PT1152861E - Processo para a producao de componentes, sua utilizacao, peca armazenada ao ar e camara de tratamento sob vacuo - Google Patents

Processo para a producao de componentes, sua utilizacao, peca armazenada ao ar e camara de tratamento sob vacuo

Info

Publication number
PT1152861E
PT1152861E PT00902526T PT00902526T PT1152861E PT 1152861 E PT1152861 E PT 1152861E PT 00902526 T PT00902526 T PT 00902526T PT 00902526 T PT00902526 T PT 00902526T PT 1152861 E PT1152861 E PT 1152861E
Authority
PT
Portugal
Prior art keywords
vacuum treatment
treatment chamber
peca
stored
production
Prior art date
Application number
PT00902526T
Other languages
English (en)
Inventor
Ramm Juergen
Beck Eugen
Original Assignee
Unaxis Balzers Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unaxis Balzers Ag filed Critical Unaxis Balzers Ag
Publication of PT1152861E publication Critical patent/PT1152861E/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/206—Cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Telephone Function (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
PT00902526T 1999-02-19 2000-02-14 Processo para a producao de componentes, sua utilizacao, peca armazenada ao ar e camara de tratamento sob vacuo PT1152861E (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH31599 1999-02-19

Publications (1)

Publication Number Publication Date
PT1152861E true PT1152861E (pt) 2006-07-31

Family

ID=4184215

Family Applications (1)

Application Number Title Priority Date Filing Date
PT00902526T PT1152861E (pt) 1999-02-19 2000-02-14 Processo para a producao de componentes, sua utilizacao, peca armazenada ao ar e camara de tratamento sob vacuo

Country Status (13)

Country Link
US (2) US6605175B1 (pt)
EP (1) EP1152861B1 (pt)
JP (1) JP2002537641A (pt)
KR (1) KR20010108240A (pt)
CN (1) CN1347357A (pt)
AT (1) ATE321622T1 (pt)
CA (1) CA2371771A1 (pt)
DE (1) DE50012480D1 (pt)
ES (1) ES2259993T3 (pt)
HK (1) HK1046113A1 (pt)
PT (1) PT1152861E (pt)
TW (1) TW462904B (pt)
WO (1) WO2000048779A1 (pt)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6605175B1 (en) * 1999-02-19 2003-08-12 Unaxis Balzers Aktiengesellschaft Process for manufacturing component parts, use of same, with air bearing supported workpieces and vacuum processing chamber
KR20020080954A (ko) * 2001-04-18 2002-10-26 주성엔지니어링(주) 냉벽 화학기상증착 방법 및 장치
DE10210216A1 (de) * 2002-03-08 2003-10-16 Behr Gmbh & Co Verfahren zum Löten von Aluminium
US6902774B2 (en) * 2002-07-25 2005-06-07 Inficon Gmbh Method of manufacturing a device
WO2004028732A1 (ja) * 2002-09-25 2004-04-08 Toray Engineering Co., Ltd. 接合方法および装置
JP2006080099A (ja) * 2002-09-26 2006-03-23 Toray Eng Co Ltd 接合方法および装置
US7482249B2 (en) * 2002-11-29 2009-01-27 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer
US7387738B2 (en) * 2003-04-28 2008-06-17 Air Products And Chemicals, Inc. Removal of surface oxides by electron attachment for wafer bumping applications
US7897029B2 (en) * 2008-03-04 2011-03-01 Air Products And Chemicals, Inc. Removal of surface oxides by electron attachment
US8361340B2 (en) * 2003-04-28 2013-01-29 Air Products And Chemicals, Inc. Removal of surface oxides by electron attachment
JP4892209B2 (ja) * 2005-08-22 2012-03-07 日立化成デュポンマイクロシステムズ株式会社 半導体装置の製造方法
JP4691417B2 (ja) * 2005-08-22 2011-06-01 日立化成デュポンマイクロシステムズ株式会社 回路接続構造体及びその製造方法及び回路接続構造体用の半導体基板
US7434719B2 (en) * 2005-12-09 2008-10-14 Air Products And Chemicals, Inc. Addition of D2 to H2 to detect and calibrate atomic hydrogen formed by dissociative electron attachment
JP2007258317A (ja) * 2006-03-22 2007-10-04 Shin Etsu Chem Co Ltd 半導体装置の製造方法
JP5210496B2 (ja) * 2006-03-27 2013-06-12 神港精機株式会社 半導体装置の製造方法
JP2007329309A (ja) * 2006-06-08 2007-12-20 Matsushita Electric Ind Co Ltd 電子部品の製造方法
EP2022591B1 (de) * 2007-08-03 2010-07-14 Siemens Aktiengesellschaft Verfahren zur Erzeugung einer lötfähigen metallischen Oberfläche und Lötverfahren
KR101046520B1 (ko) 2007-09-07 2011-07-04 어플라이드 머티어리얼스, 인코포레이티드 내부 챔버 상의 부산물 막 증착을 제어하기 위한 ｐｅｃｖｄ 시스템에서의 소스 가스 흐름 경로 제어
DE102011105645A1 (de) * 2011-06-07 2012-12-13 Oerlikon Trading Ag, Trübbach Entschichtungsverfahren für harte Kohlenstoffschichten
CN102259218B (zh) * 2011-07-06 2012-12-19 哈尔滨工业大学 真空活化焊接装置
CH705951B1 (de) * 2011-12-23 2017-12-15 Awaiba Consultadoria Desenvolvimento E Comércio De Componentes Microelectrónicos Unipessoal Lda Optische Sensoranordnung und Verfahren zur Herstellung sowie Verwendung derselben.
CN104064480A (zh) * 2013-03-22 2014-09-24 江西创成半导体有限责任公司 聚酰亚胺喷涂
US10636661B2 (en) * 2016-01-15 2020-04-28 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus and method for wafer bonding
CN108872380B (zh) * 2018-06-04 2021-10-22 航天特种材料及工艺技术研究所 多层粘接构件的粘接缺陷检测方法

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US4598022A (en) * 1983-11-22 1986-07-01 Olin Corporation One-step plasma treatment of copper foils to increase their laminate adhesion
GB8827933D0 (en) 1988-11-30 1989-01-05 Plessey Co Plc Improvements relating to soldering processes
US4921157A (en) 1989-03-15 1990-05-01 Microelectronics Center Of North Carolina Fluxless soldering process
US4965530A (en) 1989-09-26 1990-10-23 General Electric Company Parallelled amplifier with switched isolation resistors
DE4032328A1 (de) 1989-11-06 1991-09-19 Wls Karl Heinz Grasmann Weichl Verfahren und vorrichtung zur verarbeitung von zu verloetenden fuegepartnern
US5225378A (en) * 1990-11-16 1993-07-06 Tokyo Electron Limited Method of forming a phosphorus doped silicon film
JP3115015B2 (ja) * 1991-02-19 2000-12-04 東京エレクトロン株式会社 縦型バッチ処理装置
DE59202116D1 (de) 1991-04-23 1995-06-14 Balzers Hochvakuum Verfahren zur Abtragung von Material von einer Oberfläche in einer Vakuumkammer.
DE4209720A1 (de) 1992-03-25 1993-09-30 Hermann Ing Grad Marr Beleimautomat zum Beleimen von Werkstücken
CH687111A5 (de) 1992-05-26 1996-09-13 Balzers Hochvakuum Verfahren zum Erzeugen einer Niederspannungsentladung, Vakuumbehandlungsanlage hierfuer sowie Anwendung des Verfahrens.
US5383984A (en) * 1992-06-17 1995-01-24 Tokyo Electron Limited Plasma processing apparatus etching tunnel-type
US5409543A (en) 1992-12-22 1995-04-25 Sandia Corporation Dry soldering with hot filament produced atomic hydrogen
US5938854A (en) * 1993-05-28 1999-08-17 The University Of Tennessee Research Corporation Method and apparatus for cleaning surfaces with a glow discharge plasma at one atmosphere of pressure
US5647945A (en) * 1993-08-25 1997-07-15 Tokyo Electron Limited Vacuum processing apparatus
US5616208A (en) * 1993-09-17 1997-04-01 Tokyo Electron Limited Vacuum processing apparatus, vacuum processing method, and method for cleaning the vacuum processing apparatus
US5546322A (en) 1994-04-12 1996-08-13 International Business Machines Corporation Method and system for analyzing plasma data
JP3247270B2 (ja) * 1994-08-25 2002-01-15 東京エレクトロン株式会社 処理装置及びドライクリーニング方法
US5832600A (en) * 1995-06-06 1998-11-10 Seiko Epson Corporation Method of mounting electronic parts
CH692446A5 (de) * 1996-04-15 2002-06-28 Esec Sa Verfahren zur Herstellung von Werkstücken und von Teilen hierfür
US6605175B1 (en) * 1999-02-19 2003-08-12 Unaxis Balzers Aktiengesellschaft Process for manufacturing component parts, use of same, with air bearing supported workpieces and vacuum processing chamber
US6383573B1 (en) * 2000-05-17 2002-05-07 Unaxis Balzers Aktiengesellschaft Process for manufacturing coated plastic body
US6902774B2 (en) * 2002-07-25 2005-06-07 Inficon Gmbh Method of manufacturing a device

Also Published As

Publication number Publication date
EP1152861A1 (de) 2001-11-14
TW462904B (en) 2001-11-11
HK1046113A1 (zh) 2002-12-27
ATE321622T1 (de) 2006-04-15
DE50012480D1 (de) 2006-05-18
US20050172983A1 (en) 2005-08-11
JP2002537641A (ja) 2002-11-05
US6605175B1 (en) 2003-08-12
EP1152861B1 (de) 2006-03-29
CA2371771A1 (en) 2000-08-24
KR20010108240A (ko) 2001-12-07
CN1347357A (zh) 2002-05-01
WO2000048779A1 (de) 2000-08-24
ES2259993T3 (es) 2006-11-01

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