SG113404A1 - Inertial temperature control system and method - Google Patents

Inertial temperature control system and method

Info

Publication number
SG113404A1
SG113404A1 SG200200733A SG200200733A SG113404A1 SG 113404 A1 SG113404 A1 SG 113404A1 SG 200200733 A SG200200733 A SG 200200733A SG 200200733 A SG200200733 A SG 200200733A SG 113404 A1 SG113404 A1 SG 113404A1
Authority
SG
Singapore
Prior art keywords
control system
temperature control
inertial temperature
inertial
temperature
Prior art date
Application number
SG200200733A
Other languages
English (en)
Inventor
L Starner Alan
Original Assignee
Asml Us Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Us Inc filed Critical Asml Us Inc
Publication of SG113404A1 publication Critical patent/SG113404A1/en

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B11/00—Automatic controllers
    • G05B11/01—Automatic controllers electric
    • G05B11/36—Automatic controllers electric with provision for obtaining particular characteristics, e.g. proportional, integral, differential
    • G05B11/42—Automatic controllers electric with provision for obtaining particular characteristics, e.g. proportional, integral, differential for obtaining a characteristic which is both proportional and time-dependent, e.g. P. I., P. I. D.
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H05B1/0233—Industrial applications for semiconductors manufacturing
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/1927—Control of temperature characterised by the use of electric means using a plurality of sensors
    • G05D23/193—Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces
    • G05D23/1935—Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces using sequential control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Remote Sensing (AREA)
  • Control Of Temperature (AREA)
SG200200733A 2001-02-06 2002-02-06 Inertial temperature control system and method SG113404A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US26692601P 2001-02-06 2001-02-06

Publications (1)

Publication Number Publication Date
SG113404A1 true SG113404A1 (en) 2005-08-29

Family

ID=23016553

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200200733A SG113404A1 (en) 2001-02-06 2002-02-06 Inertial temperature control system and method

Country Status (7)

Country Link
US (1) US6901317B2 (ko)
EP (1) EP1239357A3 (ko)
JP (1) JP2002328728A (ko)
KR (1) KR100441046B1 (ko)
CN (1) CN1372175A (ko)
SG (1) SG113404A1 (ko)
TW (1) TW522292B (ko)

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US7427329B2 (en) * 2002-05-08 2008-09-23 Asm International N.V. Temperature control for single substrate semiconductor processing reactor
EP2790210A3 (en) 2002-06-19 2014-12-31 Murata Machinery, Ltd. Automated material handling system
KR20120026129A (ko) 2002-10-11 2012-03-16 무라다기카이가부시끼가이샤 오버헤드 호이스트를 탑재한 오버헤드 호이스트 수송 차량
JP3850413B2 (ja) * 2004-02-16 2006-11-29 株式会社ソニー・コンピュータエンタテインメント 電子デバイス冷却装置、電子デバイス冷却方法、電子デバイス冷却制御プログラム及びそれを格納した記録媒体
US20050247266A1 (en) * 2004-05-04 2005-11-10 Patel Nital S Simultaneous control of deposition time and temperature of multi-zone furnaces
US7770806B2 (en) * 2007-06-19 2010-08-10 Nordyne Inc. Temperature control in variable-capacity HVAC system
TWI380144B (en) * 2008-04-09 2012-12-21 Inotera Memories Inc Method of fuzzy control for semiconductor machine
JP5274213B2 (ja) * 2008-11-14 2013-08-28 株式会社日立国際電気 基板処理装置および半導体装置の製造方法、温度制御方法
US9289002B2 (en) * 2010-06-02 2016-03-22 National Pasteurized Eggs, Inc. Shell egg pasteurization method
CN101893906A (zh) * 2010-07-08 2010-11-24 北京七星华创电子股份有限公司 温度控制系统及方法
WO2012127383A1 (en) 2011-03-18 2012-09-27 Ecolab Usa Inc. Heat system for killing pests
CN102354244B (zh) * 2011-06-16 2013-10-02 北京七星华创电子股份有限公司 半导体热处理工艺温度前馈补偿方法
US20130269539A1 (en) * 2011-09-17 2013-10-17 B. Robert Polt Variable Temperature Cooking Method and Apparatus
CN104752249A (zh) * 2013-12-27 2015-07-01 中芯国际集成电路制造(上海)有限公司 侦测炉管加热器状态的方法
JP6324739B2 (ja) * 2014-01-27 2018-05-16 株式会社Kelk 半導体ウェーハの温度制御装置、及び半導体ウェーハの温度制御方法
KR101605717B1 (ko) * 2014-07-16 2016-03-23 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
CN104980534B (zh) * 2014-09-17 2018-01-19 广东欧珀移动通信有限公司 一种移动终端的外壳温度调整装置及方法
CN109043667B (zh) * 2018-07-13 2021-05-14 深圳麦克韦尔科技有限公司 低温卷烟设备、存储装置、温度控制装置及其方法
CN109324646B (zh) * 2018-12-05 2021-07-30 上海亚泰仪表有限公司 一种小振幅快速温度控制装置及方法
TWI809475B (zh) * 2020-08-12 2023-07-21 美商瓦特洛威電子製造公司 用於提供針對電氣加熱器的可變調降控制之方法及系統
EP4113222A1 (de) * 2021-06-28 2023-01-04 Brabender GmbH & Co. KG Verfahren und steuer- und/oder regeleinheit zum bereitstellen eines zeitlichen verlaufs eines messparameters sowie entsprechende messvorrichtung
CN114510088B (zh) * 2022-02-18 2023-08-15 安徽庆宇光电科技有限公司 一种小型恒温控制系统及其在线空气检测仪
US20230350438A1 (en) * 2022-04-29 2023-11-02 Semes Co., Ltd. Process measurement apparatus and method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4807144A (en) * 1986-12-02 1989-02-21 Glasstech International L.P. Temperature control system for glass sheet furnace
US4845332A (en) * 1987-09-16 1989-07-04 National Steel Corp. Galvanneal induction furnace temperature control system
US4952227A (en) * 1989-05-22 1990-08-28 Libbey-Owens-Ford Co. Apparatus for processing glass

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US4782215A (en) * 1986-12-10 1988-11-01 Robertshaw Controls Company Control unit and method of making the same
US4842686A (en) * 1987-07-17 1989-06-27 Texas Instruments Incorporated Wafer processing apparatus and method
US4991770A (en) * 1990-03-27 1991-02-12 Honeywell Inc. Thermostat with means for disabling PID control
JP2816054B2 (ja) * 1992-06-25 1998-10-27 三洋電機株式会社 恒温庫の温度制御装置
JPH06187005A (ja) * 1992-12-22 1994-07-08 Fuji Electric Co Ltd 時間切替式２自由度ｐｉｄ制御装置
US5561612A (en) * 1994-05-18 1996-10-01 Micron Technology, Inc. Control and 3-dimensional simulation model of temperature variations in a rapid thermal processing machine
JPH086648A (ja) * 1994-06-17 1996-01-12 Hitachi Ltd 温度制御装置
JP3334356B2 (ja) * 1994-09-09 2002-10-15 株式会社明電舎 自動温度制御装置
US5618351A (en) 1995-03-03 1997-04-08 Silicon Valley Group, Inc. Thermal processing apparatus and process
JP3380668B2 (ja) * 1996-01-23 2003-02-24 東京エレクトロン株式会社 温度調整方法、温度調整装置及び熱処理装置
US6133550A (en) 1996-03-22 2000-10-17 Sandia Corporation Method and apparatus for thermal processing of semiconductor substrates
US5963840A (en) * 1996-11-13 1999-10-05 Applied Materials, Inc. Methods for depositing premetal dielectric layer at sub-atmospheric and high temperature conditions
US5994675A (en) 1997-03-07 1999-11-30 Semitool, Inc. Semiconductor processing furnace heating control system
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US6059567A (en) 1998-02-10 2000-05-09 Silicon Valley Group, Inc. Semiconductor thermal processor with recirculating heater exhaust cooling system
TW446995B (en) * 1998-05-11 2001-07-21 Semitool Inc Temperature control system for a thermal reactor
JP3278807B2 (ja) * 1998-10-14 2002-04-30 オムロン株式会社 制御装置、温度調節器および熱処理装置
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JP2000305632A (ja) * 1999-04-20 2000-11-02 Fujitsu General Ltd ペルチェ素子の温度制御方式
JP4192394B2 (ja) * 2000-04-14 2008-12-10 オムロン株式会社 温度調節器
JP3925078B2 (ja) * 2000-11-20 2007-06-06 オムロン株式会社 制御装置、温度調節器および熱処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4807144A (en) * 1986-12-02 1989-02-21 Glasstech International L.P. Temperature control system for glass sheet furnace
US4845332A (en) * 1987-09-16 1989-07-04 National Steel Corp. Galvanneal induction furnace temperature control system
US4952227A (en) * 1989-05-22 1990-08-28 Libbey-Owens-Ford Co. Apparatus for processing glass

Also Published As

Publication number Publication date
EP1239357A2 (en) 2002-09-11
US6901317B2 (en) 2005-05-31
KR100441046B1 (ko) 2004-07-19
KR20020065398A (ko) 2002-08-13
TW522292B (en) 2003-03-01
JP2002328728A (ja) 2002-11-15
CN1372175A (zh) 2002-10-02
US20020143426A1 (en) 2002-10-03
EP1239357A3 (en) 2002-09-25

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