SU105863A1 - Paste for soldering and tinning - Google Patents
Paste for soldering and tinningInfo
- Publication number
- SU105863A1 SU105863A1 SU560631A SU560631A SU105863A1 SU 105863 A1 SU105863 A1 SU 105863A1 SU 560631 A SU560631 A SU 560631A SU 560631 A SU560631 A SU 560631A SU 105863 A1 SU105863 A1 SU 105863A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- paste
- soldering
- tinning
- ammonium chloride
- alcohol
- Prior art date
Links
- 238000005476 soldering Methods 0.000 title description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 4
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 3
- 235000019270 ammonium chloride Nutrition 0.000 description 3
- QDHHCQZDFGDHMP-UHFFFAOYSA-N monochloramine Chemical compound ClN QDHHCQZDFGDHMP-UHFFFAOYSA-N 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N HCl Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Tris Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- BVDRUCCQKHGCRX-UHFFFAOYSA-N 2,3-dihydroxypropyl formate Chemical compound OCC(O)COC=O BVDRUCCQKHGCRX-UHFFFAOYSA-N 0.000 description 1
- 241000277342 Esox lucius Species 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000001680 brushing Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 235000015927 pasta Nutrition 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Description
Известны припои в виде пасты, состо щие из иорошкообразного приио и флюсующей части, в состав которых вход т глицерин, спирт, этаиоламип п пашатырь. Однако эти пасты-припои после л жени вызывают ускореппую коррозию .Solders in the form of a paste are known, which consist of a powdery, priio and fluxing part, which include glycerin, alcohol, ethanol, and pasacate. However, these solder-based solders after acceleration cause rapid corrosion.
Описываслга паста не имеет этого недостатка. Оптима.тьный состав насты д,1Я ,11уже1и-1Я и пайки следуюнтий: 30% спирта-сырца, 45% технического г.тицерипа, 18%i насыщенного водного раствора хлористого аммони , 5% сол ргокислого апалина и 2% триэтаноламипа.Description of pasta does not have this disadvantage. Optima.tyn composition nasta d, 1I, 11-1I and soldering the following: 30% raw alcohol, 45% technical griteripa, 18% i saturated aqueous solution of ammonium chloride, 5% hydrochloric acid apaline and 2% triethanolamine.
Паста готовитс смеиюнием жидкой части с порошкообразным приноем ИЛИ ОЛОВОМ в соотноншнии 1:6. При унотреблении паста разбавл етс водой до консистенции удобной ДЛЯ нанесени ее кистью на место пайки.The paste is prepared by blending the liquid portion with a powdered powder OR TIN in a 1: 6 ratio. When used, the paste is diluted with water to a consistency convenient for brushing it onto the place of soldering.
Паста при оплавлеппи дает прочный блест щий припой и равномерно распредел етс тонким слоем в месте пайкп без корродирующего в().1: па об.чу к11вае:.10е пли па емое изделие.When melted, the paste gives a durable shiny solder and is evenly distributed with a thin layer in the place of the pike without corroding in (). 1: pas about 11 h: 11.
ПрEtc
е д м е т п 3 о о р е т е и и e d eme n 3 o rote e and u
Паста ДЛЯ пайки и .лужепп , состо ига из порошкообразного пригго п.тп о.това и флюса, содержащего спирт, глицерип, хлористый аммоииГ; п триэтанолампн, о т л ич а ю HI, а с тем, что дл получени равномерпо распредел ющейс па поверхности насты, не корродируюи ,ей изделие, в состав флюса вход т; спирта-сырца-30%, глицерина технического-45%, водный раствор насыпхенного хлористого аммонн -18%), СОЛЯНОКИСЛОГО апалина-5% , трнэтаиоламипа-2%.Paste FOR soldering and fluff, the condition of the yoke of powdered prigotov p.tp o.tova and flux containing alcohol, glyceride, ammonium chloride; n triethanolamine, tl i h ay HI, and with the fact that to obtain an uniformly distributed on the surface of the crust, not corrode, her product, the flux composition includes; raw alcohol-30%, technical glycerol-45%, an aqueous solution of ammonium chloride milled -18%), SALT-APPALINA-5%, trn-thiolamip-2%.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU560631A SU105863A1 (en) | 1956-11-12 | 1956-11-12 | Paste for soldering and tinning |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU560631A SU105863A1 (en) | 1956-11-12 | 1956-11-12 | Paste for soldering and tinning |
Publications (1)
Publication Number | Publication Date |
---|---|
SU105863A1 true SU105863A1 (en) | 1956-11-30 |
Family
ID=48379222
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SU560631A SU105863A1 (en) | 1956-11-12 | 1956-11-12 | Paste for soldering and tinning |
Country Status (1)
Country | Link |
---|---|
SU (1) | SU105863A1 (en) |
-
1956
- 1956-11-12 SU SU560631A patent/SU105863A1/en active
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