SG11201600173WA - Method and apparatus for optically checking by interferometry the thickness of an object being machined - Google Patents
Method and apparatus for optically checking by interferometry the thickness of an object being machinedInfo
- Publication number
- SG11201600173WA SG11201600173WA SG11201600173WA SG11201600173WA SG11201600173WA SG 11201600173W A SG11201600173W A SG 11201600173WA SG 11201600173W A SG11201600173W A SG 11201600173WA SG 11201600173W A SG11201600173W A SG 11201600173WA SG 11201600173W A SG11201600173W A SG 11201600173WA
- Authority
- SG
- Singapore
- Prior art keywords
- interferometry
- machined
- thickness
- optically checking
- optically
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0675—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating using interferometry
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/02015—Interferometers characterised by the beam path configuration
- G01B9/02017—Interferometers characterised by the beam path configuration with multiple interactions between the target object and light beams, e.g. beam reflections occurring from different locations
- G01B9/02021—Interferometers characterised by the beam path configuration with multiple interactions between the target object and light beams, e.g. beam reflections occurring from different locations contacting different faces of object, e.g. opposite faces
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/02015—Interferometers characterised by the beam path configuration
- G01B9/02025—Interference between three or more discrete surfaces
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/02041—Interferometers characterised by particular imaging or detection techniques
- G01B9/02044—Imaging in the frequency domain, e.g. by using a spectrometer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/0209—Low-coherence interferometers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT000403A ITBO20130403A1 (en) | 2013-07-26 | 2013-07-26 | METHOD AND EQUIPMENT FOR OPTICAL CONTROL BY INTERFEROMETRY OF THE THICKNESS OF A PROCESSED OBJECT |
| PCT/EP2014/065963 WO2015011243A1 (en) | 2013-07-26 | 2014-07-24 | Method and apparatus for optically checking by interferometry the thickness of an object being machined |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201600173WA true SG11201600173WA (en) | 2016-02-26 |
Family
ID=49182320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201600173WA SG11201600173WA (en) | 2013-07-26 | 2014-07-24 | Method and apparatus for optically checking by interferometry the thickness of an object being machined |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US9879978B2 (en) |
| EP (1) | EP3025121B1 (en) |
| JP (1) | JP6509846B2 (en) |
| KR (1) | KR102236207B1 (en) |
| CN (1) | CN105452801B (en) |
| CA (1) | CA2919136A1 (en) |
| IT (1) | ITBO20130403A1 (en) |
| MY (1) | MY176734A (en) |
| PH (1) | PH12016500188A1 (en) |
| SG (1) | SG11201600173WA (en) |
| TW (1) | TWI638976B (en) |
| WO (1) | WO2015011243A1 (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3045813B1 (en) * | 2015-12-22 | 2020-05-01 | Unity Semiconductor | DEVICE AND METHOD FOR MEASURING HEIGHT IN THE PRESENCE OF THIN FILMS |
| EP3488180B1 (en) * | 2016-07-21 | 2021-06-16 | Assan Alüminyum San. Ve Tic. A.S. | Measurement of oxide thickness on aluminum surface by ftir spectroscopy and chemometrics method |
| US10260865B1 (en) * | 2016-09-13 | 2019-04-16 | National Technology & Engineering Solutions Of Sandia, Llc | High resolution, non-contact removal rate module for serial sectioning |
| US10236222B2 (en) * | 2017-02-08 | 2019-03-19 | Kla-Tencor Corporation | System and method for measuring substrate and film thickness distribution |
| CN108571933A (en) * | 2017-03-07 | 2018-09-25 | 台濠科技股份有限公司 | The method for measuring wafer thickness near infrared ray |
| JP6829653B2 (en) * | 2017-05-17 | 2021-02-10 | 株式会社荏原製作所 | Polishing equipment and polishing method |
| CN108181264B (en) * | 2017-12-29 | 2023-10-20 | 北京市农林科学院智能装备技术研究中心 | Measuring system for diffuse reflection of light radiation depth in agricultural products |
| CN110160450B (en) * | 2019-05-13 | 2020-12-25 | 天津大学 | Method for rapidly measuring height of large step based on white light interference spectrum |
| CN110948379B (en) * | 2019-10-24 | 2020-10-20 | 清华大学 | Chemical mechanical polishing device |
| CN110948376B (en) * | 2019-10-24 | 2020-10-20 | 清华大学 | Driving device for chemical mechanical polishing bearing head |
| US12072176B2 (en) * | 2019-12-26 | 2024-08-27 | Nanjing Zhongan Semiconductor Equipment Ltd | Measuring apparatus and method of wafer geometry |
| IT202100014969A1 (en) * | 2021-06-09 | 2022-12-09 | Marposs Spa | METHOD AND UNIT OF THICKNESS CONTROL OF A MULTILAYER SHEET CONSTITUTING PART OF A BAG FOR A CELL OF AN ELECTRIC BATTERY |
| GB2618378A (en) * | 2022-05-06 | 2023-11-08 | The Francis Crick Institute Ltd | Optical measurement apparatuses for use with a cutting apparatus |
| CN116417365B (en) * | 2023-06-12 | 2023-09-08 | 合肥晶合集成电路股份有限公司 | Wafer testing method |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2855964B2 (en) * | 1992-04-28 | 1999-02-10 | 信越半導体株式会社 | Method for measuring thickness of single crystal thin film on SOI substrate |
| DE60134120D1 (en) * | 2000-01-21 | 2008-07-03 | Hamamatsu Photonics Kk | THICKNESS MEASURING DEVICE, THICKNESS MEASURING MEASUREMENT AND NUTRITIONING APPARATUS AND METHOD OF USE THEREOF |
| US6319093B1 (en) * | 2001-02-06 | 2001-11-20 | International Business Machines Corporation | Chemical-mechanical polishing system and method for integrated spin dry-film thickness measurement |
| JP4223349B2 (en) * | 2003-08-13 | 2009-02-12 | フジノン株式会社 | Vibration-resistant interferometer device |
| JP4425747B2 (en) | 2004-08-30 | 2010-03-03 | フジノン株式会社 | Interferometer device for virtual contact surface measurement |
| US7483147B2 (en) * | 2004-11-10 | 2009-01-27 | Korea Advanced Institute Of Science And Technology (Kaist) | Apparatus and method for measuring thickness and profile of transparent thin film using white-light interferometer |
| ITBO20070504A1 (en) | 2007-07-20 | 2009-01-21 | Marposs Spa | EQUIPMENT AND METHOD FOR THE CONTROL OF THE THICKNESS OF A PROCESSED ELEMENT |
| JP5101312B2 (en) * | 2008-01-17 | 2012-12-19 | 株式会社ディスコ | Thickness measuring device and grinding device provided with the thickness measuring device |
| JP5473265B2 (en) * | 2008-07-09 | 2014-04-16 | キヤノン株式会社 | Multilayer structure measuring method and multilayer structure measuring apparatus |
| JP2010060420A (en) * | 2008-09-03 | 2010-03-18 | Tokyo Institute Of Technology | Surface shape and/or film thickness measuring method and its system |
| WO2010037452A1 (en) * | 2008-10-01 | 2010-04-08 | Peter Wolters Gmbh | Method for measuring the thickness of a discoidal workpiece |
| GB2478590A (en) * | 2010-03-12 | 2011-09-14 | Precitec Optronik Gmbh | Apparatus and method for monitoring a thickness of a silicon wafer |
| FR2959305B1 (en) * | 2010-04-26 | 2014-09-05 | Nanotec Solution | OPTICAL DEVICE AND METHOD FOR INSPECTING STRUCTURED OBJECTS. |
| JP2012021856A (en) * | 2010-07-14 | 2012-02-02 | Keyence Corp | Interference thickness meter |
| JP5752961B2 (en) * | 2011-03-11 | 2015-07-22 | 株式会社ディスコ | Measuring device |
| US9714825B2 (en) * | 2011-04-08 | 2017-07-25 | Rudolph Technologies, Inc. | Wafer shape thickness and trench measurement |
| DE102011051146B3 (en) * | 2011-06-17 | 2012-10-04 | Precitec Optronik Gmbh | Test method for testing a bonding layer between wafer-shaped samples |
-
2013
- 2013-07-26 IT IT000403A patent/ITBO20130403A1/en unknown
-
2014
- 2014-07-24 JP JP2016528537A patent/JP6509846B2/en active Active
- 2014-07-24 KR KR1020167005118A patent/KR102236207B1/en active IP Right Grant
- 2014-07-24 EP EP14742247.1A patent/EP3025121B1/en active Active
- 2014-07-24 CN CN201480041998.8A patent/CN105452801B/en active Active
- 2014-07-24 WO PCT/EP2014/065963 patent/WO2015011243A1/en active Application Filing
- 2014-07-24 SG SG11201600173WA patent/SG11201600173WA/en unknown
- 2014-07-24 CA CA2919136A patent/CA2919136A1/en not_active Abandoned
- 2014-07-24 MY MYPI2016000090A patent/MY176734A/en unknown
- 2014-07-24 US US14/905,541 patent/US9879978B2/en active Active
- 2014-07-25 TW TW103125507A patent/TWI638976B/en active
-
2016
- 2016-01-26 PH PH12016500188A patent/PH12016500188A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN105452801B (en) | 2019-04-26 |
| PH12016500188B1 (en) | 2016-05-16 |
| CA2919136A1 (en) | 2015-01-29 |
| JP6509846B2 (en) | 2019-05-08 |
| CN105452801A (en) | 2016-03-30 |
| KR20160037993A (en) | 2016-04-06 |
| MY176734A (en) | 2020-08-20 |
| EP3025121B1 (en) | 2020-06-10 |
| WO2015011243A1 (en) | 2015-01-29 |
| TWI638976B (en) | 2018-10-21 |
| TW201520509A (en) | 2015-06-01 |
| US9879978B2 (en) | 2018-01-30 |
| EP3025121A1 (en) | 2016-06-01 |
| US20160153769A1 (en) | 2016-06-02 |
| ITBO20130403A1 (en) | 2015-01-27 |
| KR102236207B1 (en) | 2021-04-06 |
| JP2016534332A (en) | 2016-11-04 |
| PH12016500188A1 (en) | 2016-05-16 |
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