SU293602A1 - MATERIAL FOR SEALING TEETH - Google Patents
MATERIAL FOR SEALING TEETHInfo
- Publication number
- SU293602A1 SU293602A1 SU1348743A SU1348743A SU293602A1 SU 293602 A1 SU293602 A1 SU 293602A1 SU 1348743 A SU1348743 A SU 1348743A SU 1348743 A SU1348743 A SU 1348743A SU 293602 A1 SU293602 A1 SU 293602A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- powder
- copper
- tin
- mrtu
- silver
- Prior art date
Links
- 239000000463 material Substances 0.000 title claims description 13
- 238000007789 sealing Methods 0.000 title 1
- 239000000843 powder Substances 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 6
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 5
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 5
- 229910052733 gallium Inorganic materials 0.000 claims description 5
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 4
- 239000006023 eutectic alloy Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 238000005260 corrosion Methods 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical class [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 claims 1
- 239000000470 constituent Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 239000011135 tin Substances 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 description 2
- 230000000844 anti-bacterial Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Description
Изобретение относитс к области ортопедической стоматологии и касаетс материалов дл пломбировани зубов.This invention relates to the field of prosthetic dentistry and concerns materials for dental fillings.
Известен материал дл пломбировани зубов , содержащий жидкий галлий или его эвтектические сплавы и мелкодисперсный порошок никел . Указанный материал, вл сь достаточно удовлетворительным по своим физико-механическим свойствам, не обладает удовлетворительной коррозионной устойчивостью и не вл етс бактерицидным.A known tooth-filling material containing liquid gallium or its eutectic alloys and fine nickel powder. This material, being sufficiently satisfactory in its physicomechanical properties, does not possess satisfactory corrosion resistance and is not bactericidal.
Целью изобретени вл етс улучшение коррозионной стойкости, а также увеличение пластичности свежезамешанного материала. Дл этого, кроме указанных компонентов, в состав материала введен порошок сплава серебра, меди и олова (МРТУ-42, № 5054-64).The aim of the invention is to improve the corrosion resistance, as well as to increase the plasticity of the freshly mixed material. For this, in addition to the above components, a powder of an alloy of silver, copper, and tin (MRTU-42, No. 5054-64) is introduced into the composition of the material.
Компоненты, составл юш,ие предлагаемый материал, берут в следуюш,их соотношени х, %: жидкий галлий или его эвтектические сплавы 30-65, мелкодисперсный порошок нике . 2-30, порошок сплава серебра, меди и олова (МРТУ-42 № 5054-64) 5-68.The components, ush, and the proposed material, are taken as follows, their ratios,%: liquid gallium or its eutectic alloys 30-65, fine powder Nike. 2-30, powder of an alloy of silver, copper and tin (MRTU-42 No. 5054-64) 5-68.
Техника приготовлени материала не отличаетс от методики, используемой дл известного материала на основе жидкого галли .The material preparation technique is not different from the technique used for the known material based on liquid gallium.
При изготовлении материала, содержащего 32% жидкого эвтектического сплава галли с оловом, 62% сплава серебра, меди и олова и 6% порошка никел , врем схватывани составл ет 10-15 мин. Через сутки предел прочности при равен 2000 кг/см-, а твердость по Роквеллу - 50-60 ед.In the manufacture of material containing 32% liquid eutectic gallium-tin alloy, 62% silver, copper and tin alloy and 6% nickel powder, the setting time is 10-15 minutes. A day later, the tensile strength at 2000 kg / cm is equal, and Rockwell hardness is 50-60 units.
Предмет изобретени Subject invention
10ten
Claims (2)
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU293602A1 true SU293602A1 (en) |
Family
ID=
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4398975A (en) * | 1980-12-25 | 1983-08-16 | Sony Corporation | Conductive paste |
| US5593082A (en) * | 1994-11-15 | 1997-01-14 | Tosoh Smd, Inc. | Methods of bonding targets to backing plate members using solder pastes and target/backing plate assemblies bonded thereby |
| US5653856A (en) * | 1994-11-15 | 1997-08-05 | Tosoh Smd, Inc. | Methods of bonding targets to backing plate members using gallium based solder pastes and target/backing plate assemblies bonded thereby |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4398975A (en) * | 1980-12-25 | 1983-08-16 | Sony Corporation | Conductive paste |
| US5593082A (en) * | 1994-11-15 | 1997-01-14 | Tosoh Smd, Inc. | Methods of bonding targets to backing plate members using solder pastes and target/backing plate assemblies bonded thereby |
| US5653856A (en) * | 1994-11-15 | 1997-08-05 | Tosoh Smd, Inc. | Methods of bonding targets to backing plate members using gallium based solder pastes and target/backing plate assemblies bonded thereby |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4064629A (en) | Cavity liner for dental restorations | |
| SU293602A1 (en) | MATERIAL FOR SEALING TEETH | |
| US3954457A (en) | Dental amalgam | |
| DK160285B (en) | HANDLING AMALGAM COMPOSITION FOR DENTAL USE | |
| US4008073A (en) | Alloy powder for the production of dental amalgam | |
| US4039329A (en) | Dental powder composite and amalgam | |
| JPS6167731A (en) | Dental alloy powder for kneading and filling material | |
| EP0033628A2 (en) | A product to be used in dental amalgams | |
| KR910003552B1 (en) | Dental metallic paste | |
| US249880A (en) | William g | |
| SU310661A1 (en) | MATERIAL FOR SEALING TEETH ^ | |
| US4453977A (en) | Low silver containing dental amalgam alloys | |
| SU243783A1 (en) | MATERIAL FOR SEALING TEETH | |
| US6190606B1 (en) | Solid amalgamating compositions for the preparation of dental amalgams, amalgam forming compositions containing them, methods for producing dental amalgams with them and dental amalgams produced thereby | |
| JPS60135550A (en) | Dental metallic material | |
| US3141761A (en) | Pulverized silver alloys for use in producing dental amalgams | |
| US3901693A (en) | Method of preparing dental restorative material | |
| JPH0321613B2 (en) | ||
| RU2024251C1 (en) | Tooth-stopping material | |
| JPH03294449A (en) | Dental metallic material | |
| JPS6324059B2 (en) | ||
| JPS633016B2 (en) | ||
| US4078921A (en) | Method for eliminating gamma2 phase from dental amalgam and improved dental amalgam composition | |
| JPS633015B2 (en) | ||
| JPS62228441A (en) | Selenium-containing alloy for dental amalgam |