SU500948A1 - Flux for soldering and tinning - Google Patents
Flux for soldering and tinningInfo
- Publication number
- SU500948A1 SU500948A1 SU1967530A SU1967530A SU500948A1 SU 500948 A1 SU500948 A1 SU 500948A1 SU 1967530 A SU1967530 A SU 1967530A SU 1967530 A SU1967530 A SU 1967530A SU 500948 A1 SU500948 A1 SU 500948A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- flux
- tinning
- soldering
- methyltetrahydrophthalic
- methyltetrahydrophthalic anhydride
- Prior art date
Links
Landscapes
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Description
Изобретеиие относи1с к об.части пайкн, в частности к флюсам дл иайки и лужени , примен емым преимущественно в процессах пайки, и лужени изделий радно-электронной анпаратуры из меди и никел в электронной и радиотехинческой отрасл х промышленности.The invention relates to parts of soldering, in particular, fluxes for tinning and tinning, used mainly in the processes of soldering, and tinning of products of rado-electronic equipment in copper and nickel in the electronic and radio engineering industries.
Известен флюс дл пайки и лужени , содержащий метилтетрагидрофталевый ангидрид и глицерин.Known flux for soldering and tinning, containing methyltetrahydrophthalic anhydride and glycerin.
Цель изобретени - создание негигросконичного флюса, имеющего нониженное коррозноиное воздействие на основной металл.The purpose of the invention is to create a non-hygroscopic flux having a low corrosive effect on the base metal.
Достигаетс это тем, что в состав флюса на основе метилтетрагидрофталевого ангидрида вход т эноксидную смолу. Состав флюса готов т смещением при температуре 100- 130°С эпоксидной смолы (4-66 вес. %) например ЭД-5, с метилтетрагидрофталевым ангидридом в зависимости от требуемой активности флюса.This is achieved by the fact that the composition of the flux on the basis of methyltetrahydrophthalic anhydride is enoxide resin. The composition of the flux is prepared by displacing at a temperature of 100-130 ° C epoxy resin (4-66 wt.%) For example ED-5, with methyltetrahydrophthalic anhydride, depending on the required activity of the flux.
После получени однородной массы в результате сплавлени сплав охлаждаетс до 45-50°С и затем раствор етс в спирте или хлорироваппых углеводородах, при этом количество флюса спирта берут в соотнощенииAfter obtaining a homogeneous mass as a result of fusion, the alloy is cooled to 45-50 ° C and then dissolved in alcohol or chlorinated hydrocarbons, while the amount of alcohol flux is taken in proportion
1 : 1-2. Папример, дл пайки или лужени медных соединений средней окисленности приготавливают флюс из 25 вес. % смолы ЭД-5 и 75 вес. % метилтетрагидрофталевого ангидрида , затем продукт сплавлени раствор ют в этиловом спирте (1:1) по весу.1: 1-2. For example, for the soldering or tinning of copper compounds of medium oxidation, a flux of 25 wt. % resin ED-5 and 75 wt. % methyltetrahydrophthalic anhydride, then the fusion product is dissolved in ethyl alcohol (1: 1) by weight.
Отмывку от флюса можно проводить в спиртах, кетопах, фреонах, хлорированных углеводородах .Flushing from the flux can be carried out in alcohols, ketopah, freon, chlorinated hydrocarbons.
Дл бытовой аппаратуры флюс не нуждаетс в отмывке.For household appliances, the flux does not need to be washed.
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU1967530A SU500948A1 (en) | 1973-10-23 | 1973-10-23 | Flux for soldering and tinning |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU1967530A SU500948A1 (en) | 1973-10-23 | 1973-10-23 | Flux for soldering and tinning |
Publications (1)
Publication Number | Publication Date |
---|---|
SU500948A1 true SU500948A1 (en) | 1976-01-30 |
Family
ID=20566889
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SU1967530A SU500948A1 (en) | 1973-10-23 | 1973-10-23 | Flux for soldering and tinning |
Country Status (1)
Country | Link |
---|---|
SU (1) | SU500948A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7357291B2 (en) * | 2002-01-30 | 2008-04-15 | Showa Denko K.K. | Solder metal, soldering flux and solder paste |
-
1973
- 1973-10-23 SU SU1967530A patent/SU500948A1/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7357291B2 (en) * | 2002-01-30 | 2008-04-15 | Showa Denko K.K. | Solder metal, soldering flux and solder paste |
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