SG10201507919TA - Method and apparatus for dc voltage control on rf-powered electrode - Google Patents
Method and apparatus for dc voltage control on rf-powered electrodeInfo
- Publication number
- SG10201507919TA SG10201507919TA SG10201507919TA SG10201507919TA SG10201507919TA SG 10201507919T A SG10201507919T A SG 10201507919TA SG 10201507919T A SG10201507919T A SG 10201507919TA SG 10201507919T A SG10201507919T A SG 10201507919TA SG 10201507919T A SG10201507919T A SG 10201507919TA
- Authority
- SG
- Singapore
- Prior art keywords
- voltage control
- powered electrode
- powered
- electrode
- voltage
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32642—Focus rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32697—Electrostatic control
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US90934307P | 2007-03-30 | 2007-03-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201507919TA true SG10201507919TA (en) | 2015-10-29 |
Family
ID=39794867
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201507919TA SG10201507919TA (en) | 2007-03-30 | 2008-03-26 | Method and apparatus for dc voltage control on rf-powered electrode |
Country Status (7)
Country | Link |
---|---|
US (1) | US9536711B2 (en) |
JP (1) | JP5432119B2 (en) |
KR (1) | KR101495368B1 (en) |
CN (1) | CN101653048B (en) |
SG (1) | SG10201507919TA (en) |
TW (2) | TWI525655B (en) |
WO (1) | WO2008121655A1 (en) |
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US7988816B2 (en) * | 2004-06-21 | 2011-08-02 | Tokyo Electron Limited | Plasma processing apparatus and method |
US7572737B1 (en) * | 2006-06-30 | 2009-08-11 | Lam Research Corporation | Apparatus and methods for adjusting an edge ring potential substrate processing |
US8563619B2 (en) * | 2007-06-28 | 2013-10-22 | Lam Research Corporation | Methods and arrangements for plasma processing system with tunable capacitance |
US8540844B2 (en) * | 2008-12-19 | 2013-09-24 | Lam Research Corporation | Plasma confinement structures in plasma processing systems |
US8869741B2 (en) * | 2008-12-19 | 2014-10-28 | Lam Research Corporation | Methods and apparatus for dual confinement and ultra-high pressure in an adjustable gap plasma chamber |
US20110011534A1 (en) * | 2009-07-17 | 2011-01-20 | Rajinder Dhindsa | Apparatus for adjusting an edge ring potential during substrate processing |
JP5502879B2 (en) * | 2009-09-29 | 2014-05-28 | 株式会社東芝 | Substrate processing equipment |
DE202010014805U1 (en) * | 2009-11-02 | 2011-02-17 | Lam Research Corporation (Delaware Corporation) | Hot edge ring with inclined upper surface |
US9194045B2 (en) * | 2012-04-03 | 2015-11-24 | Novellus Systems, Inc. | Continuous plasma and RF bias to regulate damage in a substrate processing system |
US20140273538A1 (en) * | 2013-03-15 | 2014-09-18 | Tokyo Electron Limited | Non-ambipolar electric pressure plasma uniformity control |
CN104217914B (en) * | 2013-05-31 | 2016-12-28 | 中微半导体设备(上海)有限公司 | Plasma processing apparatus |
US9145607B2 (en) | 2013-10-22 | 2015-09-29 | Lam Research Corporation | Tandem source activation for cyclical deposition of films |
US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
WO2016060712A1 (en) | 2014-10-17 | 2016-04-21 | Applied Materials, Inc. | Cmp pad construction with composite material properties using additive manufacturing processes |
US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
JP6424120B2 (en) * | 2015-03-23 | 2018-11-14 | 東京エレクトロン株式会社 | Power supply system, plasma processing apparatus, and power supply control method |
US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
US9852889B1 (en) * | 2016-06-22 | 2017-12-26 | Lam Research Corporation | Systems and methods for controlling directionality of ions in an edge region by using an electrode within a coupling ring |
KR20180072917A (en) * | 2016-12-21 | 2018-07-02 | 삼성전자주식회사 | dielectric window, plasma apparatus including the same, and method for manufacturing dielectric window |
US10335909B2 (en) * | 2017-04-04 | 2019-07-02 | Sakai Display Products Corporation | Vapor deposition apparatus, vapor deposition method and method of manufacturing organic EL display apparatus |
US20180323042A1 (en) * | 2017-05-02 | 2018-11-08 | Applied Materials, Inc. | Method to modulate the wafer edge sheath in a plasma processing chamber |
US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
CN107779845A (en) * | 2017-10-30 | 2018-03-09 | 武汉华星光电半导体显示技术有限公司 | Chemical vapor depsotition equipment and film build method |
AT520558B1 (en) * | 2017-11-27 | 2019-05-15 | Avl List Gmbh | Recursive, time series-based method for determining the state of an electrochemical reactor |
JP6932070B2 (en) * | 2017-11-29 | 2021-09-08 | 東京エレクトロン株式会社 | Focus ring and semiconductor manufacturing equipment |
JP7055040B2 (en) | 2018-03-07 | 2022-04-15 | 東京エレクトロン株式会社 | Placement device and processing device for the object to be processed |
JP6846384B2 (en) * | 2018-06-12 | 2021-03-24 | 東京エレクトロン株式会社 | Method of controlling high frequency power supply of plasma processing equipment and plasma processing equipment |
CN111095502B (en) * | 2018-06-22 | 2024-04-05 | 东京毅力科创株式会社 | Plasma processing apparatus and plasma etching method |
US11557460B2 (en) | 2018-07-09 | 2023-01-17 | Lam Research Corporation | Radio frequency (RF) signal source supplying RF plasma generator and remote plasma generator |
WO2020050932A1 (en) | 2018-09-04 | 2020-03-12 | Applied Materials, Inc. | Formulations for advanced polishing pads |
WO2020068107A1 (en) * | 2018-09-28 | 2020-04-02 | Lam Research Corporation | Systems and methods for optimizing power delivery to an electrode of a plasma chamber |
WO2020096723A1 (en) | 2018-11-09 | 2020-05-14 | Applied Materials, Inc. | Radio frequency filter system for a processing chamber |
US11289310B2 (en) * | 2018-11-21 | 2022-03-29 | Applied Materials, Inc. | Circuits for edge ring control in shaped DC pulsed plasma process device |
CN111383887A (en) * | 2018-12-27 | 2020-07-07 | 江苏鲁汶仪器有限公司 | Device and method for improving plasma etching uniformity |
KR102256216B1 (en) * | 2019-06-27 | 2021-05-26 | 세메스 주식회사 | Plasma processing apparatus and method |
KR102214333B1 (en) | 2019-06-27 | 2021-02-10 | 세메스 주식회사 | Apparatus and method for treating substrate |
TWI767655B (en) * | 2020-05-01 | 2022-06-11 | 日商東京威力科創股份有限公司 | Etching apparatus and etching method |
JP7516198B2 (en) | 2020-05-01 | 2024-07-16 | 東京エレクトロン株式会社 | Etching apparatus and method |
KR20220013046A (en) * | 2020-07-24 | 2022-02-04 | 세메스 주식회사 | Apparatus for treating substrate and method for treating apparatus |
US11967483B2 (en) * | 2021-06-02 | 2024-04-23 | Applied Materials, Inc. | Plasma excitation with ion energy control |
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JPS5825742B2 (en) | 1979-12-22 | 1983-05-30 | 富士通株式会社 | Plasma etching processing method and processing equipment |
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US20040027781A1 (en) | 2002-08-12 | 2004-02-12 | Hiroji Hanawa | Low loss RF bias electrode for a plasma reactor with enhanced wafer edge RF coupling and highly efficient wafer cooling |
CN100418187C (en) * | 2003-02-07 | 2008-09-10 | 东京毅力科创株式会社 | Plasma processing device, annular element and plasma processing method |
JP3905870B2 (en) * | 2003-08-01 | 2007-04-18 | 東京エレクトロン株式会社 | Plasma processing equipment |
US7244336B2 (en) * | 2003-12-17 | 2007-07-17 | Lam Research Corporation | Temperature controlled hot edge ring assembly for reducing plasma reactor etch rate drift |
US7951262B2 (en) | 2004-06-21 | 2011-05-31 | Tokyo Electron Limited | Plasma processing apparatus and method |
US7740737B2 (en) | 2004-06-21 | 2010-06-22 | Tokyo Electron Limited | Plasma processing apparatus and method |
US7988816B2 (en) | 2004-06-21 | 2011-08-02 | Tokyo Electron Limited | Plasma processing apparatus and method |
US20060043067A1 (en) * | 2004-08-26 | 2006-03-02 | Lam Research Corporation | Yttria insulator ring for use inside a plasma chamber |
US7988814B2 (en) * | 2006-03-17 | 2011-08-02 | Tokyo Electron Limited | Plasma processing apparatus, plasma processing method, focus ring, and focus ring component |
-
2008
- 2008-03-13 US US12/047,820 patent/US9536711B2/en active Active
- 2008-03-26 JP JP2010501198A patent/JP5432119B2/en not_active Expired - Fee Related
- 2008-03-26 WO PCT/US2008/058316 patent/WO2008121655A1/en active Application Filing
- 2008-03-26 CN CN200880011076.7A patent/CN101653048B/en active Active
- 2008-03-26 KR KR1020097020366A patent/KR101495368B1/en active IP Right Grant
- 2008-03-26 SG SG10201507919TA patent/SG10201507919TA/en unknown
- 2008-03-28 TW TW103121047A patent/TWI525655B/en active
- 2008-03-28 TW TW097111298A patent/TWI451468B/en active
Also Published As
Publication number | Publication date |
---|---|
CN101653048A (en) | 2010-02-17 |
CN101653048B (en) | 2015-09-23 |
WO2008121655A1 (en) | 2008-10-09 |
TW200845091A (en) | 2008-11-16 |
US9536711B2 (en) | 2017-01-03 |
JP5432119B2 (en) | 2014-03-05 |
KR20090129446A (en) | 2009-12-16 |
US20080241420A1 (en) | 2008-10-02 |
KR101495368B1 (en) | 2015-02-24 |
JP2010524157A (en) | 2010-07-15 |
TWI451468B (en) | 2014-09-01 |
TW201438055A (en) | 2014-10-01 |
TWI525655B (en) | 2016-03-11 |
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