer, the porous conductive material layer is a first, second, and second power: the conductive material film on the inner layer of the device's shell is in contact with each other. The accumulated charge is dispersed elsewhere, and the accumulated charge in the hole structure causes electrostatic discharge to damage the electronic component. A preferred embodiment of the invention is the porous conductive material layer of the invention " 5 is a metal fiber woven fabric having a plurality of minute holes. In another preferred embodiment, the porous conductive material layer may also be a metal thin film. The material of the metal thin film may be selected from copper, copper, or other metals with good processing properties, so as to disperse the accumulated charge of the porous structure. In addition, a porous plastic material layer can be added between the porous conductive material layer and the electronic component, and its hardness is used to give the porous conductive material layer the required support. In addition, a -crossover structure can also be added between the = conductive material layer and the electronic components to transition the dust spread from the outside world of 200421945 to protect the electronic components. It can be known from the above-mentioned preferred embodiments of the present invention that the application of the present invention can solve the problem that the conventional electrostatic discharge is easy to occur when the inner layer of the hole structure of the shell does not have a conductive material film. The invention only needs to add a porous conductive material layer between the hole structure and the electronic component, and use the porous conductive material layer to contact the conductive material film of the inner layer of the shell to disperse the accumulated charge of the hole structure. In addition, the additional porous plastic material layer is used, so that the thickness of the porous conductive material layer used in the present invention, such as a conductive cloth or a metal thin film, need not be too thick to reduce the manufacturing cost. Therefore, the present invention is an effective and inexpensive electrostatic discharge protection structure. [Embodiment] In order to improve the electrostatic discharge problem of the hole structure of the conventional electronic component, the present invention provides an electrostatic discharge protection structure with a hole structure. In the present invention, a porous conductive material layer is added between the hole structure of the electronic device and the electronic component. The porous conductive material layer is a conductor and is in contact with the conductive material film on the inner layer of the casing of the electric device. The hole structure = lack of conductivity The charge accumulated by the material film is dispersed elsewhere to prevent the accumulated charge from the hole structure from causing electrostatic discharge and damaging the electronic component. The electrostatic discharge protection structure of the hole structure of the present invention is described below with reference to Figures 2A-2D and Figures 1A-1B. Please refer to FIG. 2A, which illustrates a schematic diagram according to a preferred embodiment of the present invention. In this embodiment, the porous conductive material layer added between La 0 Ba 114 and La 0 Ba Lun Port II 2 10 200421945 is a conductive cloth 202, and the conductive cloth 202 and the case cover 102 The inner layer of conductive material film 122 is in contact, and the charge accumulated in the output port 112 of the Rabbi is dispersed to prevent the electrostatic discharge caused by the accumulated charge in the Rab eight output port 112 from damaging the Rabbi i 14 or even the entire notebook computer 1 〇〇. FIG. 2B is a schematic diagram showing the appearance of the notebook computer using the embodiment of FIG. 2A. The conductive cloth 202 may be a metal fiber woven fabric, using metal fiber as a conductive material as a weft yarn, and a thermoplastic polyester (pET) fiber as a warp yarn ^ It is known from experiments that the electromagnetic shielding effect and the electrostatic potential difference attenuation value of the metal fiber woven fabric As the density of the fabric increases, you can choose a suitable metal fiber woven according to the specifications of electrostatic discharge protection: As a material for electrostatic discharge protection. In addition, the conductive cloth 202 is a structure with a plurality of tiny holes, so it will not affect the normal operation of the speaker U4. In another preferred embodiment, the porous conductive material layer added between the LA0 114 and the LA0 output ports 112 is a metal thin film. The material of the metal thin film can be selected from copper, copper or other metal that is easy to process and has good conductivity to disperse the accumulated charge of the speaker output_ 112. In addition, a plurality of holes can also be made in the metal film to facilitate the transmission of the sound of the speaker " 4. As the U-hole conductive material layer added to the electronic component and its corresponding hole structure door, such as conductive Bucheon 2, its cost is higher than the shell '-generally it will choose a thinner thickness to save costs, but this will cause The support of the conductive cloth 202 is insufficient and it is difficult to fix. Because of & in another preferred embodiment of 200421945, the material of the porous plastic material layer 204 is mylar, which is cheap and easy to process. It can be cut into the desired shape as required, and printed in it. Holes to meet the needs of the present invention. And the metal thin film used in another preferred embodiment of the present invention has a very thin thickness, so the porous plastic material layer 204 can also be added between the metal thin film and the electronic component, as shown in FIG. 2C, so that the metal The film can be held well. In this way, the metal thin film can be kept in contact with the conductive material thin film 122 on the inner layer of the casing upper cover 丨 to disperse the electric charge accumulated by the speaker: 喇叭 φ 112. In addition, since general electronic components, such as the speaker U4, are usually dust-proofed, a filter is added. Therefore, the present invention can also add a filter structure between the porous conductive material layer 202 and the remaining openings 114. 2 6. As shown in Fig. =, To filter the dust that is diffused from the outside to protect the raid HO. As can be seen from the above preferred embodiment of the present invention, the application of the present invention can solve the problem when the inner layer of the hole structure of the shell does not have When the conductive material film is used, the problem of electrostatic discharge is likely to occur. In the present invention, an additional porous conductive material layer needs to be added between the hole structure and the electric + element, and the porous conductive material layer is used to contact the conductive material film of the inner layer of the shell to disperse the hole structure: charge. In addition, an additional layer of porous plastic material is used: The thickness of the porous conductive layer, such as conductive cloth or gold film, made by the present invention does not need to be too thick to reduce the manufacturing cost. Therefore, the present invention is an effective and inexpensive electrostatic discharge protection structure. ",, · Although the present invention has been disclosed in the preferred embodiment as above, it is not a shame. 12 200421945 To limit the present invention, anyone skilled in the art can do various things without departing from the spirit and scope of the present invention. The modification and retouching of the present invention is therefore subject to the protection of Ife of the present invention as defined in the scope of the attached patent application. [Simplified illustration of the drawings] In order to make the above and other objects, features, and advantages of the present invention clearer * The members are easy to understand. The following is a detailed description of a preferred embodiment and the accompanying drawings. The detailed description is as follows: Figure 1A is a schematic diagram of the appearance of a conventional notebook computer. Figure 1B shows the first Figure 1A is a schematic diagram of the back of the case cover. Figure 2A is a schematic diagram showing a preferred embodiment of the present invention. Figure 2B is a schematic diagram showing the appearance of a notebook computer using Figure 2a. Figure 2C It is a schematic diagram according to another preferred embodiment of the present invention. 苐 2D drawing is a schematic diagram of another preferred embodiment according to Zhaomu Yuming m ..., Qiqiming 0 ^ [Elementary symbol simple description] 100 : Notebook 102 · Case Top cover 13 200421945 104: body 11 2 ··. 8 output ports 114: thorns 122: conductive material film 202: conductive cloth 204: porous plastic material layer 206: filter structure

Claims (1)

200421945, patent application scope ^ 1 · A type of hole-dissipated electrostatic discharge protection structure, which is applied to an electronic device and an electronic device including an insulating case and at least one electronic-nine electronic component located in the insulating case, the hole The electrostatic discharge protection structure of the structure includes at least: a hole structure located at a position of the insulating shell corresponding to the electronic component; a private material film formed around the hole structure of the inner layer of the insulation shell; It is placed between the hole structure and the electronic component, and the porous conductive material layer is in contact with the conductive material film to prevent the wells from accumulating charges in the same structure and causing electrostatic discharge to damage the electronic element. The hole-hole electrical protection structure has a thunder in the basin; the external supply stone 丨-human π static forced discharge The eight-sided electronic equipment contains at least one portable electronic device. 0 As described in the scope of the patent application, the snow is steep Addicted to electrostatic discharge protection, the structure of the hole at least includes the wheel exit port. 4 · Electrostatic discharge structure of hole structure as described in item i of the patent application scope 厶 丄 yq ·;) inch 厶 丄 yq ·;) electric protection structure, wherein the electronic component contains at least 5_ The anti-static discharge of the hole structure attracted by the soldier named Gangan is protected from electrostatic discharge. The square edge structure, wherein the porous material layer includes at least one conductive cloth. 〇 According to the scope of the patent application, the electrostatic discharge prevention of the hole structure described by the first member of the electric defense 1 family member Gan Gan is in compliance with the L structure, wherein the conductive cloth ^ H ^ includes a metal fiber shuttle fabric. 7. The first electric protection structure according to the scope of patent application, wherein the porous conductive film. The electrostatic discharge material layer of the hole structure described in the item above includes at least one thin metal sheet. The electrostatic discharge protection structure of the hole structure as described in the patent application for ribs 7M, 丄, and 7 members, where the material of the metal film At least the inscription. 9. The electrostatic discharge protection structure of the hole structure according to item 7 of the scope of the patent application, wherein the material of the metal thin film includes at least copper. The electrostatic discharge protection structure of the hole structure according to item 丨 in the scope of the patent application, wherein the electrostatic discharge protection structure of the hole structure further includes: a porous plastic material layer placed on the porous conductive material layer and the electronic component. For supporting the porous conductive material layer. " 200421945 11 · The electrostatic discharge protection structure of the hole structure according to item 1 of the scope of patent application, wherein the electrostatic discharge protection structure of the hole structure further comprises: a filter and mesh structure, which is placed on the porous conductive material layer and The electronic components are used to prevent the electronic components from being polluted by dust. 12 · An electronic device comprising an insulating casing and at least one electronic component, the electronic component is located in the insulating casing, the insulating casing has a hole structure corresponding to the position of the electronic component, and a thin film of conductive material is formed on the The surrounding structure of the hole structure of the inner layer of the insulating shell is characterized in that: the conductive material layer is placed between the hole structure and the electronic component, and the porous conductive material layer is in contact with the conductive material film to prevent the hole structure The accumulated electric charge causes electrostatic discharge to damage the electronic component. 13. The electronic device described in item 12 of the scope of patent application, the electronic device is a portable electronic device. 14. The electronic device as described in claim 12 of the patent scope, wherein the hole structure includes at least one horn wheel to bee. The electronic device according to item i 2 of the declared patent scope, wherein 17 200421945 the electronic component includes at least one system. 16. The electronic device according to item 12 of the scope of patent application. The porous conductive material layer includes at least one conductive cloth. 1 7_ Electronic equipment as described in item 16 of the scope of patent application. The conductive fabric includes at least one metal fiber woven fabric. 1 8. The electronic device according to item 12 of the scope of patent application. The porous conductive material layer includes at least one metal thin film. 19_ The electronic device according to item 18 of the scope of patent application. The material of the metal film includes at least aluminum. 20. The electronic device as described in item 18 of the scope of patent application. The material of the metal film includes at least copper. 21. The electronic device according to item 12 of the scope of the patent application includes: a porous plastic material layer placed between the electronic components of the porous conductive material layer to support the porous conductive material layer. 22. The electronic device according to item 12 of the scope of patent application, wherein, among which, among them, its special feature and the special feature, the special feature of the special feature includes a filter structure, which is placed on the porous conductive material layer. And between the electronic components to prevent the electronic components from being polluted by dust. 19