TH2101004548A - Photosensitive resin composition and a printed circuit board coated with a photosensitive resin composition. - Google Patents

Photosensitive resin composition and a printed circuit board coated with a photosensitive resin composition.

Info

Publication number
TH2101004548A
TH2101004548A TH2101004548A TH2101004548A TH2101004548A TH 2101004548 A TH2101004548 A TH 2101004548A TH 2101004548 A TH2101004548 A TH 2101004548A TH 2101004548 A TH2101004548 A TH 2101004548A TH 2101004548 A TH2101004548 A TH 2101004548A
Authority
TH
Thailand
Prior art keywords
resin composition
photosensitive resin
circuit board
printed circuit
board coated
Prior art date
Application number
TH2101004548A
Other languages
Thai (th)
Inventor
สึโดเมะนายโทชิคิ ฟูจิอิ นายฮิโรคิ
Original Assignee
ทามูระ คอร์ปอเรชั่น
Filing date
Publication date
Application filed by ทามูระ คอร์ปอเรชั่น filed Critical ทามูระ คอร์ปอเรชั่น
Publication of TH2101004548A publication Critical patent/TH2101004548A/en

Links

TH2101004548A 2021-07-30 Photosensitive resin composition and a printed circuit board coated with a photosensitive resin composition. TH2101004548A (en)

Publications (1)

Publication Number Publication Date
TH2101004548A true TH2101004548A (en) 2023-03-20

Family

ID=

Similar Documents

Publication Publication Date Title
EP3903166A4 (en) Foldable electronic device including flexible printed circuit board
TWI366072B (en) Photosensitive thermosetting resin composition, flattened and resist film coated printed wiring board and method of preparing the same
EP3804479A4 (en) Printed circuit board including bending portion, and electronic device including the same
EP3750966A4 (en) Adhesive composition, thermosetting adhesive sheet, and printed wiring board
EP3919531A4 (en) Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
JP1721807S (en) circuit board
EP3970457A4 (en) An electronic device having a flexible printed circuit board
EP2284611A4 (en) Photosensitive resin composition, photosensitive element, resist pattern manufacturing method, and printed circuit board manufacturing method
EP3778693A4 (en) Curable resin composition, adhesive agent, adhesive film, circuit substrate, interlayer insulating material, and printed wiring board
EP3845575A4 (en) Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
EP3916025A4 (en) Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
TWI800733B (en) Electromagnetic wave shielding film and shielding printed wiring board
EP3950334A4 (en) Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
GB2578820B (en) Printed circuit board and electronic device
TH2101004548A (en) Photosensitive resin composition and a printed circuit board coated with a photosensitive resin composition.
EP3582006A4 (en) Photosensitive resin composition, solder resist film using said photosensitive resin composition, flexible printed wiring board, and image display device
TWI800622B (en) Magnetic printed circuit board and manufacturing method thereof
TWI799479B (en) Printed circuit board and camera module having the same
EP4052546A4 (en) Printed circuit board and electronic device having the same
EP4074740A4 (en) Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
GB202000865D0 (en) Printed circuit board structure
GB2591241B (en) Printed circuit board structure
GB202016309D0 (en) Electronic devices comprising printed circuit boards
TWI853086B (en) Photosensitive resin composition, dry film having photosensitive resin composition, and printed circuit board having photocured product of photosensitive resin composition
GB202101705D0 (en) Printed circuit board substrate comprising a coated boron nitride