TW200403192A - Method of scribing on brittle material, scribe head, and scribing apparatus with the scribe head - Google Patents

Method of scribing on brittle material, scribe head, and scribing apparatus with the scribe head Download PDF

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Publication number
TW200403192A
TW200403192A TW092119507A TW92119507A TW200403192A TW 200403192 A TW200403192 A TW 200403192A TW 092119507 A TW092119507 A TW 092119507A TW 92119507 A TW92119507 A TW 92119507A TW 200403192 A TW200403192 A TW 200403192A
Authority
TW
Taiwan
Prior art keywords
blade
scribing
axis
brittle material
head
Prior art date
Application number
TW092119507A
Other languages
English (en)
Chinese (zh)
Other versions
TWI296612B (https=
Inventor
Junichi Matsumoto
Keiko Hayashi
Toshiyuki Sakai
Haruo Wakayama
Yoshitaka Nishio
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW200403192A publication Critical patent/TW200403192A/zh
Application granted granted Critical
Publication of TWI296612B publication Critical patent/TWI296612B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • C03B33/107—Wheel design, e.g. materials, construction, shape
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
TW092119507A 2002-07-18 2003-07-17 Method of scribing on brittle material, scribe head, and scribing apparatus with the scribe head TW200403192A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002209823 2002-07-18

Publications (2)

Publication Number Publication Date
TW200403192A true TW200403192A (en) 2004-03-01
TWI296612B TWI296612B (https=) 2008-05-11

Family

ID=30767701

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092119507A TW200403192A (en) 2002-07-18 2003-07-17 Method of scribing on brittle material, scribe head, and scribing apparatus with the scribe head

Country Status (6)

Country Link
JP (1) JP4205664B2 (https=)
KR (1) KR100647456B1 (https=)
CN (1) CN1668431B (https=)
AU (1) AU2003281461A1 (https=)
TW (1) TW200403192A (https=)
WO (1) WO2004009311A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI380959B (zh) * 2005-05-27 2013-01-01 Schott Ag 用以機械地折斷易脆斷裂材料之一經刻線工件之方法
TWI562264B (en) * 2012-12-19 2016-12-11 Genesis Photonics Inc Splitting apparatus and splitting method

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101272455B1 (ko) * 2005-12-01 2013-06-07 미쓰보시 다이야몬도 고교 가부시키가이샤 팁홀더 교환 방법
US8051681B2 (en) * 2007-05-09 2011-11-08 Corning Incorporated Constant force scoring device and method for using same
CN104149211B (zh) * 2007-06-06 2016-12-07 三星钻石工业株式会社 手动气割切削器用刀片保持器以及具有该刀片保持器的手动气割切削器
JP5450964B2 (ja) * 2008-02-29 2014-03-26 三星ダイヤモンド工業株式会社 スクライブ装置及びスクライブ方法
KR100941080B1 (ko) * 2008-04-30 2010-02-10 세메스 주식회사 스크라이빙 장치 및 방법과, 이를 이용한 기판 절단 장치
TWI498293B (zh) * 2011-05-31 2015-09-01 Mitsuboshi Diamond Ind Co Ltd 劃線方法、鑽石尖、劃線裝置
JP6519381B2 (ja) * 2015-07-27 2019-05-29 三星ダイヤモンド工業株式会社 脆性材料基板における垂直クラックの形成方法および脆性材料基板の分断方法
CN107775825A (zh) * 2016-08-30 2018-03-09 三星钻石工业股份有限公司 金刚石刀具及其划线方法
JP2018051945A (ja) * 2016-09-29 2018-04-05 三星ダイヤモンド工業株式会社 ダイヤモンドツール及びそのスクライブ方法
TWI819626B (zh) * 2022-05-25 2023-10-21 矽品精密工業股份有限公司 超音波裝置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0857846A (ja) * 1994-08-19 1996-03-05 Hitachi Ltd ダイヤモンド・ポイントスクライブ装置
JP4191304B2 (ja) * 1999-03-03 2008-12-03 三星ダイヤモンド工業株式会社 チップホルダー
JP4249373B2 (ja) * 2000-05-16 2009-04-02 三星ダイヤモンド工業株式会社 脆性材料のクロススクライブ方法
TW555706B (en) * 2001-07-18 2003-10-01 Mitsuboshi Diamond Ind Co Ltd Scribe head, scribe apparatus and scribe method using the scribe head

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI380959B (zh) * 2005-05-27 2013-01-01 Schott Ag 用以機械地折斷易脆斷裂材料之一經刻線工件之方法
TWI562264B (en) * 2012-12-19 2016-12-11 Genesis Photonics Inc Splitting apparatus and splitting method

Also Published As

Publication number Publication date
WO2004009311A1 (ja) 2004-01-29
JP4205664B2 (ja) 2009-01-07
TWI296612B (https=) 2008-05-11
KR100647456B1 (ko) 2006-11-23
AU2003281461A1 (en) 2004-02-09
CN1668431A (zh) 2005-09-14
JPWO2004009311A1 (ja) 2005-11-17
CN1668431B (zh) 2010-06-09
KR20050013220A (ko) 2005-02-03

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