SE405183B - Sett att tillverka ett halvledardon i form av ett inkapslat halvledarelement - Google Patents

Sett att tillverka ett halvledardon i form av ett inkapslat halvledarelement

Info

Publication number
SE405183B
SE405183B SE7602584A SE7602584A SE405183B SE 405183 B SE405183 B SE 405183B SE 7602584 A SE7602584 A SE 7602584A SE 7602584 A SE7602584 A SE 7602584A SE 405183 B SE405183 B SE 405183B
Authority
SE
Sweden
Prior art keywords
semiconductor
encaped
manufacturing
semiconductor element
encaped semiconductor
Prior art date
Application number
SE7602584A
Other languages
English (en)
Swedish (sv)
Other versions
SE7602584L (sv
Inventor
T A Anderson
Original Assignee
Westinghouse Brake & Signal
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Brake & Signal filed Critical Westinghouse Brake & Signal
Publication of SE7602584L publication Critical patent/SE7602584L/xx
Publication of SE405183B publication Critical patent/SE405183B/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H01L2924/13033—TRIAC - Triode for Alternating Current - A bidirectional switching device containing two thyristor structures with common gate contact
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Springs (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Braking Arrangements (AREA)
  • Bolts, Nuts, And Washers (AREA)
SE7602584A 1975-03-21 1976-02-27 Sett att tillverka ett halvledardon i form av ett inkapslat halvledarelement SE405183B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB11877/75A GB1506735A (en) 1975-03-21 1975-03-21 Semiconductor devices

Publications (2)

Publication Number Publication Date
SE7602584L SE7602584L (sv) 1976-09-22
SE405183B true SE405183B (sv) 1978-11-20

Family

ID=9994314

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7602584A SE405183B (sv) 1975-03-21 1976-02-27 Sett att tillverka ett halvledardon i form av ett inkapslat halvledarelement

Country Status (6)

Country Link
US (1) US3991461A (de)
JP (1) JPS6011461B2 (de)
DE (1) DE2611161A1 (de)
FR (1) FR2305024A1 (de)
GB (1) GB1506735A (de)
SE (1) SE405183B (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5382278A (en) * 1976-12-28 1978-07-20 Toshiba Corp Production of semiconductor device
JPS55121654A (en) * 1979-03-13 1980-09-18 Toshiba Corp Compression bonded semiconductor device
US4568962A (en) * 1982-11-08 1986-02-04 Motorola, Inc. Plastic encapsulated semiconductor power device means and method
US5895228A (en) * 1996-11-14 1999-04-20 International Business Machines Corporation Encapsulation of organic light emitting devices using Siloxane or Siloxane derivatives
US6845664B1 (en) * 2002-10-03 2005-01-25 The United States Of America As Represented By The Administrator Of National Aeronautics And Space Administration MEMS direct chip attach packaging methodologies and apparatuses for harsh environments
JP7117309B2 (ja) * 2017-01-17 2022-08-12 ヒタチ・エナジー・スウィツァーランド・アクチェンゲゼルシャフト 半導体スイッチングデバイス

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR83243E (fr) * 1961-08-12 1964-07-03 Siemens Ag Dispositif semiconducteur perfectionné
DE1514483B2 (de) * 1965-06-22 1971-05-06 Siemens AG, 1000 Berlin u 8000 München Druckkontakt halbleiter gleichrichter
GB1121717A (en) * 1966-06-20 1968-07-31 Ass Elect Ind Improvements in semi-conductor devices
GB1133358A (en) * 1966-11-11 1968-11-13 Ass Elect Ind Pressure contact semi-conductor devices
DE1944515A1 (de) * 1969-09-02 1971-03-04 Siemens Ag Halbleiterbauelement mit Kunststoffuellung
US3683492A (en) * 1970-02-06 1972-08-15 Westinghouse Electric Corp Apparatus and process for making a pressure electrical contact assembly for an electrical device
DE2131695C3 (de) * 1971-06-25 1979-11-08 Siemens Ag, 1000 Berlin Und 8000 Muenchen Halbleiterbauelement

Also Published As

Publication number Publication date
JPS6011461B2 (ja) 1985-03-26
DE2611161A1 (de) 1976-10-14
GB1506735A (en) 1978-04-12
FR2305024A1 (fr) 1976-10-15
DE2611161C2 (de) 1987-07-02
US3991461A (en) 1976-11-16
FR2305024B1 (de) 1982-04-30
SE7602584L (sv) 1976-09-22
JPS51129176A (en) 1976-11-10

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