SE7410847L - - Google Patents

Info

Publication number
SE7410847L
SE7410847L SE7410847A SE7410847A SE7410847L SE 7410847 L SE7410847 L SE 7410847L SE 7410847 A SE7410847 A SE 7410847A SE 7410847 A SE7410847 A SE 7410847A SE 7410847 L SE7410847 L SE 7410847L
Authority
SE
Sweden
Application number
SE7410847A
Other versions
SE390360B (sv
Inventor
R Denda
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of SE7410847L publication Critical patent/SE7410847L/xx
Publication of SE390360B publication Critical patent/SE390360B/sv

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157Partial encapsulation or coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
SE7410847A 1973-08-28 1974-08-27 Halvledaranordning innefattande ett passiverande glasskikt, vilket er teckt med ett forseglingslager av glas med legre mjukningspunkt en det i glasskiktet ingaende glaset SE390360B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48096310A JPS5046079A (sv) 1973-08-28 1973-08-28

Publications (2)

Publication Number Publication Date
SE7410847L true SE7410847L (sv) 1975-03-03
SE390360B SE390360B (sv) 1976-12-13

Family

ID=14161437

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7410847A SE390360B (sv) 1973-08-28 1974-08-27 Halvledaranordning innefattande ett passiverande glasskikt, vilket er teckt med ett forseglingslager av glas med legre mjukningspunkt en det i glasskiktet ingaende glaset

Country Status (3)

Country Link
JP (1) JPS5046079A (sv)
DE (1) DE2440917A1 (sv)
SE (1) SE390360B (sv)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61234059A (ja) * 1985-04-10 1986-10-18 Hitachi Ltd 半導体素子の沸謄冷却装置

Also Published As

Publication number Publication date
JPS5046079A (sv) 1975-04-24
DE2440917A1 (de) 1975-03-27
SE390360B (sv) 1976-12-13

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