SE9904516L - Mellanläggsanordning - Google Patents

Mellanläggsanordning

Info

Publication number
SE9904516L
SE9904516L SE9904516A SE9904516A SE9904516L SE 9904516 L SE9904516 L SE 9904516L SE 9904516 A SE9904516 A SE 9904516A SE 9904516 A SE9904516 A SE 9904516A SE 9904516 L SE9904516 L SE 9904516L
Authority
SE
Sweden
Prior art keywords
substrate
chip
electrodes
interposer device
pattern
Prior art date
Application number
SE9904516A
Other languages
English (en)
Other versions
SE516936C2 (sv
SE9904516D0 (sv
Inventor
Ulf Christian Bjoerkengren
Torbjoern Gaerdenfors
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9904516A priority Critical patent/SE516936C2/sv
Publication of SE9904516D0 publication Critical patent/SE9904516D0/sv
Priority to CNB008169470A priority patent/CN1284236C/zh
Priority to MYPI20005782A priority patent/MY127045A/en
Priority to EP00986140A priority patent/EP1236228A1/en
Priority to PCT/SE2000/002465 priority patent/WO2001043190A1/en
Priority to US09/732,818 priority patent/US6493056B2/en
Priority to AU22432/01A priority patent/AU2243201A/en
Priority to JP2001543778A priority patent/JP2003516560A/ja
Publication of SE9904516L publication Critical patent/SE9904516L/sv
Publication of SE516936C2 publication Critical patent/SE516936C2/sv

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15173—Fan-out arrangement of the internal vias in a single layer of the multilayer substrate

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Wire Bonding (AREA)
SE9904516A 1999-12-10 1999-12-10 Flytande-kristalldisplay, LCD SE516936C2 (sv)

Priority Applications (8)

Application Number Priority Date Filing Date Title
SE9904516A SE516936C2 (sv) 1999-12-10 1999-12-10 Flytande-kristalldisplay, LCD
CNB008169470A CN1284236C (zh) 1999-12-10 2000-12-08 内插装置
MYPI20005782A MY127045A (en) 1999-12-10 2000-12-08 Interposer device
EP00986140A EP1236228A1 (en) 1999-12-10 2000-12-08 Interposer device
PCT/SE2000/002465 WO2001043190A1 (en) 1999-12-10 2000-12-08 Interposer device
US09/732,818 US6493056B2 (en) 1999-12-10 2000-12-08 Interposer device
AU22432/01A AU2243201A (en) 1999-12-10 2000-12-08 Interposer device
JP2001543778A JP2003516560A (ja) 1999-12-10 2000-12-08 インタポーザ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9904516A SE516936C2 (sv) 1999-12-10 1999-12-10 Flytande-kristalldisplay, LCD

Publications (3)

Publication Number Publication Date
SE9904516D0 SE9904516D0 (sv) 1999-12-10
SE9904516L true SE9904516L (sv) 2001-06-11
SE516936C2 SE516936C2 (sv) 2002-03-26

Family

ID=20418069

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9904516A SE516936C2 (sv) 1999-12-10 1999-12-10 Flytande-kristalldisplay, LCD

Country Status (8)

Country Link
US (1) US6493056B2 (sv)
EP (1) EP1236228A1 (sv)
JP (1) JP2003516560A (sv)
CN (1) CN1284236C (sv)
AU (1) AU2243201A (sv)
MY (1) MY127045A (sv)
SE (1) SE516936C2 (sv)
WO (1) WO2001043190A1 (sv)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6806938B2 (en) * 2001-08-30 2004-10-19 Kyocera Corporation Liquid crystal display device with particular on substrate wiring, portable terminal and display equipment provided with the liquid crystal display device
JP2003295218A (ja) * 2002-04-04 2003-10-15 Advanced Display Inc 表示装置
EP1585102A1 (en) * 2004-03-30 2005-10-12 Dialog Semiconductor GmbH Interlaced multiple line addressing (MLA) LCD STN driver
JP2007139912A (ja) * 2005-11-15 2007-06-07 Sharp Corp 駆動素子実装表示装置
TW200720738A (en) * 2005-11-18 2007-06-01 Innolux Display Corp Liquid crystal display panel
AT9551U1 (de) * 2006-05-16 2007-11-15 Austria Tech & System Tech Verfahren zum festlegen eines elektronischen bauteils auf einer leiterplatte sowie system bestehend aus einer leiterplatte und wenigstens einem elektronischen bauteil
KR100798896B1 (ko) * 2007-06-07 2008-01-29 주식회사 실리콘웍스 반도체 칩의 패드 배치 구조
JP5452290B2 (ja) * 2010-03-05 2014-03-26 ラピスセミコンダクタ株式会社 表示パネル
KR20150114632A (ko) * 2014-04-01 2015-10-13 삼성디스플레이 주식회사 터치 유닛 및 이를 포함하는 터치 표시 장치
KR102243669B1 (ko) * 2015-01-26 2021-04-23 삼성전자주식회사 칩 온 필름 패키지 및 이를 포함하는 디스플레이 장치

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60130721A (ja) * 1983-12-19 1985-07-12 Citizen Watch Co Ltd 液晶表示装置
JPS62136063A (ja) * 1985-12-10 1987-06-19 Citizen Watch Co Ltd 集積回路
DE3910963A1 (de) * 1989-04-05 1990-10-11 Licentia Gmbh Schaltungsanordnung
KR100370698B1 (ko) 1992-09-08 2003-03-31 세이코 엡슨 가부시키가이샤 액정표시장치
JP3321925B2 (ja) * 1992-09-08 2002-09-09 セイコーエプソン株式会社 液晶表示装置、半導体チップの実装構造、電子光学装置および電子印字装置
US5467210A (en) 1993-02-16 1995-11-14 Casio Computer Co., Ltd. Arrangement of bonding IC chip to liquid crystal display device
KR100321883B1 (ko) * 1993-11-12 2002-06-20 구사마 사부로 반도체소자의실장구조및실장방법과,액정표시장치
EP0735404A4 (en) * 1994-09-16 1998-11-18 Seiko Epson Corp LIQUID CRYSTAL DISPLAY, ITS MOUNTING STRUCTURE, AND ELECTRONIC DEVICE
JP3487524B2 (ja) 1994-12-20 2004-01-19 株式会社ルネサステクノロジ 半導体装置及びその製造方法
JP3082129B2 (ja) * 1995-03-27 2000-08-28 セイコーインスツルメンツ株式会社 液晶表示装置
US5637920A (en) * 1995-10-04 1997-06-10 Lsi Logic Corporation High contact density ball grid array package for flip-chips
JPH09297318A (ja) * 1996-03-06 1997-11-18 Seiko Epson Corp 液晶装置、液晶装置の製造方法および電子機器
JP2730572B2 (ja) * 1996-03-21 1998-03-25 日本電気株式会社 液晶表示装置及びその製造方法
JPH11102932A (ja) * 1997-07-30 1999-04-13 Seiko Epson Corp Ｉｃ実装構造、液晶装置及び電子機器
JP3548682B2 (ja) * 1998-03-25 2004-07-28 シャープ株式会社 半導体チップおよびそれを備えるテープキャリアパッケージ
JP2000259091A (ja) * 1999-03-04 2000-09-22 Casio Comput Co Ltd 表示パネル、フレキシブル配線基板及びそれらを備えた表示装置

Also Published As

Publication number Publication date
CN1409874A (zh) 2003-04-09
EP1236228A1 (en) 2002-09-04
JP2003516560A (ja) 2003-05-13
SE516936C2 (sv) 2002-03-26
SE9904516D0 (sv) 1999-12-10
AU2243201A (en) 2001-06-18
WO2001043190A1 (en) 2001-06-14
US6493056B2 (en) 2002-12-10
CN1284236C (zh) 2006-11-08
MY127045A (en) 2006-11-30
US20010015785A1 (en) 2001-08-23

Similar Documents

Publication Publication Date Title
ATE313834T1 (de) Chipkarte mit display
SG146414A1 (en) Semiconductor device test apparatus
EP1282169A3 (en) IC chip mounting structure and display device
TW371358B (en) Semiconductor device
GB2317268B (en) Integral copper column withsolder bump flip-chip
EP1403685A3 (en) Liquid crystal display device
MY112054A (en) Display device and ic chip used in the same
SE9904516L (sv) Mellanläggsanordning
TW200407608A (en) Substrate for a display device, liquid crystal display device and method of manufacturing the same
MY112462A (en) Liquid crystal display device and process for producing same
EP0971406A3 (en) Chip-sized semiconductor device
EP1321983A3 (en) Wiring board and semiconductor device
WO2007136932A3 (en) Integrated circuit having pads and input/output (i/o) cells
TWI264127B (en) Chip package and substrate thereof
AU4415800A (en) Method for the production of a portable integrated circuit electronic device comprising a low-cost dielectric
AU2003274530A1 (en) Integrated circuit with at least one bump
EP1022775A4 (en) SEMICONDUCTOR ASSEMBLY, MOUNTING STRUCTURE AND ASSEMBLED MANUFACTURING METHOD
CA2156795A1 (en) An electronic device assembly and a manufacturing method of the same
WO2002044799A1 (fr) Dispositif detecteur du motif de circuit et procede de detection de motif de circuit
AU5410300A (en) Device and method for making devices comprising at least a chip fixed on a support
EP0886368A3 (en) Power semiconductor switching device
TW341726B (en) Flip-chip type connection with elastic contacts
KR970007429A (ko) 액정표시장치의 패드구조 및 그 제조방법
TW200509342A (en) Chip structure
TWI267143B (en) Forming a cap above a metal layer

Legal Events

Date Code Title Description
NUG Patent has lapsed