SG11201405096WA - Photosensitive black resin composition and resin black matrix substrate - Google Patents

Photosensitive black resin composition and resin black matrix substrate

Info

Publication number
SG11201405096WA
SG11201405096WA SG11201405096WA SG11201405096WA SG11201405096WA SG 11201405096W A SG11201405096W A SG 11201405096WA SG 11201405096W A SG11201405096W A SG 11201405096WA SG 11201405096W A SG11201405096W A SG 11201405096WA SG 11201405096W A SG11201405096W A SG 11201405096WA
Authority
SG
Singapore
Prior art keywords
resin
black
matrix substrate
resin composition
photosensitive
Prior art date
Application number
SG11201405096WA
Other languages
English (en)
Inventor
Ryosuke Aihara
Yoshihiko Inoue
Original Assignee
Toray Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries filed Critical Toray Industries
Publication of SG11201405096WA publication Critical patent/SG11201405096WA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Optical Filters (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
SG11201405096WA 2012-03-26 2013-03-08 Photosensitive black resin composition and resin black matrix substrate SG11201405096WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012068902 2012-03-26
PCT/JP2013/056437 WO2013146183A1 (fr) 2012-03-26 2013-03-08 Composition de résine noire photosensible, et substrat de matrice noire en résine

Publications (1)

Publication Number Publication Date
SG11201405096WA true SG11201405096WA (en) 2014-11-27

Family

ID=49259451

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201405096WA SG11201405096WA (en) 2012-03-26 2013-03-08 Photosensitive black resin composition and resin black matrix substrate

Country Status (6)

Country Link
JP (1) JP5333696B1 (fr)
KR (1) KR101998449B1 (fr)
CN (1) CN104204945B (fr)
SG (1) SG11201405096WA (fr)
TW (1) TWI575314B (fr)
WO (1) WO2013146183A1 (fr)

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TWI544281B (zh) * 2014-11-25 2016-08-01 奇美實業股份有限公司 黑色矩陣用之感光性樹脂組成物及其應用
TWI613486B (zh) * 2014-08-01 2018-02-01 Toppan Printing Co Ltd 黑色電極基板、黑色電極基板之製造方法、及顯示裝置
TWI564657B (zh) * 2014-08-28 2017-01-01 Chi Mei Corp Photosensitive resin composition for color filter and its application
JP6607682B2 (ja) * 2015-03-05 2019-11-20 日鉄ケミカル＆マテリアル株式会社 遮光膜用黒色樹脂組成物、当該組成物を硬化させた遮光膜を有する遮光膜付基板、並びに当該遮光膜付基板を有するカラーフィルター及びタッチパネル
JPWO2016194619A1 (ja) * 2015-05-29 2018-03-22 住友ベークライト株式会社 着色感光性樹脂組成物、着色パターンまたはブラックマトリクス、カラーフィルタ、液晶表示装置または固体撮像素子およびカラーフィルタの製造方法
KR102431444B1 (ko) 2015-07-14 2022-08-11 삼성디스플레이 주식회사 액정 표시 장치 및 그 제조 방법
CN111149058B (zh) * 2017-09-22 2024-03-08 东丽株式会社 透明感光性树脂组合物及其应用、光刻间隔物和液晶显示装置及其制造方法
WO2019064993A1 (fr) * 2017-09-26 2019-04-04 富士フイルム株式会社 Structure, composition de formation de parois de séparation, élément d'imagerie à semi-conducteurs et dispositif d'affichage d'image
KR102229633B1 (ko) * 2017-12-26 2021-03-17 삼성에스디아이 주식회사 감광성 수지 조성물, 이를 이용한 감광성 수지막 및 컬러필터
KR102284582B1 (ko) * 2018-04-04 2021-08-02 삼성에스디아이 주식회사 적색 감광성 수지 조성물, 이를 이용한 감광성 수지막 및 컬러필터
KR20210115795A (ko) * 2020-03-16 2021-09-27 동우 화인켐 주식회사 흑색 감광성 수지 조성물, 블랙 매트릭스 및 화상표시장치
TWI744014B (zh) 2020-09-29 2021-10-21 新應材股份有限公司 黑色樹脂組成物、硬化膜以及黑色濾光片

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JP3230800B2 (ja) 1997-03-06 2001-11-19 日本化薬株式会社 黒色感放射線性樹脂組成物、黒色硬化膜及びブラックマトリックス
JP3921730B2 (ja) 1997-04-08 2007-05-30 三菱化学株式会社 カラーフィルター用光重合性組成物
JP2005258460A (ja) 1999-09-17 2005-09-22 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法
JP2001228610A (ja) 2000-02-15 2001-08-24 Showa Denko Kk 感光性樹脂組成物及び硬化皮膜の製造方法
JP4606684B2 (ja) * 2000-03-29 2011-01-05 学校法人神奈川大学 光硬化性・熱硬化性樹脂組成物、その感光性ドライフィルム及びそれを用いたパターン形成方法
JP4034588B2 (ja) * 2001-12-25 2008-01-16 旭化成ケミカルズ株式会社 感光性を有する着色性組成物およびその硬化物
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JP4947300B2 (ja) * 2007-06-14 2012-06-06 Ｊｓｒ株式会社 感放射線性樹脂組成物、層間絶縁膜およびマイクロレンズならびにそれらの形成方法
KR101602005B1 (ko) * 2009-03-30 2016-03-17 제이에스알 가부시끼가이샤 착색 조성물, 컬러 필터 및 컬러 액정 표시 소자
JP2011048064A (ja) * 2009-08-26 2011-03-10 Asahi Kasei E-Materials Corp 感光性樹脂組成物及び積層体、並びにこれを用いた電磁波シールド及び透明導電性基板
JP5515714B2 (ja) * 2009-12-16 2014-06-11 Ｊｓｒ株式会社 着色組成物、カラーフィルタおよびカラー液晶表示素子
KR20110130151A (ko) * 2010-05-27 2011-12-05 동우 화인켐 주식회사 흑색 감광성 수지 조성물, 컬러 필터 및 이를 구비한 액정 표시 장치
JP2012008262A (ja) * 2010-06-23 2012-01-12 Fujifilm Corp 着色感光性樹脂組成物、パターン形成方法、カラーフィルタの製造方法、カラーフィルタ、およびそれを備えた表示装置
KR20120002864A (ko) * 2010-07-01 2012-01-09 동우 화인켐 주식회사 흑색 감광성 수지 조성물, 컬러 필터 및 이를 구비한 액정 표시 장치
EP2590025B1 (fr) * 2010-07-02 2014-09-17 Toray Industries, Inc. Composition de résine photosensible, pellicule de composition de résine photosensible, et dispositif semi-conducteur utilisant la composition de résine photosensible ou la pellicule de composition de résine photosensible

Also Published As

Publication number Publication date
CN104204945B (zh) 2017-10-03
JP5333696B1 (ja) 2013-11-06
TW201348864A (zh) 2013-12-01
KR101998449B1 (ko) 2019-07-09
WO2013146183A1 (fr) 2013-10-03
JPWO2013146183A1 (ja) 2015-12-10
TWI575314B (zh) 2017-03-21
CN104204945A (zh) 2014-12-10
KR20140148377A (ko) 2014-12-31

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