SE547728C2 - Liquid cooled module with air bubble trap - Google Patents
Liquid cooled module with air bubble trapInfo
- Publication number
- SE547728C2 SE547728C2 SE2350291A SE2350291A SE547728C2 SE 547728 C2 SE547728 C2 SE 547728C2 SE 2350291 A SE2350291 A SE 2350291A SE 2350291 A SE2350291 A SE 2350291A SE 547728 C2 SE547728 C2 SE 547728C2
- Authority
- SE
- Sweden
- Prior art keywords
- air bubble
- bubble trap
- liquid cooled
- cooled module
- shaped
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/656—Means for temperature control structurally associated with the cells characterised by the type of heat-exchange fluid
- H01M10/6567—Liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/656—Means for temperature control structurally associated with the cells characterised by the type of heat-exchange fluid
- H01M10/6561—Gases
- H01M10/6566—Means within the gas flow to guide the flow around one or more cells, e.g. manifolds, baffles or other barriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- External Artificial Organs (AREA)
- Sampling And Sample Adjustment (AREA)
- Farming Of Fish And Shellfish (AREA)
Abstract
Described is among other things a liquid cooled module (1) comprising a bubble trap arrangement (170, 180) comprising an air bubble structure (171, 181), wherein the air bubble trap structure (171) is shaped as a cut off cone or pyramid, or wherein the air bubble trap structure (181) is shaped as a half sphere.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE2350291A SE547728C2 (en) | 2021-05-06 | 2021-05-06 | Liquid cooled module with air bubble trap |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE2350291A SE547728C2 (en) | 2021-05-06 | 2021-05-06 | Liquid cooled module with air bubble trap |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| SE2350291A1 SE2350291A1 (en) | 2023-03-16 |
| SE547728C2 true SE547728C2 (en) | 2025-11-18 |
Family
ID=85795607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE2350291A SE547728C2 (en) | 2021-05-06 | 2021-05-06 | Liquid cooled module with air bubble trap |
Country Status (1)
| Country | Link |
|---|---|
| SE (1) | SE547728C2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE547746C2 (en) * | 2023-04-05 | 2025-11-18 | Apr Tech Ab | A closed system with partially filled barrier bag for thermal expansion and a thermal management system |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0200221A2 (en) * | 1985-04-30 | 1986-11-05 | Fujitsu Limited | Evaporation cooling module for semiconductor devices |
| US20080141875A1 (en) * | 2006-12-13 | 2008-06-19 | Jurgen Fahrenback | Cooled energy storage device and press including such a device |
| CN111740063A (en) * | 2020-07-10 | 2020-10-02 | 大连理工大学 | A cylindrical battery module holder with bubble baffle for two-phase immersion liquid cooling |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2708495B2 (en) * | 1988-09-19 | 1998-02-04 | 株式会社日立製作所 | Semiconductor cooling device |
| JPH05136305A (en) * | 1991-11-08 | 1993-06-01 | Hitachi Ltd | Cooling device for heating element |
| DE102012111970A1 (en) * | 2012-12-07 | 2014-06-12 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Battery assembly and method for cooling a battery |
| DE102016109277A1 (en) * | 2016-05-20 | 2017-11-23 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | battery module |
| EP3696876A1 (en) * | 2019-02-18 | 2020-08-19 | 3M Innovative Properties Company | Battery module |
-
2021
- 2021-05-06 SE SE2350291A patent/SE547728C2/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0200221A2 (en) * | 1985-04-30 | 1986-11-05 | Fujitsu Limited | Evaporation cooling module for semiconductor devices |
| US20080141875A1 (en) * | 2006-12-13 | 2008-06-19 | Jurgen Fahrenback | Cooled energy storage device and press including such a device |
| CN111740063A (en) * | 2020-07-10 | 2020-10-02 | 大连理工大学 | A cylindrical battery module holder with bubble baffle for two-phase immersion liquid cooling |
Also Published As
| Publication number | Publication date |
|---|---|
| SE2350291A1 (en) | 2023-03-16 |
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