SE509451C2 - Förfarande för åstadkommande av en för värmeöverföringsändamål avsedd anordning - Google Patents
Förfarande för åstadkommande av en för värmeöverföringsändamål avsedd anordningInfo
- Publication number
- SE509451C2 SE509451C2 SE9701771A SE9701771A SE509451C2 SE 509451 C2 SE509451 C2 SE 509451C2 SE 9701771 A SE9701771 A SE 9701771A SE 9701771 A SE9701771 A SE 9701771A SE 509451 C2 SE509451 C2 SE 509451C2
- Authority
- SE
- Sweden
- Prior art keywords
- base
- flanges
- projecting
- manufactured
- deformed
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 32
- 239000000463 material Substances 0.000 claims description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 229910000838 Al alloy Inorganic materials 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000001816 cooling Methods 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D53/00—Making other particular articles
- B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4878—Mechanical treatment, e.g. deforming
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Bending Of Plates, Rods, And Pipes (AREA)
- Decoration By Transfer Pictures (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9701771A SE509451C2 (sv) | 1997-05-13 | 1997-05-13 | Förfarande för åstadkommande av en för värmeöverföringsändamål avsedd anordning |
DE69801322T DE69801322T2 (de) | 1997-05-13 | 1998-04-14 | Verfahren zur herstellung einer wärmeübertragungsvorrichtung |
CA002286906A CA2286906C (fr) | 1997-05-13 | 1998-04-14 | Procede de fabrication d'un dispositif de transfert de chaleur |
JP54859598A JP2001526591A (ja) | 1997-05-13 | 1998-04-14 | 熱伝達装置の製造方法 |
AT98917885T ATE203938T1 (de) | 1997-05-13 | 1998-04-14 | Verfahren zur herstellung einer wärmeübertragungsvorrichtung |
ES98917885T ES2160415T3 (es) | 1997-05-13 | 1998-04-14 | Metodo para la produccion de un dispositivo para la transferencia de calor. |
PCT/SE1998/000671 WO1998051430A1 (fr) | 1997-05-13 | 1998-04-14 | Procede de fabrication d'un dispositif de transfert de chaleur |
EP98917885A EP0981413B1 (fr) | 1997-05-13 | 1998-04-14 | Procede de fabrication d'un dispositif de transfert de chaleur |
US09/379,472 US6138489A (en) | 1997-05-13 | 1999-08-23 | Method of making a heat transfer device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9701771A SE509451C2 (sv) | 1997-05-13 | 1997-05-13 | Förfarande för åstadkommande av en för värmeöverföringsändamål avsedd anordning |
Publications (3)
Publication Number | Publication Date |
---|---|
SE9701771D0 SE9701771D0 (sv) | 1997-05-13 |
SE9701771L SE9701771L (sv) | 1998-11-14 |
SE509451C2 true SE509451C2 (sv) | 1999-01-25 |
Family
ID=20406913
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9701771A SE509451C2 (sv) | 1997-05-13 | 1997-05-13 | Förfarande för åstadkommande av en för värmeöverföringsändamål avsedd anordning |
Country Status (9)
Country | Link |
---|---|
US (1) | US6138489A (fr) |
EP (1) | EP0981413B1 (fr) |
JP (1) | JP2001526591A (fr) |
AT (1) | ATE203938T1 (fr) |
CA (1) | CA2286906C (fr) |
DE (1) | DE69801322T2 (fr) |
ES (1) | ES2160415T3 (fr) |
SE (1) | SE509451C2 (fr) |
WO (1) | WO1998051430A1 (fr) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6327886B1 (en) * | 1999-08-23 | 2001-12-11 | Ab Webra Industrl | Method, a device, and a work piece for producing a heat transfer member |
SE0002124L (sv) * | 2000-06-07 | 2001-10-15 | Webra Ind Ab | Förfarande, anordning samt ämne för tillverkning av ett värmeöverföringsorgan |
SE0004915D0 (sv) * | 2000-12-29 | 2000-12-29 | Sapa Profiler Ab | Heat sink unit |
GB2442793A (en) * | 2006-10-10 | 2008-04-16 | Apogee Antennas Ltd | Forming curved panels |
US8498116B2 (en) * | 2010-07-16 | 2013-07-30 | Rockwell Automation Technologies, Inc. | Heat sink for power circuits |
AU2011382514A1 (en) * | 2011-11-30 | 2014-07-03 | Schneider Electric It Corporation | Method of fabricating a heat sink |
DE102013008635B3 (de) * | 2013-05-18 | 2014-06-26 | Ulrich Bruhnke | Verfahren und Anlage zur Herstellung von Blechtafeln |
WO2018010981A1 (fr) * | 2016-07-11 | 2018-01-18 | Philips Lighting Holding B.V. | Dissipateur thermique métallique en feuille pliée |
USD888600S1 (en) * | 2017-11-30 | 2020-06-30 | Netta WEINROTH | Sculpture |
USD888599S1 (en) * | 2017-11-30 | 2020-06-30 | Netta WEINROTH | Sculpture |
USD888601S1 (en) * | 2017-11-30 | 2020-06-30 | Netta WEINROTH | Sculpture |
US20220042751A1 (en) * | 2020-08-10 | 2022-02-10 | Ge Aviation Systems Limited | Topological heatsink |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2716805A (en) * | 1952-07-08 | 1955-09-06 | Macdonald S Reed | Extruding integrally stiffened panels |
US3866286A (en) * | 1973-07-02 | 1975-02-18 | Peerless Of America | Method of making a finned tube heat exchanger having a circular cross section |
US4187711A (en) * | 1977-04-25 | 1980-02-12 | Wakefield Engineering, Inc. | Method and apparatus for producing a high fin density extruded heat dissipator |
US4447842A (en) * | 1982-06-01 | 1984-05-08 | Control Data Corporation | Finned heat exchangers for electronic chips and cooling assembly |
JPS60126853A (ja) * | 1983-12-14 | 1985-07-06 | Hitachi Ltd | 半導体デバイス冷却装置 |
US4609040A (en) * | 1985-04-01 | 1986-09-02 | Thermalloy Incorporated | Self-securing heat sink |
GB8628967D0 (en) * | 1986-12-03 | 1987-01-07 | Microelectronics & Computer | Pin-fin microchannel heat sink |
US4794985A (en) * | 1987-04-29 | 1989-01-03 | Peerless Of America Incorporated | Finned heat exchanger tubing with varying wall thickness |
US4967473A (en) * | 1988-08-11 | 1990-11-06 | Wessel Kenneth C | Method of forming a bow beam for a truck trailer |
US4970579A (en) * | 1988-09-21 | 1990-11-13 | International Business Machines Corp. | Integrated circuit package with improved cooling means |
US5085272A (en) * | 1991-02-11 | 1992-02-04 | The Venables Machine And Tool Company | Spine fin heat exchanger and method and apparatus for producing same |
DE4131332A1 (de) * | 1991-09-20 | 1993-03-25 | Behr Gmbh & Co | Extrudiertes leichtmetallprofil und werkzeug zur herstellung eines halbzeugs fuer das leichtmetallprofil |
JP2715752B2 (ja) * | 1991-10-31 | 1998-02-18 | 住友金属工業株式会社 | ヒートシンク放熱フィンとその製造方法 |
US5201866A (en) * | 1992-02-03 | 1993-04-13 | International Business Machines Corporation | Structure for dissipation of heat having slidably engaged fins for conformal disposition against a heat generating surface |
JP3126217B2 (ja) * | 1992-06-04 | 2001-01-22 | 昭和アルミニウム株式会社 | 幅の狭い空間部を有する押出二次加工品の製造方法 |
JPH06244328A (ja) * | 1993-02-19 | 1994-09-02 | Fujitsu Ltd | ヒートシンク |
US5272599A (en) * | 1993-03-19 | 1993-12-21 | Compaq Computer Corporation | Microprocessor heat dissipation apparatus for a printed circuit board |
US5426683A (en) * | 1994-03-14 | 1995-06-20 | Oec Medical Systems, Inc. | One piece C-arm for X-ray diagnostic equipment |
US5758418A (en) * | 1996-01-11 | 1998-06-02 | International Business Machines Corporation | Method of making an ultra high-density, high-performance heat sink |
JPH09248621A (ja) * | 1996-03-14 | 1997-09-22 | Showa Alum Corp | 展開加工用押出材 |
US5901040A (en) * | 1997-07-30 | 1999-05-04 | Hewlett-Packard Company | Heat sink and Faraday Cage assembly for a semiconductor module and a power converter |
-
1997
- 1997-05-13 SE SE9701771A patent/SE509451C2/sv not_active IP Right Cessation
-
1998
- 1998-04-14 AT AT98917885T patent/ATE203938T1/de not_active IP Right Cessation
- 1998-04-14 WO PCT/SE1998/000671 patent/WO1998051430A1/fr active IP Right Grant
- 1998-04-14 ES ES98917885T patent/ES2160415T3/es not_active Expired - Lifetime
- 1998-04-14 EP EP98917885A patent/EP0981413B1/fr not_active Expired - Lifetime
- 1998-04-14 DE DE69801322T patent/DE69801322T2/de not_active Expired - Lifetime
- 1998-04-14 CA CA002286906A patent/CA2286906C/fr not_active Expired - Lifetime
- 1998-04-14 JP JP54859598A patent/JP2001526591A/ja active Pending
-
1999
- 1999-08-23 US US09/379,472 patent/US6138489A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
ATE203938T1 (de) | 2001-08-15 |
JP2001526591A (ja) | 2001-12-18 |
EP0981413A1 (fr) | 2000-03-01 |
WO1998051430A1 (fr) | 1998-11-19 |
DE69801322T2 (de) | 2002-04-25 |
CA2286906C (fr) | 2006-12-12 |
US6138489A (en) | 2000-10-31 |
CA2286906A1 (fr) | 1998-11-19 |
DE69801322D1 (de) | 2001-09-13 |
EP0981413B1 (fr) | 2001-08-08 |
SE9701771L (sv) | 1998-11-14 |
ES2160415T3 (es) | 2001-11-01 |
SE9701771D0 (sv) | 1997-05-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NUG | Patent has lapsed |