SG10202004261TA - Cross flow manifold for electroplating apparatus - Google Patents

Cross flow manifold for electroplating apparatus

Info

Publication number
SG10202004261TA
SG10202004261TA SG10202004261TA SG10202004261TA SG10202004261TA SG 10202004261T A SG10202004261T A SG 10202004261TA SG 10202004261T A SG10202004261T A SG 10202004261TA SG 10202004261T A SG10202004261T A SG 10202004261TA SG 10202004261T A SG10202004261T A SG 10202004261TA
Authority
SG
Singapore
Prior art keywords
cross flow
electroplating apparatus
flow manifold
manifold
electroplating
Prior art date
Application number
SG10202004261TA
Other languages
English (en)
Inventor
Richard Abraham
Steven T Mayer
Bryan L Buckalew
Robert Rash
Original Assignee
Novellus Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Novellus Systems Inc filed Critical Novellus Systems Inc
Publication of SG10202004261TA publication Critical patent/SG10202004261TA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
SG10202004261TA 2012-05-14 2013-05-13 Cross flow manifold for electroplating apparatus SG10202004261TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201261646598P 2012-05-14 2012-05-14

Publications (1)

Publication Number Publication Date
SG10202004261TA true SG10202004261TA (en) 2020-06-29

Family

ID=49854985

Family Applications (3)

Application Number Title Priority Date Filing Date
SG10201509320WA SG10201509320WA (en) 2012-05-14 2013-05-13 Cross flow manifold for electroplating apparatus
SG2013037437A SG195480A1 (en) 2012-05-14 2013-05-13 Cross flow manifold for electroplating apparatus
SG10202004261TA SG10202004261TA (en) 2012-05-14 2013-05-13 Cross flow manifold for electroplating apparatus

Family Applications Before (2)

Application Number Title Priority Date Filing Date
SG10201509320WA SG10201509320WA (en) 2012-05-14 2013-05-13 Cross flow manifold for electroplating apparatus
SG2013037437A SG195480A1 (en) 2012-05-14 2013-05-13 Cross flow manifold for electroplating apparatus

Country Status (3)

Country Link
KR (1) KR102142159B1 (zh)
SG (3) SG10201509320WA (zh)
TW (1) TWI589734B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI550139B (zh) * 2011-04-04 2016-09-21 諾菲勒斯系統公司 用於裁整均勻輪廓之電鍍裝置
US9816194B2 (en) * 2015-03-19 2017-11-14 Lam Research Corporation Control of electrolyte flow dynamics for uniform electroplating
US10364505B2 (en) * 2016-05-24 2019-07-30 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
US20190048467A1 (en) * 2017-08-10 2019-02-14 Applied Materials, Inc. Showerhead and process chamber incorporating same
WO2020046567A1 (en) 2018-08-29 2020-03-05 Applied Materials, Inc. Chamber injector
US11814743B2 (en) * 2020-06-15 2023-11-14 Taiwan Semiconductor Manufacturing Company, Ltd. Plating membrane
EP4219799A1 (en) * 2022-01-27 2023-08-02 Semsysco GmbH System for a chemical and/or electrolytic surface treatment of a substrate

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8308931B2 (en) * 2006-08-16 2012-11-13 Novellus Systems, Inc. Method and apparatus for electroplating
US8475636B2 (en) * 2008-11-07 2013-07-02 Novellus Systems, Inc. Method and apparatus for electroplating
US6869515B2 (en) * 2001-03-30 2005-03-22 Uri Cohen Enhanced electrochemical deposition (ECD) filling of high aspect ratio openings
US8795480B2 (en) * 2010-07-02 2014-08-05 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating

Also Published As

Publication number Publication date
SG10201509320WA (en) 2015-12-30
KR102142159B1 (ko) 2020-08-07
KR20130127400A (ko) 2013-11-22
TW201410925A (zh) 2014-03-16
SG195480A1 (en) 2013-12-30
TWI589734B (zh) 2017-07-01

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