SG11202112348PA - Method for evaluating pickup performance, integrated dicing/die-bonding film, method for evaluating and selecting integrated dicing/die-bonding film, and method for manufacturing semiconductor device - Google Patents

Method for evaluating pickup performance, integrated dicing/die-bonding film, method for evaluating and selecting integrated dicing/die-bonding film, and method for manufacturing semiconductor device

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Publication number
SG11202112348PA
SG11202112348PA SG11202112348PA SG11202112348PA SG11202112348PA SG 11202112348P A SG11202112348P A SG 11202112348PA SG 11202112348P A SG11202112348P A SG 11202112348PA SG 11202112348P A SG11202112348P A SG 11202112348PA SG 11202112348P A SG11202112348P A SG 11202112348PA
Authority
SG
Singapore
Prior art keywords
evaluating
die
bonding film
integrated dicing
semiconductor device
Prior art date
Application number
SG11202112348PA
Other languages
English (en)
Inventor
Tsuyoshi Tazawa
Naohiro Kimura
Keisuke Ohkubo
Yoshinobu Ozaki
Original Assignee
Showa Denko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Materials Co Ltd filed Critical Showa Denko Materials Co Ltd
Publication of SG11202112348PA publication Critical patent/SG11202112348PA/en

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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
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    • H01L22/10—Measuring as part of the manufacturing process
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N19/00—Investigating materials by mechanical methods
    • G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
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SG11202112348PA 2019-05-10 2019-05-10 Method for evaluating pickup performance, integrated dicing/die-bonding film, method for evaluating and selecting integrated dicing/die-bonding film, and method for manufacturing semiconductor device SG11202112348PA (en)

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