SG11201907100RA - Sputtering target and production method therefor - Google Patents
Sputtering target and production method thereforInfo
- Publication number
- SG11201907100RA SG11201907100RA SG11201907100RA SG11201907100RA SG 11201907100R A SG11201907100R A SG 11201907100RA SG 11201907100R A SG11201907100R A SG 11201907100RA SG 11201907100R A SG11201907100R A SG 11201907100RA
- Authority
- SG
- Singapore
- Prior art keywords
- sputtering target
- silicon
- production method
- method therefor
- phase
- Prior art date
Links
Landscapes
- Physical Vapour Deposition (AREA)
- Silicon Compounds (AREA)
- Powder Metallurgy (AREA)
Abstract
A sputtering target according to the present invention has a molybdenum content of from 3 to 25 mol%, and a silicon content of from 75 to 97 mol%. The sputtering target includes a silicon phase in which an average grain size of silicon grains is 2.0 µm or less, and a molybdenum silicide phase in which an average grain size of molybdenum silicide grains is 2.5 µm or less. The average number of holes present in the silicon phase and having a major axis of 0.3 µm or greater is ten or fewer within an area of 90×125 µm.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017057426 | 2017-03-23 | ||
PCT/JP2018/003909 WO2018173517A1 (en) | 2017-03-23 | 2018-02-06 | Sputtering target and production method therefor |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201907100RA true SG11201907100RA (en) | 2019-10-30 |
Family
ID=63585306
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201907100R SG11201907100RA (en) | 2017-03-23 | 2018-02-06 | Sputtering target and production method therefor |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7060578B2 (en) |
CN (1) | CN110392747B (en) |
MY (1) | MY193691A (en) |
SG (1) | SG11201907100RA (en) |
WO (1) | WO2018173517A1 (en) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2794382B2 (en) * | 1993-05-07 | 1998-09-03 | 株式会社ジャパンエナジー | Silicide target for sputtering and method for producing the same |
EP1118690A3 (en) * | 1993-07-27 | 2001-09-26 | Kabushiki Kaisha Toshiba | Refractory metal silicide target |
JP4509363B2 (en) * | 2000-12-05 | 2010-07-21 | 株式会社東芝 | Sputtering target, sputtering target manufacturing method, phase shift mask blank manufacturing method, and phase shift mask manufacturing method |
JP2004109317A (en) * | 2002-09-17 | 2004-04-08 | Shin Etsu Chem Co Ltd | Sputtering target, and method for manufacturing mask blank |
JP2004204278A (en) * | 2002-12-25 | 2004-07-22 | Hitachi Metals Ltd | Silicide target manufacturing method |
JP4376638B2 (en) * | 2004-01-14 | 2009-12-02 | Hoya株式会社 | Sputtering target and photomask blank manufacturing method using the same |
FR2944295B1 (en) * | 2009-04-10 | 2014-08-15 | Saint Gobain Coating Solutions | MOLYBDENE-BASED TARGET AND THERMAL PROJECTION DELIVERY METHOD OF A TARGET |
-
2018
- 2018-02-06 MY MYPI2019004604A patent/MY193691A/en unknown
- 2018-02-06 JP JP2019507415A patent/JP7060578B2/en active Active
- 2018-02-06 WO PCT/JP2018/003909 patent/WO2018173517A1/en active Application Filing
- 2018-02-06 CN CN201880013540.XA patent/CN110392747B/en active Active
- 2018-02-06 SG SG11201907100R patent/SG11201907100RA/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP7060578B2 (en) | 2022-04-26 |
WO2018173517A1 (en) | 2018-09-27 |
CN110392747A (en) | 2019-10-29 |
CN110392747B (en) | 2021-10-29 |
MY193691A (en) | 2022-10-25 |
JPWO2018173517A1 (en) | 2020-01-23 |
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