SG11201702721RA - Tdi sensor in a darkfield system - Google Patents

Tdi sensor in a darkfield system

Info

Publication number
SG11201702721RA
SG11201702721RA SG11201702721RA SG11201702721RA SG11201702721RA SG 11201702721R A SG11201702721R A SG 11201702721RA SG 11201702721R A SG11201702721R A SG 11201702721RA SG 11201702721R A SG11201702721R A SG 11201702721RA SG 11201702721R A SG11201702721R A SG 11201702721RA
Authority
SG
Singapore
Prior art keywords
tdi sensor
darkfield system
darkfield
system
tdi
Prior art date
Application number
SG11201702721RA
Inventor
Jijen Vazhaeparambil
Guoheng Zhao
Daniel Ivanov Kavaldjiev
Anatoly Romanovsky
Ivan Maleev
Christian Wolters
George Kren
Stephen Biellak
Bret Whiteside
Donald Pettibone
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US14/506,321 priority Critical patent/US9891177B2/en
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Priority to PCT/US2015/053824 priority patent/WO2016054570A1/en
Publication of SG11201702721RA publication Critical patent/SG11201702721RA/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8896Circuits specially adapted for system specific signal conditioning
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00Features of devices classified in G01N21/00
    • G01N2201/06Illumination; Optics
    • G01N2201/061Sources
    • G01N2201/06113Coherent sources; lasers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00Features of devices classified in G01N21/00
    • G01N2201/10Scanning
    • G01N2201/103Scanning by mechanical motion of stage
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00Features of devices classified in G01N21/00
    • G01N2201/12Circuits of general importance; Signal processing
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/10Image acquisition modality
    • G06T2207/10004Still image; Photographic image
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30108Industrial image inspection
    • G06T2207/30148Semiconductor; IC; Wafer
SG11201702721RA 2014-10-03 2015-10-02 Tdi sensor in a darkfield system SG11201702721RA (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US14/506,321 US9891177B2 (en) 2014-10-03 2014-10-03 TDI sensor in a darkfield system
PCT/US2015/053824 WO2016054570A1 (en) 2014-10-03 2015-10-02 Tdi sensor in a darkfield system

Publications (1)

Publication Number Publication Date
SG11201702721RA true SG11201702721RA (en) 2017-04-27

Family

ID=55631647

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201702721RA SG11201702721RA (en) 2014-10-03 2015-10-02 Tdi sensor in a darkfield system

Country Status (7)

Country Link
US (1) US9891177B2 (en)
KR (1) KR20170063938A (en)
CN (1) CN107110792B (en)
DE (1) DE112015004550T5 (en)
SG (1) SG11201702721RA (en)
TW (1) TWI656338B (en)
WO (1) WO2016054570A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160381267A1 (en) * 2015-06-23 2016-12-29 The Charles Stark Draper Laboratory, Inc. Hemispherical Star Camera
US10462391B2 (en) 2015-08-14 2019-10-29 Kla-Tencor Corporation Dark-field inspection using a low-noise sensor
US10313622B2 (en) 2016-04-06 2019-06-04 Kla-Tencor Corporation Dual-column-parallel CCD sensor and inspection systems using a sensor
US10469782B2 (en) 2016-09-27 2019-11-05 Kla-Tencor Corporation Power-conserving clocking for scanning sensors
US10234402B2 (en) 2017-01-05 2019-03-19 Kla-Tencor Corporation Systems and methods for defect material classification
US20190137411A1 (en) * 2017-11-03 2019-05-09 Kla-Tencor Corporation Minimizing Field Size to Reduce Unwanted Stray Light
US10267790B1 (en) 2017-11-17 2019-04-23 Ultima Genomics, Inc. Systems for biological sample processing and analysis
US10512911B1 (en) 2018-12-07 2019-12-24 Ultima Genomics, Inc. Implementing barriers for controlled environments during sample processing and detection

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6288780B1 (en) 1995-06-06 2001-09-11 Kla-Tencor Technologies Corp. High throughput brightfield/darkfield wafer inspection system using advanced optical techniques
US6608676B1 (en) 1997-08-01 2003-08-19 Kla-Tencor Corporation System for detecting anomalies and/or features of a surface
US7227984B2 (en) 2003-03-03 2007-06-05 Kla-Tencor Technologies Corporation Method and apparatus for identifying defects in a substrate surface by using dithering to reconstruct under-sampled images
JP2006053690A (en) 2004-08-10 2006-02-23 Ricoh Co Ltd Image processing device, image processing method, image processing program, and recording medium
US7952633B2 (en) 2004-11-18 2011-05-31 Kla-Tencor Technologies Corporation Apparatus for continuous clocking of TDI sensors
US7609309B2 (en) 2004-11-18 2009-10-27 Kla-Tencor Technologies Corporation Continuous clocking of TDI sensors
US7675561B2 (en) 2006-09-28 2010-03-09 Cypress Semiconductor Corporation Time delayed integration CMOS image sensor with zero desynchronization
US7714997B2 (en) * 2006-11-07 2010-05-11 Hitachi High-Technologies Corporation Apparatus for inspecting defects
US8463078B2 (en) 2007-08-23 2013-06-11 Lockheed Martin Corporation Multi-bank TDI approach for high-sensitivity scanners
US20100074515A1 (en) * 2008-02-05 2010-03-25 Kla-Tencor Corporation Defect Detection and Response
US8624971B2 (en) 2009-01-23 2014-01-07 Kla-Tencor Corporation TDI sensor modules with localized driving and signal processing circuitry for high speed inspection
EP2457251A4 (en) * 2009-07-22 2017-11-08 KLA-Tencor Corporation Dark field inspection system with ring illumination
US8692916B2 (en) * 2011-02-24 2014-04-08 Teledyne Dalsa, Inc. Continuous clocking mode for TDI binning operation of CCD image sensor
US9279774B2 (en) 2011-07-12 2016-03-08 Kla-Tencor Corp. Wafer inspection
US8772731B2 (en) 2012-04-15 2014-07-08 Kla-Tencor Corporation Apparatus and method for synchronizing sample stage motion with a time delay integration charge-couple device in a semiconductor inspection tool
EP2907301A4 (en) 2012-10-12 2016-08-31 Thorlabs Inc Time delay and integration scanning using a ccd imager
US9426400B2 (en) 2012-12-10 2016-08-23 Kla-Tencor Corporation Method and apparatus for high speed acquisition of moving images using pulsed illumination

Also Published As

Publication number Publication date
TW201617604A (en) 2016-05-16
WO2016054570A1 (en) 2016-04-07
US9891177B2 (en) 2018-02-13
JP2017536533A (en) 2017-12-07
CN107110792A (en) 2017-08-29
CN107110792B (en) 2019-02-01
KR20170063938A (en) 2017-06-08
US20160097727A1 (en) 2016-04-07
DE112015004550T5 (en) 2017-06-14
TWI656338B (en) 2019-04-11

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