SG11201601893YA - Apparatus for dressing urethane foam pad for use in polishing - Google Patents

Apparatus for dressing urethane foam pad for use in polishing

Info

Publication number
SG11201601893YA
SG11201601893YA SG11201601893YA SG11201601893YA SG11201601893YA SG 11201601893Y A SG11201601893Y A SG 11201601893YA SG 11201601893Y A SG11201601893Y A SG 11201601893YA SG 11201601893Y A SG11201601893Y A SG 11201601893YA SG 11201601893Y A SG11201601893Y A SG 11201601893YA
Authority
SG
Singapore
Prior art keywords
dressing
polishing
urethane foam
foam pad
pad
Prior art date
Application number
SG11201601893YA
Inventor
Junichi Ueno
Michito Sato
Kaoru Ishii
Original Assignee
Shinetsu Handotai Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Kk filed Critical Shinetsu Handotai Kk
Publication of SG11201601893YA publication Critical patent/SG11201601893YA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B24D3/10—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
    • H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/463—Mechanical treatment, e.g. grinding, ultrasonic treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
SG11201601893YA 2013-10-17 2014-09-22 Apparatus for dressing urethane foam pad for use in polishing SG11201601893YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013216738A JP5954293B2 (en) 2013-10-17 2013-10-17 Polishing urethane pad dressing equipment
PCT/JP2014/004833 WO2015056405A1 (en) 2013-10-17 2014-09-22 Dressing device for polishing-use foamed urethane pad

Publications (1)

Publication Number Publication Date
SG11201601893YA true SG11201601893YA (en) 2016-04-28

Family

ID=52827866

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201601893YA SG11201601893YA (en) 2013-10-17 2014-09-22 Apparatus for dressing urethane foam pad for use in polishing

Country Status (8)

Country Link
US (1) US9981361B2 (en)
JP (1) JP5954293B2 (en)
KR (1) KR102112535B1 (en)
CN (1) CN105531082B (en)
DE (1) DE112014003809T5 (en)
SG (1) SG11201601893YA (en)
TW (1) TWI608904B (en)
WO (1) WO2015056405A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101392401B1 (en) * 2012-11-30 2014-05-07 이화다이아몬드공업 주식회사 Wafer retaininer ring with a function of pad conditioner and method for producing the same
CN104875131A (en) * 2015-05-28 2015-09-02 江苏耐尔特钻石有限公司 Diamond millstone
US20170008146A1 (en) * 2015-07-10 2017-01-12 Abrasive Technology, Inc. Chemical mechanical planarization conditioner
US10857651B2 (en) 2017-11-20 2020-12-08 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus of chemical mechanical polishing and operating method thereof
CN111699439A (en) * 2018-02-06 2020-09-22 Asml荷兰有限公司 Systems, devices, and methods for repairing a substrate support

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4908046A (en) * 1989-02-14 1990-03-13 Wiand Ronald C Multilayer abrading tool and process
US5271547A (en) * 1992-09-15 1993-12-21 Tunco Manufacturing, Inc. Method for brazing tungsten carbide particles and diamond crystals to a substrate and products made therefrom
JP3052896B2 (en) 1997-06-13 2000-06-19 日本電気株式会社 Dress jig on polishing cloth surface and method of manufacturing the same
JP3772946B2 (en) * 1999-03-11 2006-05-10 株式会社荏原製作所 Dressing apparatus and polishing apparatus provided with the dressing apparatus
JP3527448B2 (en) * 1999-12-20 2004-05-17 株式会社リード Dresser for CMP polishing cloth and its manufacturing method
JP2001252871A (en) * 2000-03-10 2001-09-18 Matsushita Electric Ind Co Ltd Dresser for polishing cloth, and method of manufacturing the same
JP2001341061A (en) * 2000-06-02 2001-12-11 Toshiba Mach Co Ltd Dressing device
JP2004001152A (en) * 2002-06-03 2004-01-08 Tokyo Seimitsu Co Ltd Dresser, dressing method, polishing device, and polishing method
JP4216025B2 (en) * 2002-09-09 2009-01-28 株式会社リード Dresser for polishing cloth and dressing method for polishing cloth using the same
US9724802B2 (en) * 2005-05-16 2017-08-08 Chien-Min Sung CMP pad dressers having leveled tips and associated methods
US20110275288A1 (en) * 2010-05-10 2011-11-10 Chien-Min Sung Cmp pad dressers with hybridized conditioning and related methods
US7169031B1 (en) 2005-07-28 2007-01-30 3M Innovative Properties Company Self-contained conditioning abrasive article
JP4946402B2 (en) * 2006-12-05 2012-06-06 三菱マテリアル株式会社 CMP conditioner and method of manufacturing the same
WO2010110834A1 (en) * 2009-03-24 2010-09-30 Saint-Gobain Abrasives, Inc. Abrasive tool for use as a chemical mechanical planarization pad conditioner
TWI380878B (en) 2009-04-21 2013-01-01 Sung Chien Min Combined Dressing Machine and Its Making Method
US20110159784A1 (en) * 2009-04-30 2011-06-30 First Principles LLC Abrasive article with array of gimballed abrasive members and method of use
JP5422262B2 (en) * 2009-06-01 2014-02-19 ニッタ・ハース株式会社 Polishing pad conditioner
US8835121B2 (en) * 2009-09-30 2014-09-16 Department Of Biotechnology Modified method of agglutination to detect infections caused by microorganisms
CN102049737B (en) 2009-10-29 2012-08-29 宋健民 Polishing pad conditioner
JP2012130995A (en) * 2010-12-22 2012-07-12 Nitta Haas Inc Dresser
ITMI20110850A1 (en) 2011-05-16 2012-11-17 Nicola Fiore MULTI-ABRASIVE TOOL
CN103329253B (en) * 2011-05-23 2016-03-30 宋健民 There is the CMP pad dresser at planarization tip
US9242342B2 (en) * 2012-03-14 2016-01-26 Taiwan Semiconductor Manufacturing Company, Ltd. Manufacture and method of making the same
TWM458275U (en) 2013-03-08 2013-08-01 Tera Xtal Technology Corp Sapphire polishing pad dresser
TWM465659U (en) * 2013-04-08 2013-11-11 jian-min Song Chemical mechanical polishing conditioner

Also Published As

Publication number Publication date
DE112014003809T5 (en) 2016-05-12
WO2015056405A1 (en) 2015-04-23
US20160214230A1 (en) 2016-07-28
KR102112535B1 (en) 2020-05-20
TWI608904B (en) 2017-12-21
CN105531082B (en) 2017-11-10
JP2015077665A (en) 2015-04-23
KR20160071366A (en) 2016-06-21
JP5954293B2 (en) 2016-07-20
CN105531082A (en) 2016-04-27
TW201532742A (en) 2015-09-01
US9981361B2 (en) 2018-05-29

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