RU2014124000A - Встроенные металлические структуры в керамических подложках - Google Patents
Встроенные металлические структуры в керамических подложках Download PDFInfo
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
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- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
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- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
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Abstract
1. Способ изготовления подложки со встроенными электропроводящими металлическими структурами или соответственно металлизацией, в частности, для применения в качестве печатных плат, отличающийся тем, что в подложке с помощью лазерной технологии вырезаются канавки и/или углубления, а затем в этих канавках и/или углублениях создаются металлические структуры.2. Способ по п. 1, отличающийся тем, что подложка имеет отличающуюся от плоской печатной платы, то есть, трехмерную, изогнутую или многогранную геометрию.3. Способ по п. 1, отличающийся тем, что подложка представляет собой керамическую подложку или подложку из синтетического материала.4. Способ по п. 3, отличающийся тем, что керамическая подложка состоит из керамики из нитрида алюминия (AlN) и после вырезания в канавках и/или углублениях с помощью лазера в результате разложения получается алюминий (Al), который потом с помощью известных способов, таких как бестоковое осаждение никеля, золота или меди и их сплавов или смеси этих металлов, дополнительно усиливается.5. Способ по п. 3, отличающийся тем, что керамическая подложка после вырезания погружается в раствор органической соли металла, такой как, например, ацетат серебра или ацетат меди, а затем эти металлические соли в канавках и/или углублениях облучаются подходящим лазером, причем металлические соли подвергаются превращению с образованием элементов, которые адгезионно-прочно связываются с керамикой.6. Способ по п. 5, отличающийся тем, что к металлическим солям добавляются оксид или стеклообразующие добавки, такие как ацетат цинка или кремнийорганические соединения.7. Способ по п. 3, отличающийся тем, что после вы�
Claims (13)
1. Способ изготовления подложки со встроенными электропроводящими металлическими структурами или соответственно металлизацией, в частности, для применения в качестве печатных плат, отличающийся тем, что в подложке с помощью лазерной технологии вырезаются канавки и/или углубления, а затем в этих канавках и/или углублениях создаются металлические структуры.
2. Способ по п. 1, отличающийся тем, что подложка имеет отличающуюся от плоской печатной платы, то есть, трехмерную, изогнутую или многогранную геометрию.
3. Способ по п. 1, отличающийся тем, что подложка представляет собой керамическую подложку или подложку из синтетического материала.
4. Способ по п. 3, отличающийся тем, что керамическая подложка состоит из керамики из нитрида алюминия (AlN) и после вырезания в канавках и/или углублениях с помощью лазера в результате разложения получается алюминий (Al), который потом с помощью известных способов, таких как бестоковое осаждение никеля, золота или меди и их сплавов или смеси этих металлов, дополнительно усиливается.
5. Способ по п. 3, отличающийся тем, что керамическая подложка после вырезания погружается в раствор органической соли металла, такой как, например, ацетат серебра или ацетат меди, а затем эти металлические соли в канавках и/или углублениях облучаются подходящим лазером, причем металлические соли подвергаются превращению с образованием элементов, которые адгезионно-прочно связываются с керамикой.
6. Способ по п. 5, отличающийся тем, что к металлическим солям добавляются оксид или стеклообразующие добавки, такие как ацетат цинка или кремнийорганические соединения.
7. Способ по п. 3, отличающийся тем, что после вырезания канавки и/или углубления заполняются с помощью пасты для толстых пленок из металла, а затем она спекается с помощью подходящего лазера непосредственно в лазерном отпечатке, то есть, в этих канавках и/или углублениях.
8. Способ по п. 1, отличающийся тем, что необлученные места за пределами канавок и/или углублений или на участках канавок и/или углублений отмываются или отшлифовываются.
9. Способ по п. 1, отличающийся тем, что металлизация в канавках и/или углублениях усиливается бестоковым или катодным осаждением и/или покрывается слоем покрывающих металлов.
10. Способ по одному из пп. 1-9, отличающийся тем, что металлизация, полученная в канавках и/или углублениях, заканчивается на одном уровне с поверхностью подложки и не выступает из подложки, и тем самым пригодна для соединения в стопки.
11. Подложка со встроенными электропроводящими металлическими структурами или соответственно металлизацией, полученная с помощью способа по одному из пп. 1-10, отличающаяся тем, что металлические структуры или соответственно металлизация имеют вертикальную глубину, измеренную относительно поверхности подложки, более 30 мкм.
12. Подложка по п. 11, которая имеет вертикальную глубину более 40 мкм.
13. Подложка по п. 11 или 12, которая имеет вертикальную глубину более 45 мкм, предпочтительно 50 мкм.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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DE102011086464 | 2011-11-16 | ||
DE102011086464.4 | 2011-11-16 | ||
PCT/EP2012/072824 WO2013072457A1 (de) | 2011-11-16 | 2012-11-16 | Eingebettete metallische strukturen in keramischen substraten |
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RU2014124000A true RU2014124000A (ru) | 2015-12-27 |
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RU2014124000/07A RU2014124000A (ru) | 2011-11-16 | 2012-11-16 | Встроенные металлические структуры в керамических подложках |
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US (1) | US20140290985A1 (ru) |
EP (1) | EP2781143A1 (ru) |
JP (1) | JP2014533775A (ru) |
KR (1) | KR20140094006A (ru) |
CN (1) | CN103931277A (ru) |
BR (1) | BR112014011810A2 (ru) |
DE (1) | DE102012220948A1 (ru) |
IN (1) | IN2014CN03687A (ru) |
PH (1) | PH12014501099A1 (ru) |
RU (1) | RU2014124000A (ru) |
TW (1) | TWI613177B (ru) |
WO (1) | WO2013072457A1 (ru) |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN103448308B (zh) * | 2013-09-18 | 2015-08-05 | 电子科技大学 | 一种生物可降解的柔性导电基板及其制备方法 |
CN104294244B (zh) * | 2014-10-24 | 2017-05-31 | 中国科学院上海光学精密机械研究所 | 激光辅助化学混合镀实现二维表面金属结构的方法 |
WO2016110531A1 (de) * | 2015-01-08 | 2016-07-14 | Ceramtec Gmbh | Leitfähige verbindung von lasereingebrachten signalleiterbahnen mit pastenmetallisierten pads auf aln substraten |
JP2017034150A (ja) * | 2015-08-04 | 2017-02-09 | 株式会社ダイセル | 回路基板とその製造方法 |
JP6502204B2 (ja) * | 2015-08-04 | 2019-04-17 | 株式会社ダイセル | 回路基板とその製造方法 |
CN108411286B (zh) * | 2018-01-31 | 2023-11-24 | 华东师范大学 | 任意构型三维导电金属微纳结构的制造方法 |
CN108394856A (zh) * | 2018-01-31 | 2018-08-14 | 华东师范大学 | 透明材料内部集成三维导电金属微纳结构的方法 |
CN110536557B (zh) * | 2018-05-24 | 2020-12-11 | 中国科学院理化技术研究所 | 基于激光烧刻成型的电路线路、电路和天线制作方法 |
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-
2012
- 2012-11-15 TW TW101142579A patent/TWI613177B/zh not_active IP Right Cessation
- 2012-11-16 US US14/358,252 patent/US20140290985A1/en not_active Abandoned
- 2012-11-16 DE DE102012220948A patent/DE102012220948A1/de not_active Withdrawn
- 2012-11-16 CN CN201280056559.5A patent/CN103931277A/zh active Pending
- 2012-11-16 EP EP12787011.1A patent/EP2781143A1/de not_active Withdrawn
- 2012-11-16 WO PCT/EP2012/072824 patent/WO2013072457A1/de active Application Filing
- 2012-11-16 KR KR1020147016377A patent/KR20140094006A/ko not_active Application Discontinuation
- 2012-11-16 IN IN3687CHN2014 patent/IN2014CN03687A/en unknown
- 2012-11-16 RU RU2014124000/07A patent/RU2014124000A/ru not_active Application Discontinuation
- 2012-11-16 JP JP2014541680A patent/JP2014533775A/ja active Pending
- 2012-11-16 BR BR112014011810A patent/BR112014011810A2/pt not_active Application Discontinuation
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2014
- 2014-05-15 PH PH12014501099A patent/PH12014501099A1/en unknown
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US20140290985A1 (en) | 2014-10-02 |
TWI613177B (zh) | 2018-02-01 |
PH12014501099A1 (en) | 2014-08-04 |
JP2014533775A (ja) | 2014-12-15 |
WO2013072457A1 (de) | 2013-05-23 |
TW201341339A (zh) | 2013-10-16 |
DE102012220948A1 (de) | 2013-05-16 |
CN103931277A (zh) | 2014-07-16 |
KR20140094006A (ko) | 2014-07-29 |
EP2781143A1 (de) | 2014-09-24 |
IN2014CN03687A (ru) | 2015-07-03 |
BR112014011810A2 (pt) | 2017-05-02 |
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