SG11201801847SA - Copper paste for joining, method for producing joined body, and method for producing semiconductor device - Google Patents
Copper paste for joining, method for producing joined body, and method for producing semiconductor deviceInfo
- Publication number
- SG11201801847SA SG11201801847SA SG11201801847SA SG11201801847SA SG11201801847SA SG 11201801847S A SG11201801847S A SG 11201801847SA SG 11201801847S A SG11201801847S A SG 11201801847SA SG 11201801847S A SG11201801847S A SG 11201801847SA SG 11201801847S A SG11201801847S A SG 11201801847SA
- Authority
- SG
- Singapore
- Prior art keywords
- producing
- joining
- semiconductor device
- joined body
- copper paste
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 229910052802 copper Inorganic materials 0.000 title 1
- 239000010949 copper Substances 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
- H01L23/49513—Lead-frames or other flat leads characterised by the die pad having bonding material between chip and die pad
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
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- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
- B22F7/064—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts using an intermediate powder layer
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- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
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- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
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JP7127269B2 (ja) * | 2017-10-23 | 2022-08-30 | 昭和電工マテリアルズ株式会社 | 部材接続方法 |
KR20200070222A (ko) * | 2017-10-24 | 2020-06-17 | 히타치가세이가부시끼가이샤 | 열전 변환 모듈의 제조 방법, 열전 변환 모듈 및 열전 변환 모듈용 접합재 |
EP3709339A4 (en) * | 2017-11-08 | 2021-02-17 | Hitachi Chemical Co., Ltd. | METHOD OF MANUFACTURING AN ASSEMBLED BODY AND ASSEMBLY MATERIAL |
JP6574234B2 (ja) * | 2017-12-13 | 2019-09-11 | Jx金属株式会社 | 半導体デバイス |
JPWO2019188511A1 (ja) * | 2018-03-29 | 2020-12-03 | ハリマ化成株式会社 | 銅ペースト、接合方法および接合体の製造方法 |
JP7127407B2 (ja) * | 2018-07-25 | 2022-08-30 | 昭和電工マテリアルズ株式会社 | 接合用金属ペースト、接合体及び接合体の製造方法 |
CN112673715A (zh) * | 2018-09-14 | 2021-04-16 | 昭和电工材料株式会社 | 电子零件及电子零件的制造方法 |
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SG11202105564QA (en) * | 2018-11-29 | 2021-06-29 | Showa Denko Materials Co Ltd | Method for producing bonded object and semiconductor device and copper bonding paste |
TWI701783B (zh) * | 2019-06-03 | 2020-08-11 | 日商Jx金屬股份有限公司 | 半導體裝置 |
JP6956765B2 (ja) * | 2019-08-07 | 2021-11-02 | Jx金属株式会社 | 銅粉ペーストを用いた接合方法 |
JP6956766B2 (ja) * | 2019-08-07 | 2021-11-02 | Jx金属株式会社 | 銅粉ペーストを用いた接合方法 |
WO2021060204A1 (ja) * | 2019-09-25 | 2021-04-01 | 昭和電工マテリアルズ株式会社 | 焼結銅ピラー形成用銅ペースト及び接合体の製造方法 |
WO2021064826A1 (ja) * | 2019-09-30 | 2021-04-08 | 昭和電工マテリアルズ株式会社 | 接合用銅ペースト、接合体の製造方法及び接合体 |
JP7302487B2 (ja) * | 2020-01-14 | 2023-07-04 | トヨタ自動車株式会社 | 複合粒子、及び複合粒子の製造方法 |
JP7391678B2 (ja) * | 2020-01-24 | 2023-12-05 | 大陽日酸株式会社 | 接合材 |
CN111415767B (zh) * | 2020-03-06 | 2021-09-03 | 深圳第三代半导体研究院 | 一种基于多维金属纳米材料膏体及其互连工艺 |
WO2021206098A1 (ja) * | 2020-04-07 | 2021-10-14 | 昭和電工マテリアルズ株式会社 | 銅ペースト、ウィックの形成方法及びヒートパイプ |
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US5611884A (en) * | 1995-12-11 | 1997-03-18 | Dow Corning Corporation | Flip chip silicone pressure sensitive conductive adhesive |
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2016
- 2016-09-07 CN CN201680051482.0A patent/CN107949447B/zh active Active
- 2016-09-07 KR KR1020187009670A patent/KR102580090B1/ko active IP Right Grant
- 2016-09-07 WO PCT/JP2016/076343 patent/WO2017043545A1/ja active Application Filing
- 2016-09-07 TW TW105129000A patent/TWI733693B/zh active
- 2016-09-07 EP EP16844406.5A patent/EP3348338B1/en active Active
- 2016-09-07 JP JP2017539203A patent/JP6794987B2/ja active Active
- 2016-09-07 MY MYPI2018700888A patent/MY184948A/en unknown
- 2016-09-07 US US15/757,790 patent/US10363608B2/en active Active
- 2016-09-07 CN CN202010141856.6A patent/CN111283206A/zh active Pending
- 2016-09-07 SG SG11201801847SA patent/SG11201801847SA/en unknown
- 2016-09-07 EP EP20162721.3A patent/EP3702071A1/en not_active Withdrawn
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KR102580090B1 (ko) | 2023-09-18 |
US20180250751A1 (en) | 2018-09-06 |
CN111283206A (zh) | 2020-06-16 |
JPWO2017043545A1 (ja) | 2018-07-12 |
JP2022180400A (ja) | 2022-12-06 |
JP7359267B2 (ja) | 2023-10-12 |
TWI733693B (zh) | 2021-07-21 |
MY184948A (en) | 2021-04-30 |
EP3348338A1 (en) | 2018-07-18 |
JP7192842B2 (ja) | 2022-12-20 |
US10363608B2 (en) | 2019-07-30 |
WO2017043545A1 (ja) | 2017-03-16 |
JP6794987B2 (ja) | 2020-12-02 |
TW201718441A (zh) | 2017-06-01 |
EP3348338A4 (en) | 2019-05-01 |
KR20180050712A (ko) | 2018-05-15 |
EP3348338B1 (en) | 2020-06-10 |
CN107949447B (zh) | 2020-03-03 |
EP3702071A1 (en) | 2020-09-02 |
JP2021048396A (ja) | 2021-03-25 |
CN107949447A (zh) | 2018-04-20 |
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