SG11202008967WA - Epoxy resin composition and electronic component device - Google Patents

Epoxy resin composition and electronic component device

Info

Publication number
SG11202008967WA
SG11202008967WA SG11202008967WA SG11202008967WA SG11202008967WA SG 11202008967W A SG11202008967W A SG 11202008967WA SG 11202008967W A SG11202008967W A SG 11202008967WA SG 11202008967W A SG11202008967W A SG 11202008967WA SG 11202008967W A SG11202008967W A SG 11202008967WA
Authority
SG
Singapore
Prior art keywords
resin composition
epoxy resin
electronic component
component device
epoxy
Prior art date
Application number
SG11202008967WA
Other languages
English (en)
Inventor
Dongchul Kang
Masashi Yamaura
Kenta Ishibashi
Takuya Kodama
Keichi Hori
Mika Tanaka
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of SG11202008967WA publication Critical patent/SG11202008967WA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
SG11202008967WA 2018-03-16 2019-03-11 Epoxy resin composition and electronic component device SG11202008967WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018049153 2018-03-16
PCT/JP2019/009705 WO2019176859A1 (ja) 2018-03-16 2019-03-11 エポキシ樹脂組成物、及び電子部品装置

Publications (1)

Publication Number Publication Date
SG11202008967WA true SG11202008967WA (en) 2020-10-29

Family

ID=67908239

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202008967WA SG11202008967WA (en) 2018-03-16 2019-03-11 Epoxy resin composition and electronic component device

Country Status (7)

Country Link
US (1) US20210061986A1 (ja)
JP (2) JP7351291B2 (ja)
KR (1) KR20200132871A (ja)
CN (1) CN111868169B (ja)
SG (1) SG11202008967WA (ja)
TW (1) TW201945460A (ja)
WO (1) WO2019176859A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11261379B1 (en) * 2019-08-23 2022-03-01 B/E Aerospace, Inc. Fire-retardant potting compound for backlit devices
JP6907393B1 (ja) * 2020-08-05 2021-07-21 信越化学工業株式会社 熱硬化性樹脂組成物及び半導体装置
CN116134084A (zh) * 2020-09-03 2023-05-16 株式会社力森诺科 复合物、成形体及复合物的固化物

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2947072B2 (ja) * 1994-05-25 1999-09-13 信越化学工業株式会社 表面処理アルミナの製造方法
JP3478315B2 (ja) 1995-12-06 2003-12-15 日立化成工業株式会社 半導体封止用エポキシ樹脂組成物及び該樹脂組成物で封止した半導体装置
JP3714861B2 (ja) * 2000-09-20 2005-11-09 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物
JP2005015639A (ja) * 2003-06-26 2005-01-20 Nhk Spring Co Ltd 電気絶縁材料樹脂組成物および電気絶縁積層材料
JP4197141B2 (ja) * 2003-08-22 2008-12-17 電気化学工業株式会社 球状アルミナ粉末及びその用途
JP2006249222A (ja) * 2005-03-10 2006-09-21 Hitachi Chem Co Ltd エポキシ樹脂硬化剤とその製造方法、エポキシ樹脂組成物及び電子部品装置
JP4961968B2 (ja) * 2006-11-22 2012-06-27 住友ベークライト株式会社 エポキシ樹脂用硬化促進剤、エポキシ樹脂組成物、及び電子材料用樹脂組成物
JP2008274013A (ja) * 2007-04-25 2008-11-13 Asahi Kasei Chemicals Corp 硬化性エポキシ樹脂組成物およびその製造法
JP5410245B2 (ja) * 2009-11-11 2014-02-05 電気化学工業株式会社 球状アルミナ粉末、その製造方法及び用途。
JP2012153829A (ja) * 2011-01-27 2012-08-16 Iteq Corp ハロゲンフリーエポキシ樹脂組成物と、それを用いたプリプレグ及び印刷回路基板
US20150299550A1 (en) * 2011-12-27 2015-10-22 Panasonic Corporation Thermally conductive resin composition
JP5891435B2 (ja) * 2012-04-05 2016-03-23 パナソニックＩｐマネジメント株式会社 エポキシ樹脂組成物、プリプレグ、金属張積層板、プリント配線板
CN104910588A (zh) * 2014-03-12 2015-09-16 江苏麒祥高新材料有限公司 一种含有纳米银线的高导热环氧材料的制备方法
JP6828238B2 (ja) * 2016-01-06 2021-02-10 昭和電工マテリアルズ株式会社 樹脂組成物及び硬化物
JP6937701B2 (ja) * 2016-01-13 2021-09-22 太陽インキ製造株式会社 ドライフィルムおよびプリント配線板
JP6980986B2 (ja) * 2016-04-22 2021-12-15 住友ベークライト株式会社 半導体封止用樹脂組成物および半導体装置
MY196654A (en) * 2016-04-28 2023-04-27 Hitachi Chemical Co Ltd Epoxy Resin Composition and Electronic Component Device
KR101829213B1 (ko) * 2016-12-20 2018-02-19 안순영 온도감지기 충진용 수지 조성물

Also Published As

Publication number Publication date
JP7351291B2 (ja) 2023-09-27
WO2019176859A1 (ja) 2019-09-19
JPWO2019176859A1 (ja) 2021-03-11
KR20200132871A (ko) 2020-11-25
CN111868169A (zh) 2020-10-30
TW201945460A (zh) 2019-12-01
CN111868169B (zh) 2024-03-08
US20210061986A1 (en) 2021-03-04
JP2023076548A (ja) 2023-06-01

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