SE417218B - Sett och medel for att fran ett kopparunderlag avlegsna avsatt tenn eller tenn-blylegering - Google Patents

Sett och medel for att fran ett kopparunderlag avlegsna avsatt tenn eller tenn-blylegering

Info

Publication number
SE417218B
SE417218B SE7509065A SE7509065A SE417218B SE 417218 B SE417218 B SE 417218B SE 7509065 A SE7509065 A SE 7509065A SE 7509065 A SE7509065 A SE 7509065A SE 417218 B SE417218 B SE 417218B
Authority
SE
Sweden
Prior art keywords
blay
alloy
remove
copper substrate
copper
Prior art date
Application number
SE7509065A
Other languages
English (en)
Other versions
SE7509065L (sv
Inventor
Jr F A Brindisi
Original Assignee
Enthone
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone filed Critical Enthone
Publication of SE7509065L publication Critical patent/SE7509065L/sv
Publication of SE417218B publication Critical patent/SE417218B/sv

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/30—Acidic compositions for etching other metallic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
SE7509065A 1974-08-14 1975-08-13 Sett och medel for att fran ett kopparunderlag avlegsna avsatt tenn eller tenn-blylegering SE417218B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/497,435 US4004956A (en) 1974-08-14 1974-08-14 Selectively stripping tin or tin-lead alloys from copper substrates

Publications (2)

Publication Number Publication Date
SE7509065L SE7509065L (sv) 1976-02-15
SE417218B true SE417218B (sv) 1981-03-02

Family

ID=23976859

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7509065A SE417218B (sv) 1974-08-14 1975-08-13 Sett och medel for att fran ett kopparunderlag avlegsna avsatt tenn eller tenn-blylegering

Country Status (12)

Country Link
US (1) US4004956A (sv)
JP (1) JPS5420179B2 (sv)
AU (1) AU8338375A (sv)
BE (1) BE832477A (sv)
BR (1) BR7505001A (sv)
CA (1) CA1056701A (sv)
CH (1) CH606488A5 (sv)
DE (1) DE2536404C2 (sv)
ES (1) ES440237A1 (sv)
FR (1) FR2281998A1 (sv)
GB (1) GB1507726A (sv)
SE (1) SE417218B (sv)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4297257A (en) * 1980-04-17 1981-10-27 Dart Industries Inc. Metal stripping composition and method
IT1144797B (it) * 1981-10-14 1986-10-29 Alfachimici Spa Soluzione per l asportazione di stagno o lega stagno piombo da un substrato mediante operazione a spruzzo
USRE32555E (en) * 1982-09-20 1987-12-08 Circuit Chemistry Corporation Solder stripping solution
US4397753A (en) * 1982-09-20 1983-08-09 Circuit Chemistry Corporation Solder stripping solution
DE3564293D1 (en) * 1984-04-02 1988-09-15 Parker Chemical Co Process and an aqueous acid cleaning solution for the cleaning of aluminium surfaces
US4687545A (en) * 1986-06-18 1987-08-18 Macdermid, Incorporated Process for stripping tin or tin-lead alloy from copper
US4978423A (en) * 1988-09-26 1990-12-18 At&T Bell Laboratories Selective solder formation on printed circuit boards
US4957653A (en) * 1989-04-07 1990-09-18 Macdermid, Incorporated Composition containing alkane sulfonic acid and ferric nitrate for stripping tin or tin-lead alloy from copper surfaces, and method for stripping tin or tin-lead alloy
US4944851A (en) * 1989-06-05 1990-07-31 Macdermid, Incorporated Electrolytic method for regenerating tin or tin-lead alloy stripping compositions
US4921571A (en) * 1989-07-28 1990-05-01 Macdermid, Incorporated Inhibited composition and method for stripping tin, lead or tin-lead alloy from copper surfaces
JPH0375386A (ja) * 1989-08-18 1991-03-29 Metsuku Kk 錫又は錫‐鉛合金の剥離方法
US5017267A (en) * 1990-07-17 1991-05-21 Macdermid, Incorporated Composition and method for stripping tin or tin-lead alloy from copper surfaces
DE4113283C2 (de) * 1991-04-24 1994-05-05 Kernforschungsz Karlsruhe Verwendung einer Ätzlösung zum selektiven Abätzen einer metallischen Opferschicht bei der Herstellung von Mikrostrukturen
US5219484A (en) * 1991-04-25 1993-06-15 Applied Electroless Concepts Inc. Solder and tin stripper compositions
DE4219667C2 (de) * 1992-06-16 1994-12-01 Kernforschungsz Karlsruhe Werkzeug und Verfahren zur Herstellung einer mikrostrukturierten Kunststoffschicht
US5824631A (en) * 1994-06-03 1998-10-20 Wagenknecht; John H. Compositions for dissolution of soft metals
US5565039A (en) * 1994-06-03 1996-10-15 Wagenknecht; John H. Method for dissolution of soft metals from a substrate of a harder metal
US6045686A (en) * 1997-03-18 2000-04-04 The University Of Connecticut Method and apparatus for electrochemical delacquering and detinning
JP2001073182A (ja) * 1999-07-15 2001-03-21 Boc Group Inc:The 改良された酸性銅電気メッキ用溶液
ATE224966T1 (de) * 2000-03-17 2002-10-15 Ruvaris S R L Verfahren und bad zur selektiven bleientfernung von sanitärkomponenten aus kupferlegierungen
US6833328B1 (en) 2000-06-09 2004-12-21 General Electric Company Method for removing a coating from a substrate, and related compositions
US6863738B2 (en) * 2001-01-29 2005-03-08 General Electric Company Method for removing oxides and coatings from a substrate
EP1302569A3 (en) * 2001-10-11 2004-03-03 Shipley Co. L.L.C. Stripping solution
US20040169013A1 (en) * 2003-02-28 2004-09-02 General Electric Company Method for chemically removing aluminum-containing materials from a substrate
US6953533B2 (en) * 2003-06-16 2005-10-11 General Electric Company Process for removing chromide coatings from metal substrates, and related compositions
US20100147803A1 (en) * 2008-12-15 2010-06-17 General Electric Company Process for removing metallic material from casted substates, and related compositions
JP6429079B2 (ja) * 2015-02-12 2018-11-28 メック株式会社 エッチング液及びエッチング方法
EP3059277B2 (en) * 2015-02-23 2022-03-30 MacDermid Enthone Inc. Inhibitor composition for racks when using chrome free etches in a plating on plastics process

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2652360A (en) * 1951-05-10 1953-09-15 Pure Oil Co Acidizing siliceous earth formations
GB885241A (en) * 1959-08-07 1961-12-20 Charles Hill & Co Ltd An improved chemical polishing solution for use upon zinc base alloys
US3061494A (en) * 1959-10-05 1962-10-30 Boeing Co Process of chemical milling and acid aqueous bath used therefor
US3677949A (en) * 1970-09-04 1972-07-18 Enthone Selectively stripping tin and/or lead from copper substrates
US3888778A (en) * 1973-03-13 1975-06-10 Merton Beckwith Bright dip composition for tin/lead

Also Published As

Publication number Publication date
JPS5142028A (sv) 1976-04-09
CA1056701A (en) 1979-06-19
BE832477A (fr) 1976-02-16
FR2281998B3 (sv) 1978-04-07
JPS5420179B2 (sv) 1979-07-20
DE2536404A1 (de) 1976-03-04
CH606488A5 (sv) 1978-10-31
AU8338375A (en) 1976-10-21
GB1507726A (en) 1978-04-19
US4004956A (en) 1977-01-25
SE7509065L (sv) 1976-02-15
DE2536404C2 (de) 1984-05-10
FR2281998A1 (fr) 1976-03-12
ES440237A1 (es) 1977-06-16
AU477223B2 (sv) 1976-10-21
BR7505001A (pt) 1976-08-03

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