SE363699B - - Google Patents

Info

Publication number
SE363699B
SE363699B SE03237/70A SE323770A SE363699B SE 363699 B SE363699 B SE 363699B SE 03237/70 A SE03237/70 A SE 03237/70A SE 323770 A SE323770 A SE 323770A SE 363699 B SE363699 B SE 363699B
Authority
SE
Sweden
Application number
SE03237/70A
Inventor
P Jochems
R Werdt
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of SE363699B publication Critical patent/SE363699B/xx

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/40Treatment after imagewise removal, e.g. baking
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00Interconnections in chips, wafers or substrates
    • H10W20/40Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Drying Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
SE03237/70A 1969-03-14 1970-03-11 SE363699B (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6903930A NL6903930A (https=) 1969-03-14 1969-03-14

Publications (1)

Publication Number Publication Date
SE363699B true SE363699B (https=) 1974-01-28

Family

ID=19806409

Family Applications (1)

Application Number Title Priority Date Filing Date
SE03237/70A SE363699B (https=) 1969-03-14 1970-03-11

Country Status (7)

Country Link
US (1) US3695955A (https=)
BE (1) BE747285A (https=)
CH (1) CH544158A (https=)
FR (1) FR2034943B1 (https=)
GB (1) GB1297203A (https=)
NL (1) NL6903930A (https=)
SE (1) SE363699B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3997380A (en) * 1970-04-17 1976-12-14 Compagnie Internationale Pour L'informatique Method of engraving a conductive layer
BE789498A (fr) * 1971-09-29 1973-01-15 Siemens Ag Contact metal-semiconducteur de faible superficie
US3883947A (en) * 1971-11-05 1975-05-20 Bosch Gmbh Robert Method of making a thin film electronic circuit unit
US4045310A (en) * 1976-05-03 1977-08-30 Teletype Corporation Starting product for the production of a read-only memory and a method of producing it and the read-only memory
JPS56114319A (en) * 1980-02-14 1981-09-08 Fujitsu Ltd Method for forming contact hole
US4350564A (en) * 1980-10-27 1982-09-21 General Electric Company Method of etching metallic materials including a major percentage of chromium
JPS58204176A (ja) * 1982-05-24 1983-11-28 Kangiyou Denki Kiki Kk 化学的蝕刻方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1369601A (fr) * 1962-07-31 1964-08-14 Rca Corp Procédé perfectionné de fabrication de semi-conducteurs
FR1437781A (fr) * 1964-04-21 1966-05-06 Philips Nv Procédé pour appliquer sur un support des couches métalliques séparées par un interstice
FR1480962A (fr) * 1965-05-28 1967-05-12 Rca Corp Procédé de fabrication de dispositifs semi-conducteurs

Also Published As

Publication number Publication date
CH544158A (de) 1973-11-15
NL6903930A (https=) 1970-09-16
DE2010701B2 (de) 1976-07-29
FR2034943B1 (https=) 1974-03-01
BE747285A (fr) 1970-09-14
US3695955A (en) 1972-10-03
GB1297203A (https=) 1972-11-22
FR2034943A1 (https=) 1970-12-18
DE2010701A1 (de) 1970-10-01

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