TH40096B - Laser processing method And objects to process - Google Patents

Abstract

The DC60 (27/01/54) provides a laser processing method. Which can be laminated parts too High accuracy with substrate When cutting the formed substrate with the laminate parts that It consists of a number of functional devices, a number of chips. Where each chip consists of At least one functional device In this laser method Modified areas that differ from each other in terms of It is easy to break the substrate 4 apart, it is formed along the contour, making cuts 5a to 5d each. Thus, when the expandable bar is attached to the rear surface of the substrate Stret 4 and enlarged The object to process 1 is cut in stages as a number of chips.Such step-by-step cuts allow consistent tensile stresses to be performed on each part that extends along. Line To perform cutting 5a to 5d, so the insulating film between layers on the cutting line 5a to 5d is cut. With high precision, together with substrate 4, a laser processing method is provided. Which can be laminated parts too High accuracy with substrate When cutting the formed substrate with the laminate parts that It consists of a number of functional devices, a number of chips. Where each chip consists of At least one functional device In this laser method Modified areas that differ from each other in terms of It is easy to break up the substrate 4, it is formed along the cutting line 5a to 5d each, hence when the expansion bar can be attached to the rear surface of the substrate. 4 and enlarged, the object to process 1 is cut step by step into a number of chips One-by-one cut This allows uniform tensile stress to be applied on each section overhang of the cutting line 5a to 5d, so the insulating film between the layers on the cutting line 5a to 5d is cut with the High accuracy with a substrate 4

Claims (9)

1. A laser processing method for projecting a substrate with a preformed surface. Laminate part consisting of a number of functional equipment By laser While aligning the points converge Light in the substrate To form a brush push-up area, which will be the starting point for cutting. Inside the substrate along the line to cut the substrate; The assembly method includes steps of: Forming the first brush bending area along the first cutting line for cutting. A number of substrates and lumpy laminate parts; And forming the second modification area along the second cutting line for cutting the cubes. A number of chips Where each chip consists of at least one functional device; Where the first modified area has a greater probability of breaking the substrate. Second modification area 2. The laser processing method according to claim 1 is also included. Procedures of: Attaching the expansion film to the rear surface of the substrate forming an area. Modify The first and the second; And the expansion of the film to expand For the beginning of substrate cutting And laminate parts Into a lump from the one modifying area that serves as the starting point and then begins cutting the lump from The second modified region that serves as the starting point. 3. Laser processing method according to claim 1 or 2, where the second cutting line is filed. Passed between the lines, making a cut that is nearby. 4. Laser processing method according to claim 1 or 2 where the first and at the cutting line The two are essentially parallel. 5. Laser processing method according to claim 1 or 2, where the first and second cutting lines intersect. 6. Laser processing method according to any one of Clause 1 or 5. Where the substrate is The semiconductor substrate and where the first and second modification regions consist of a melting zone. 7. Laser processing method in accordance with any of Clause 1 or 6. Where the modified area Where one of the protrusions along the cutting line, where one of the substrates has the forming density Differs from the density, the formation of the second modified region in the overhangs along the contour. The second cut in the substrate Which causes the first modified region to break up in the substrate More easily than the second modification area 8. Laser processing method according to any one of Clause 1 or 7. Where the modified area At one of the protrusions along the cutting line, the one in the substrate is different from the size. Of the second modification area in the overhang of the second cutting line in the substrate, which makes the first modification area more prone to splitting in the substrate than the two 9. Laser processing method according to any one of Clause 1 or 8. Where the modified area At one of the protrusions along the cutting line, one of the substrates was formed at a different location from the position where the second modification zone was formed. In the portion filed by Line of line making the second cut in the substrate Which causes the first variant of the pressure region to break out in The substrate comes up more easily than the second modification area 1. 0.Objects to be processed include a substrate. And a piece of laminate that is formed on The front surface of the substrate It consists of a number of functional devices: the compound further: the first modified region formed within the substrate along the cutting line at One for cutting substrates and laminate into a number of cubes; And a second modified area, which has been formed within the substrate along the cutting line at Two for cutting cubes into a number of chips. Where each chip consists of a functional device Minimal one device; Where the first modified area is more likely to cause the substrate to split. Second modification area