SG180121A1 - Light-emitting device and method for manufacturing the same - Google Patents

Light-emitting device and method for manufacturing the same

Info

Publication number
SG180121A1
SG180121A1 SG2011076494A SG2011076494A SG180121A1 SG 180121 A1 SG180121 A1 SG 180121A1 SG 2011076494 A SG2011076494 A SG 2011076494A SG 2011076494 A SG2011076494 A SG 2011076494A SG 180121 A1 SG180121 A1 SG 180121A1
Authority
SG
Singapore
Prior art keywords
manufacturing
light
same
emitting device
method
Prior art date
Application number
SG2011076494A
Inventor
Shigenobu Sekine
Yurina Sekine
Yoshiharu Kuwana
Kazutoshi Kamibayashi
Original Assignee
Napra Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2010234459A priority Critical patent/JP4778107B1/en
Application filed by Napra Co Ltd filed Critical Napra Co Ltd
Publication of SG180121A1 publication Critical patent/SG180121A1/en

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers
    • H01L33/486Containers adapted for surface mounting
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • H01L2933/0066Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

Abstract

to the ends of the first and second through electrode inside the support substrate.Fig. 1
SG2011076494A 2010-10-19 2011-10-19 Light-emitting device and method for manufacturing the same SG180121A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010234459A JP4778107B1 (en) 2010-10-19 2010-10-19 Light emitting device and manufacturing method thereof

Publications (1)

Publication Number Publication Date
SG180121A1 true SG180121A1 (en) 2012-05-30

Family

ID=44798064

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2011076494A SG180121A1 (en) 2010-10-19 2011-10-19 Light-emitting device and method for manufacturing the same

Country Status (7)

Country Link
US (1) US8766312B2 (en)
EP (1) EP2445006B1 (en)
JP (1) JP4778107B1 (en)
KR (1) KR101193280B1 (en)
CN (1) CN102456827B (en)
SG (1) SG180121A1 (en)
TW (1) TWI420707B (en)

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US8573469B2 (en) 2011-11-18 2013-11-05 LuxVue Technology Corporation Method of forming a micro LED structure and array of micro LED structures with an electrically insulating layer
US8426227B1 (en) 2011-11-18 2013-04-23 LuxVue Technology Corporation Method of forming a micro light emitting diode array
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KR101886156B1 (en) * 2012-08-21 2018-09-11 엘지이노텍 주식회사 Light emitting device
JP5701921B2 (en) * 2013-03-21 2015-04-15 有限会社 ナプラ Light emitting element
JP5490949B1 (en) * 2013-08-08 2014-05-14 有限会社 ナプラ Wiring board and manufacturing method thereof
DE102013111496A1 (en) * 2013-10-18 2015-04-23 Osram Opto Semiconductors Gmbh Method for producing optoelectronic semiconductor components and optoelectronic semiconductor component
KR102075981B1 (en) 2014-02-21 2020-02-11 삼성전자주식회사 Method for manufacturing light emitting diode package
KR20150144401A (en) * 2014-06-16 2015-12-28 삼성전기주식회사 Method for manufacturing semiconductor light emitting device package
JP6413460B2 (en) * 2014-08-08 2018-10-31 日亜化学工業株式会社 Light emitting device and light emitting device manufacturing method
US9704823B2 (en) * 2015-03-21 2017-07-11 Nxp B.V. Reduction of defects in wafer level chip scale package (WLCSP) devices
CN104900638B (en) * 2015-05-27 2017-10-24 深圳市华星光电技术有限公司 Light-emitting component package assembly
DE102015108545A1 (en) 2015-05-29 2016-12-01 Osram Opto Semiconductors Gmbh Optoelectronic component and method for producing an optoelectronic component
DE102015109413A1 (en) * 2015-06-12 2016-12-15 Osram Opto Semiconductors Gmbh Process for the production of optoelectronic conversion semiconductor chips and combination of conversion semiconductor chips
DE102015115722A1 (en) * 2015-09-17 2017-03-23 Osram Opto Semiconductors Gmbh Carrier for a device, component and method for producing a carrier or a component
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US10211384B2 (en) 2016-03-28 2019-02-19 Samsung Electronics Co., Ltd. Light emitting diode apparatus and manufacturing method thereof
US20190189682A1 (en) * 2017-12-20 2019-06-20 Lumileds Llc Monolithic segmented led array architecture with transparent common n-contact

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Also Published As

Publication number Publication date
EP2445006A3 (en) 2013-08-28
JP4778107B1 (en) 2011-09-21
CN102456827A (en) 2012-05-16
JP2012089646A (en) 2012-05-10
US8766312B2 (en) 2014-07-01
US20120091481A1 (en) 2012-04-19
EP2445006B1 (en) 2015-07-01
KR101193280B1 (en) 2012-10-19
CN102456827B (en) 2015-03-11
EP2445006A2 (en) 2012-04-25
TWI420707B (en) 2013-12-21
TW201232822A (en) 2012-08-01
KR20120040664A (en) 2012-04-27

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