SG112921A1 - Protective tape joining method and apparatus using the same as well as protective tape separating method and apparatus using the same - Google Patents

Protective tape joining method and apparatus using the same as well as protective tape separating method and apparatus using the same

Info

Publication number
SG112921A1
SG112921A1 SG200406243A SG200406243A SG112921A1 SG 112921 A1 SG112921 A1 SG 112921A1 SG 200406243 A SG200406243 A SG 200406243A SG 200406243 A SG200406243 A SG 200406243A SG 112921 A1 SG112921 A1 SG 112921A1
Authority
SG
Singapore
Prior art keywords
same
protective tape
well
joining method
separating method
Prior art date
Application number
SG200406243A
Other languages
English (en)
Inventor
Yamamoto Masayuki
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of SG112921A1 publication Critical patent/SG112921A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0004—Component parts, details or accessories; Auxiliary operations
    • B29C63/0013—Removing old coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2793/00—Shaping techniques involving a cutting or machining operation
    • B29C2793/009—Shaping techniques involving a cutting or machining operation after shaping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • H01L2221/6839—Separation by peeling using peeling wedge or knife or bar
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y10T156/1093—All laminae planar and face to face with covering of discrete laminae with additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1744—Means bringing discrete articles into assembled relationship
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1906—Delaminating means responsive to feed or shape at delamination

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG200406243A 2003-12-15 2004-10-21 Protective tape joining method and apparatus using the same as well as protective tape separating method and apparatus using the same SG112921A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003416740A JP2005175384A (ja) 2003-12-15 2003-12-15 保護テープの貼付方法及び剥離方法

Publications (1)

Publication Number Publication Date
SG112921A1 true SG112921A1 (en) 2005-07-28

Family

ID=34650641

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200406243A SG112921A1 (en) 2003-12-15 2004-10-21 Protective tape joining method and apparatus using the same as well as protective tape separating method and apparatus using the same

Country Status (6)

Country Link
US (1) US20050126694A1 (zh)
JP (1) JP2005175384A (zh)
KR (1) KR100639587B1 (zh)
CN (1) CN100459055C (zh)
SG (1) SG112921A1 (zh)
TW (1) TWI371789B (zh)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4297829B2 (ja) * 2004-04-23 2009-07-15 リンテック株式会社 吸着装置
JP2006100413A (ja) * 2004-09-28 2006-04-13 Tokyo Seimitsu Co Ltd フィルム貼付方法およびフィルム貼付装置
JP4705418B2 (ja) * 2005-06-29 2011-06-22 株式会社ディスコ ウェーハの加工方法
JP4461176B2 (ja) * 2005-08-11 2010-05-12 リンテック株式会社 シート貼付装置及び貼付方法
JP2007110014A (ja) * 2005-10-17 2007-04-26 Lintec Corp シート剥離装置及び剥離方法
CN100392754C (zh) * 2005-11-23 2008-06-04 深圳易拓科技有限公司 磨胶机
JP4953764B2 (ja) * 2005-11-29 2012-06-13 株式会社東京精密 剥離テープ貼付方法および剥離テープ貼付装置
JP4606319B2 (ja) * 2005-12-19 2011-01-05 日東電工株式会社 復旧支援装置
JP4796430B2 (ja) * 2006-04-19 2011-10-19 株式会社ディスコ 保護テープ貼着方法
JP4666514B2 (ja) * 2006-07-20 2011-04-06 リンテック株式会社 シート剥離装置及び剥離方法
JP4761207B2 (ja) * 2006-07-21 2011-08-31 株式会社東京精密 ウェーハ収納方法
JP4711904B2 (ja) * 2006-07-31 2011-06-29 日東電工株式会社 半導体ウエハへの粘着テープ貼付け方法および半導体ウエハからの保護テープ剥離方法
JP4992362B2 (ja) * 2006-09-22 2012-08-08 カシオ計算機株式会社 フィルム剥離方法およびその装置
KR100876155B1 (ko) * 2006-11-28 2008-12-26 삼성전자주식회사 웨이퍼 보호테이프 커팅장치, 백 래핑설비 및 이를 사용한웨이퍼 보호테이프 커팅방법
JP4693817B2 (ja) 2007-07-02 2011-06-01 日東電工株式会社 半導体ウエハへの粘着テープ貼付け方法および保護テープの剥離方法
JP5235509B2 (ja) * 2008-06-04 2013-07-10 株式会社東京精密 ウェーハ位置決め装置およびウェーハ位置決め装置におけるテーブル
JP5378089B2 (ja) * 2009-07-16 2013-12-25 株式会社ディスコ 保護テープ剥離装置
US8574398B2 (en) 2010-05-27 2013-11-05 Suss Microtec Lithography, Gmbh Apparatus and method for detaping an adhesive layer from the surface of ultra thin wafers
JP5808544B2 (ja) * 2011-02-08 2015-11-10 リンテック株式会社 シート剥離装置及び剥離方法
JP2013191746A (ja) * 2012-03-14 2013-09-26 Toshiba Corp 半導体装置の製造方法、半導体製造装置
JP5969334B2 (ja) * 2012-09-13 2016-08-17 株式会社ディスコ 加工装置及び加工方法
JP6062210B2 (ja) * 2012-10-31 2017-01-18 株式会社日立プラントメカニクス フィルム剥離装置
JP5554430B2 (ja) * 2013-03-06 2014-07-23 リンテック株式会社 シート剥離装置及び剥離方法並びにシート剥離用プレート部材
JP6189700B2 (ja) * 2013-10-03 2017-08-30 株式会社ディスコ ウエーハの加工方法
JP6271380B2 (ja) * 2014-09-12 2018-01-31 アルパッド株式会社 半導体装置の製造装置と半導体装置の製造方法
JP6614865B2 (ja) * 2015-09-01 2019-12-04 リンテック株式会社 シート貼付装置およびシート貼付方法
US10276423B2 (en) 2017-02-16 2019-04-30 Panasonic Intellectual Property Management Co., Ltd. Method of manufacturing element chip
JP2018133496A (ja) * 2017-02-16 2018-08-23 パナソニックＩｐマネジメント株式会社 素子チップの製造方法
JP7149065B2 (ja) * 2017-11-21 2022-10-06 リンテック株式会社 シート剥離装置および剥離方法
JP7075307B2 (ja) * 2018-08-09 2022-05-25 株式会社ディスコ テープ剥離方法
EP3636423A1 (en) * 2018-10-09 2020-04-15 Essilor International (Compagnie Generale D'optique) Method for manufacturing an optical element with a functional film
CN113165121B (zh) * 2019-03-26 2023-12-05 琳得科株式会社 半导体装置的制造方法以及层叠体
CN112061829B (zh) * 2020-08-31 2022-04-01 苏州天立达精密科技股份有限公司 全自动aoi圆刀片材检测机
TWI806502B (zh) * 2022-03-18 2023-06-21 萬潤科技股份有限公司 散熱膠墊貼合方法、裝置及設備

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US6031242A (en) * 1998-01-23 2000-02-29 Zevatech, Inc. Semiconductor die in-flight registration and orientation method and apparatus
EP0932149B1 (en) * 1998-01-27 2006-09-06 Kitano Co., Ltd. Method of and apparatus for laminating disc-shaped substrates
JP2000114204A (ja) * 1998-10-01 2000-04-21 Mitsubishi Electric Corp ウエハシート及びこれを用いた半導体装置の製造方法並びに半導体製造装置
JP3504543B2 (ja) * 1999-03-03 2004-03-08 株式会社日立製作所 半導体素子の分離方法およびその装置並びに半導体素子の搭載方法
KR100391983B1 (ko) * 2001-07-03 2003-07-22 삼성전자주식회사 반도체 노광 장비의 정렬 시스템
JP2003124146A (ja) * 2001-10-11 2003-04-25 Lintec Corp 保護シート剥離方法及び装置
JP3612317B2 (ja) * 2001-11-30 2005-01-19 株式会社東芝 半導体装置の製造方法
JP3880397B2 (ja) * 2001-12-27 2007-02-14 日東電工株式会社 保護テープの貼付・剥離方法
US20040080730A1 (en) * 2002-10-29 2004-04-29 Michael Binnard System and method for clamping a device holder with reduced deformation

Also Published As

Publication number Publication date
CN1649102A (zh) 2005-08-03
CN100459055C (zh) 2009-02-04
KR100639587B1 (ko) 2006-10-30
TW200527526A (en) 2005-08-16
JP2005175384A (ja) 2005-06-30
US20050126694A1 (en) 2005-06-16
TWI371789B (en) 2012-09-01
KR20050059996A (ko) 2005-06-21

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