SG11201907283PA - Wire saw, wire guide roll and method for simultaneously cutting a multiplicity of wafers from an ingot - Google Patents

Wire saw, wire guide roll and method for simultaneously cutting a multiplicity of wafers from an ingot

Info

Publication number
SG11201907283PA
SG11201907283PA SG11201907283PA SG11201907283PA SG11201907283PA SG 11201907283P A SG11201907283P A SG 11201907283PA SG 11201907283P A SG11201907283P A SG 11201907283PA SG 11201907283P A SG11201907283P A SG 11201907283PA SG 11201907283P A SG11201907283P A SG 11201907283PA
Authority
SG
Singapore
Prior art keywords
wire
ingot
multiplicity
wafers
guide roll
Prior art date
Application number
SG11201907283PA
Inventor
Georg Pietsch
Original Assignee
Siltronic Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic Ag filed Critical Siltronic Ag
Publication of SG11201907283PA publication Critical patent/SG11201907283PA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0061—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of devices for guiding or feeding saw wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0053—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of drives for saw wires; of wheel mountings; of wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B23D61/185—Saw wires; Saw cables; Twisted saw strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

Wire Saw, Wire Guide Roll and Method for Simultaneously Cutting a Multiplicity of Wafers from an Ingot 5 The invention relates to a method for simultaneously cutting a multiplicity of wafers from an ingot by means of a structured sawing wire, wherein the structured sawing wire is guided through grooves of two wire guide rolls, and a bottom of each groove, on which the structured wire bears, has a curved groove bottom with a radius of curvature which for each groove is equal to or up to 1.5 times as large as the radius of 10 the envelope of the structured wire, which the structured wire has in the respective groove. The invention furthermore relates to a wire guide roll and to a wire saw. Drawing for the abstract: Fig. 2 15
SG11201907283PA 2017-02-14 2018-01-30 Wire saw, wire guide roll and method for simultaneously cutting a multiplicity of wafers from an ingot SG11201907283PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017202314.7A DE102017202314A1 (en) 2017-02-14 2017-02-14 Wire saw, wire guide roller, and method of simultaneously separating a plurality of disks from a rod
PCT/EP2018/052207 WO2018149631A1 (en) 2017-02-14 2018-01-30 Wire saw, wire guide roller, and method for simultaneously separating a plurality of discs from a rod

Publications (1)

Publication Number Publication Date
SG11201907283PA true SG11201907283PA (en) 2019-09-27

Family

ID=61157186

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201907283PA SG11201907283PA (en) 2017-02-14 2018-01-30 Wire saw, wire guide roll and method for simultaneously cutting a multiplicity of wafers from an ingot

Country Status (9)

Country Link
US (1) US11878359B2 (en)
EP (1) EP3582920B1 (en)
JP (1) JP7102422B2 (en)
KR (1) KR102369751B1 (en)
CN (1) CN110430958B (en)
DE (1) DE102017202314A1 (en)
SG (1) SG11201907283PA (en)
TW (1) TWI667114B (en)
WO (1) WO2018149631A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019207719A1 (en) * 2019-05-27 2020-12-03 Siltronic Ag Method for severing a multiplicity of wafers from workpieces during a number of severing operations by means of a wire saw and semiconductor wafer made of monocrystalline silicon
DE102019216267A1 (en) 2019-10-23 2021-04-29 Siltronic Ag Process for the production of semiconductor wafers
FI3940124T3 (en) 2020-07-14 2024-04-03 Siltronic Ag Monocrystalline silicon crystal article
EP3943265A1 (en) * 2020-07-21 2022-01-26 Siltronic AG Method and device for simultaneously separating a plurality of plates from a workpiece
EP4029670A1 (en) 2021-01-15 2022-07-20 Lapmaster Wolters GmbH Device and method for cutting a solid substrate
DE102021121134A1 (en) 2021-08-13 2023-02-16 voestalpine Wire Rod Austria GmbH Saw wire and method for its manufacture
CN115635606B (en) * 2022-11-18 2023-03-10 浙江晶盛机电股份有限公司 Crystal cut-off device, crystal growth equipment and crystal cut-off method
CN115870571A (en) * 2022-12-05 2023-03-31 北京天科合达半导体股份有限公司 Cutting device control method, system, equipment and medium

Family Cites Families (26)

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Publication number Priority date Publication date Assignee Title
GB717874A (en) 1952-05-22 1954-11-03 British Thomson Houston Co Ltd Improvements in and relating to methods of and apparatus for cutting crystal
JP3058077B2 (en) 1996-01-16 2000-07-04 松下電器産業株式会社 Semiconductor light emitting and receiving device
JPH09254006A (en) * 1996-03-25 1997-09-30 Naoetsu Seimitsu Kako Kk Wire for wire saw
JP3058077U (en) * 1998-09-29 1999-06-08 金井 宏彰 Wire for wire saw
JP2001205551A (en) * 2000-01-27 2001-07-31 Tokyo Seiko Co Ltd Saw wire and wire saw
DE10237247B4 (en) 2002-08-14 2004-09-09 Siltronic Ag Method of manufacturing a silicon wafer
JP2004243492A (en) * 2003-02-14 2004-09-02 Kanai Hiroaki Saw wire for single wire saw
JP4411062B2 (en) * 2003-12-25 2010-02-10 株式会社アライドマテリアル Super abrasive wire saw winding structure, super abrasive wire saw cutting device, and super abrasive wire saw winding method
JP2006102917A (en) 2004-10-08 2006-04-20 Sumco Corp Roller for wire saw
LU91126B1 (en) 2004-12-23 2006-06-26 Trefilarbed Bettembourg S A Monofilament metal saw wire
JP4559929B2 (en) * 2005-08-11 2010-10-13 東京製綱株式会社 Saw wire manufacturing method
DE102007019566B4 (en) * 2007-04-25 2012-11-29 Siltronic Ag Wire guide roller for wire saw
KR20100000195A (en) 2008-06-24 2010-01-06 삼성에스디아이 주식회사 Light emission device and display device using the light emission device as light source
KR20100000195U (en) * 2009-11-27 2010-01-06 노승훈 Implementation of the idle rollers for the wire saw
DE102010005718B4 (en) * 2010-01-26 2011-09-22 Schott Solar Ag Wire guide roller for use in wire saws
CN201900685U (en) * 2010-12-06 2011-07-20 常州得一新材料科技有限公司 Wavy special-shaped cutting steel wire
CN102205563B (en) * 2011-05-25 2014-11-26 镇江耐丝新型材料有限公司 Spiral waveform cutting metal wire as well as manufacturing method and equipment thereof
CN202378185U (en) * 2011-10-17 2012-08-15 南京三超金刚石工具有限公司 Pre-deformation diamond fret saw for high-speed cutting
WO2014102662A1 (en) * 2012-12-27 2014-07-03 Pirelli Tyre S.P.A. System for wire sawing of ingot materials, and saw wire used in said system
CN103692567B (en) * 2013-12-17 2015-12-23 苏闽(张家港)新型金属材料科技有限公司 Flat cross section zigzag cutting steel wire
KR101652062B1 (en) * 2014-02-04 2016-08-29 홍덕산업 주식회사 A structure saw wire maintaining crimp property under high slicing tension
JP6281312B2 (en) * 2014-02-20 2018-02-21 株式会社Sumco Silicon wafer manufacturing method
DE102015200198B4 (en) * 2014-04-04 2020-01-16 Siltronic Ag Method for cutting semiconductor wafers from a workpiece with a saw wire
KR101427554B1 (en) * 2014-04-29 2014-08-08 주식회사 효성 Wavy-patterned Monowire for Cutting
DE102014208187B4 (en) * 2014-04-30 2023-07-06 Siltronic Ag Process for the simultaneous cutting of a large number of slices with a particularly uniform thickness from a workpiece
CN104476688A (en) * 2014-12-29 2015-04-01 盛利维尔（中国）新材料技术有限公司 Scrap accumulation prevention type special-shaped steel wire stranded diamond rope

Also Published As

Publication number Publication date
WO2018149631A1 (en) 2018-08-23
EP3582920B1 (en) 2022-08-10
JP2020507484A (en) 2020-03-12
TW201829145A (en) 2018-08-16
JP7102422B2 (en) 2022-07-19
CN110430958A (en) 2019-11-08
DE102017202314A1 (en) 2018-08-16
CN110430958B (en) 2021-11-30
TWI667114B (en) 2019-08-01
EP3582920A1 (en) 2019-12-25
US20200016671A1 (en) 2020-01-16
KR102369751B1 (en) 2022-03-03
KR20190117618A (en) 2019-10-16
US11878359B2 (en) 2024-01-23

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