SG11201400643SA - Controlling the temperature of an object - Google Patents

Controlling the temperature of an object

Info

Publication number
SG11201400643SA
SG11201400643SA SG11201400643SA SG11201400643SA SG11201400643SA SG 11201400643S A SG11201400643S A SG 11201400643SA SG 11201400643S A SG11201400643S A SG 11201400643SA SG 11201400643S A SG11201400643S A SG 11201400643SA SG 11201400643S A SG11201400643S A SG 11201400643SA
Authority
SG
Singapore
Prior art keywords
controlling
temperature
Prior art date
Application number
SG11201400643SA
Inventor
Larry W Akers
Nathan Blosser
Brian S Merrow
Original Assignee
Teradyne Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teradyne Inc filed Critical Teradyne Inc
Publication of SG11201400643SA publication Critical patent/SG11201400643SA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554—Forced ventilation of a gaseous coolant
    • H05K7/20563—Forced ventilation of a gaseous coolant within sub-racks for removing heat from electronic boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Other Air-Conditioning Systems (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Devices For Use In Laboratory Experiments (AREA)
  • Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)
SG11201400643SA 2011-10-31 2012-10-02 Controlling the temperature of an object SG11201400643SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161553681P 2011-10-31 2011-10-31
PCT/US2012/058454 WO2013066547A1 (en) 2011-10-31 2012-10-02 Controlling the temperature of an object

Publications (1)

Publication Number Publication Date
SG11201400643SA true SG11201400643SA (en) 2014-04-28

Family

ID=48172549

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201400643SA SG11201400643SA (en) 2011-10-31 2012-10-02 Controlling the temperature of an object

Country Status (5)

Country Link
US (1) US9002186B2 (en)
KR (1) KR20140089374A (en)
CN (1) CN103907411B (en)
SG (1) SG11201400643SA (en)
WO (1) WO2013066547A1 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9459312B2 (en) * 2013-04-10 2016-10-04 Teradyne, Inc. Electronic assembly test system
US9578786B1 (en) * 2014-06-10 2017-02-21 Amazon Technologies, Inc. Computer system with bypass air plenum
US10948534B2 (en) 2017-08-28 2021-03-16 Teradyne, Inc. Automated test system employing robotics
US10845410B2 (en) 2017-08-28 2020-11-24 Teradyne, Inc. Automated test system having orthogonal robots
US10725091B2 (en) 2017-08-28 2020-07-28 Teradyne, Inc. Automated test system having multiple stages
US11226390B2 (en) 2017-08-28 2022-01-18 Teradyne, Inc. Calibration process for an automated test system
US10368467B2 (en) * 2017-10-10 2019-07-30 Facebook, Inc. System and method for data center heat containment
US10983145B2 (en) 2018-04-24 2021-04-20 Teradyne, Inc. System for testing devices inside of carriers
US10775408B2 (en) 2018-08-20 2020-09-15 Teradyne, Inc. System for testing devices inside of carriers
US11353375B2 (en) 2019-06-28 2022-06-07 Teradyne, Inc. Using vibrations to position devices in a test system
US11953519B2 (en) 2020-10-22 2024-04-09 Teradyne, Inc. Modular automated test system
US11867749B2 (en) 2020-10-22 2024-01-09 Teradyne, Inc. Vision system for an automated test system
US11754596B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Test site configuration in an automated test system
US11899042B2 (en) 2020-10-22 2024-02-13 Teradyne, Inc. Automated test system
US11754622B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Thermal control system for an automated test system
US12007411B2 (en) 2021-06-22 2024-06-11 Teradyne, Inc. Test socket having an automated lid
US11968808B2 (en) * 2022-01-14 2024-04-23 Dell Products L.P. Heater apparatus-integrated bezel for a computing device
US11968807B2 (en) * 2022-01-14 2024-04-23 Dell Products L.P. Heater apparatus and air circulation component-integrated bezel for a computing device

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5477417A (en) * 1992-08-28 1995-12-19 Kabushiki Kaisha Toshiba Electronic equipment having integrated circuit device and temperature sensor
JP3028462B2 (en) * 1995-05-12 2000-04-04 東京エレクトロン株式会社 Heat treatment equipment
JP3833439B2 (en) * 2000-05-02 2006-10-11 株式会社ノリタケカンパニーリミテド Multistage heating furnace for large substrates, double-sided heating type far-infrared panel heater, and air supply / exhaust method in the heating furnace
US6512672B1 (en) * 2000-12-29 2003-01-28 Cisco Technology, Inc. Modular air flow distribution system
US7022192B2 (en) * 2002-09-04 2006-04-04 Tokyo Electron Limited Semiconductor wafer susceptor
US7394654B2 (en) * 2006-10-19 2008-07-01 Cisco Technology, Inc. Method and apparatus for providing thermal management in an electronic device
US7885066B2 (en) * 2008-07-17 2011-02-08 Juniper Networks, Inc. Airflow/cooling solution for chassis with orthogonal boards
US7643290B1 (en) * 2008-07-23 2010-01-05 Cisco Technology, Inc. Techniques utilizing thermal, EMI and FIPS friendly electronic modules
US8547123B2 (en) * 2009-07-15 2013-10-01 Teradyne, Inc. Storage device testing system with a conductive heating assembly
US7995349B2 (en) * 2009-07-15 2011-08-09 Teradyne, Inc. Storage device temperature sensing
US8628239B2 (en) * 2009-07-15 2014-01-14 Teradyne, Inc. Storage device temperature sensing
US8466699B2 (en) * 2009-07-15 2013-06-18 Teradyne, Inc. Heating storage devices in a testing system
US20110303100A1 (en) * 2010-06-11 2011-12-15 Prince Castle LLC Conveyor Toaster with Air-Cooled Panels
CN201957357U (en) * 2011-01-30 2011-08-31 广东佳和通信技术有限公司 Case and communication equipment comprising same

Also Published As

Publication number Publication date
WO2013066547A1 (en) 2013-05-10
CN103907411B (en) 2016-05-18
US20130108253A1 (en) 2013-05-02
KR20140089374A (en) 2014-07-14
CN103907411A (en) 2014-07-02
US9002186B2 (en) 2015-04-07

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