NO2933810T3 - - Google Patents
Info
- Publication number
- NO2933810T3 NO2933810T3 NO15163554A NO15163554A NO2933810T3 NO 2933810 T3 NO2933810 T3 NO 2933810T3 NO 15163554 A NO15163554 A NO 15163554A NO 15163554 A NO15163554 A NO 15163554A NO 2933810 T3 NO2933810 T3 NO 2933810T3
- Authority
- NO
- Norway
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Powder Metallurgy (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102013219541.9A DE102013219541B4 (de) | 2013-09-27 | 2013-09-27 | Verbessertes Verfahren zur pulvermetallurgischen Herstellung thermoelektrischer Bauelemente |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NO2933810T3 true NO2933810T3 (uk) | 2018-03-03 |
Family
ID=51355532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO15163554A NO2933810T3 (uk) | 2013-09-27 | 2015-04-14 |
Country Status (13)
| Country | Link |
|---|---|
| US (1) | US9553249B2 (uk) |
| EP (1) | EP3050131B1 (uk) |
| CN (1) | CN105637663B (uk) |
| CA (1) | CA2924139C (uk) |
| DE (1) | DE102013219541B4 (uk) |
| DK (1) | DK3050131T3 (uk) |
| ES (1) | ES2668691T3 (uk) |
| NO (1) | NO2933810T3 (uk) |
| PL (1) | PL3050131T3 (uk) |
| RU (1) | RU2639615C2 (uk) |
| TR (1) | TR201806647T4 (uk) |
| UA (1) | UA116040C2 (uk) |
| WO (1) | WO2015043824A1 (uk) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DK3196951T3 (en) * | 2016-01-21 | 2019-01-21 | Evonik Degussa Gmbh | RATIONAL PROCEDURE FOR POWDER METAL SURGICAL MANUFACTURING THERMOELECTRIC COMPONENTS |
| DE102017201294A1 (de) | 2017-01-27 | 2018-08-02 | Mahle International Gmbh | Verfahren zum Herstellen von Peltierelementen sowie eines thermoelektrischen Wärmeübertragers |
| CN107658121A (zh) * | 2017-10-31 | 2018-02-02 | 贵州金林电子科技有限公司 | 一种用于变压器含浸处理的治具 |
| US10862008B2 (en) * | 2018-11-20 | 2020-12-08 | Osram Opto Semiconductors Gmbh | Ceramic conversion element, light-emitting device and method for producing a ceramic conversion element |
| CN113084170B (zh) * | 2021-04-05 | 2023-04-14 | 博深股份有限公司 | 一种适于自动化生产用摩擦块烧结模具及使用方法 |
| CN115188877A (zh) * | 2022-07-27 | 2022-10-14 | 武汉理工大学 | 一种制备强织构和高热电性能柔性热电薄膜的方法 |
| CN116148296B (zh) * | 2023-04-19 | 2023-08-25 | 中国科学院过程工程研究所 | 含金属固体物料自动化xrf检测集成装置的检测方法 |
Family Cites Families (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3269871A (en) * | 1960-11-14 | 1966-08-30 | Westinghouse Electric Corp | Multiple junction unitary thermoelectric device |
| US3201504A (en) * | 1961-10-16 | 1965-08-17 | Carrler Corp | Method of making a thermo-electric couple |
| US6025554A (en) * | 1995-10-16 | 2000-02-15 | Macris; Chris | Thermoelectric device and method of manufacture |
| JPH09139526A (ja) | 1995-11-13 | 1997-05-27 | Ngk Insulators Ltd | 熱電気変換モジュールおよびその製造方法 |
| SE9801798A0 (sv) * | 1998-05-20 | 1999-11-21 | Termogen Ab | Termoelektrisk anordning |
| US6127619A (en) * | 1998-06-08 | 2000-10-03 | Ormet Corporation | Process for producing high performance thermoelectric modules |
| US6297441B1 (en) * | 2000-03-24 | 2001-10-02 | Chris Macris | Thermoelectric device and method of manufacture |
| JP2001320097A (ja) * | 2000-05-09 | 2001-11-16 | Komatsu Ltd | 熱電素子とその製造方法及びこれを用いた熱電モジュール |
| DE10109087A1 (de) | 2001-02-24 | 2002-10-24 | Leoni Bordnetz Sys Gmbh & Co | Verfahren zum Herstellen eines Formbauteils mit einer integrierten Leiterbahn |
| FR2822295B1 (fr) | 2001-03-16 | 2004-06-25 | Edouard Serras | Generateur thermoelectrique a semi-conducteurs et ses procedes de fabrication |
| JP2004265988A (ja) | 2003-02-28 | 2004-09-24 | Matsushita Electric Ind Co Ltd | 熱電体およびその製造方法 |
| US6969679B2 (en) | 2003-11-25 | 2005-11-29 | Canon Kabushiki Kaisha | Fabrication of nanoscale thermoelectric devices |
| JP2006032850A (ja) | 2004-07-21 | 2006-02-02 | Tohoku Okano Electronics:Kk | 熱電変換モジュール |
| DE102005043772A1 (de) * | 2005-09-14 | 2007-03-15 | Forschungszentrum Karlsruhe Gmbh | Verfahren zur Herstellung eines Gegenstandes aus mindestens einem selbständigen beweglichen Teil und einem Fixierteil |
| CN100391021C (zh) * | 2005-10-21 | 2008-05-28 | 清华大学 | Ag-Pb-Sb-Te热电材料及其制备方法 |
| JP4908426B2 (ja) * | 2005-11-29 | 2012-04-04 | 株式会社東芝 | 熱電変換モジュールとそれを用いた熱交換器および熱電発電装置 |
| DE102006039024A1 (de) * | 2006-08-19 | 2008-02-21 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Thermogenerator |
| DE102006055120B4 (de) | 2006-11-21 | 2015-10-01 | Evonik Degussa Gmbh | Thermoelektrische Elemente, Verfahren zu deren Herstellung und deren Verwendung |
| JP4912931B2 (ja) * | 2007-03-22 | 2012-04-11 | 住友化学株式会社 | 熱電変換モジュールの製造方法及び熱電変換モジュール |
| WO2009042720A1 (en) | 2007-09-25 | 2009-04-02 | Neosync, Inc. | Systems and methods for anxiety treatment using neuro-eeg synchronization therapy |
| JP4404127B2 (ja) * | 2007-09-28 | 2010-01-27 | ヤマハ株式会社 | 熱電モジュール用基板およびこの基板を用いた熱電モジュール |
| DE102008005694B4 (de) * | 2008-01-23 | 2015-05-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Herstellung eines thermoelektrischen Bauelementes |
| US20090199887A1 (en) * | 2008-02-08 | 2009-08-13 | North Carolina State University And Nextreme Thermal Solutions, Inc. | Methods of forming thermoelectric devices including epitaxial thermoelectric elements of different conductivity types on a same substrate and related structures |
| DE102009009586A1 (de) * | 2009-02-19 | 2010-08-26 | Emitec Gesellschaft Für Emissionstechnologie Mbh | Thermoelektrische Vorrichtung |
| CA2768978A1 (en) * | 2009-07-27 | 2011-02-03 | Basf Se | Method for producing thermoelectric semiconductor materials and branches |
| AT508979A1 (de) * | 2009-10-23 | 2011-05-15 | Miba Sinter Austria Gmbh | Verfahren zum herstellen eines thermoelektrischen elementes |
| DE102010035151A1 (de) * | 2010-08-23 | 2012-02-23 | Emitec Gesellschaft Für Emissionstechnologie Mbh | Halbleiterelement für ein thermoelektrisches Modul und Verfahren zu dessen Herstellung |
| FR2968837B1 (fr) * | 2010-12-10 | 2013-08-23 | Centre Nat Rech Scient | Thermo-générateur et procédé de réalisation de thermo-générateur |
| KR20120070906A (ko) * | 2010-12-22 | 2012-07-02 | 삼성전기주식회사 | 열전 장치 |
| DE102011008377A1 (de) * | 2011-01-12 | 2012-07-12 | Emitec Gesellschaft Für Emissionstechnologie Mbh | Thermoelektrisches Material und Verfahren zur Herstellung |
| JP5308577B2 (ja) * | 2011-02-22 | 2013-10-09 | パナソニック株式会社 | 熱電変換素子とその製造方法 |
| WO2012135428A1 (en) * | 2011-03-29 | 2012-10-04 | The Government Of The United States Of America, As Represented By The Secretary Of The Navy | Thermoelectric materials |
| US20130019918A1 (en) * | 2011-07-18 | 2013-01-24 | The Regents Of The University Of Michigan | Thermoelectric devices, systems and methods |
| DE102011054739A1 (de) * | 2011-10-24 | 2013-04-25 | O-Flexx Technologies Gmbh | Thermoelement und Herstellungsverfahren |
| US10205080B2 (en) * | 2012-01-17 | 2019-02-12 | Matrix Industries, Inc. | Systems and methods for forming thermoelectric devices |
| CN103296190B (zh) * | 2012-02-28 | 2016-01-13 | 中国科学院上海微系统与信息技术研究所 | 三维热电能量收集器及其制作方法 |
| DE102012205098B4 (de) | 2012-03-29 | 2020-04-02 | Evonik Operations Gmbh | Thermoelektrische Bauelemente auf Basis trocken verpresster Pulvervorstufen |
| DE102012205087A1 (de) | 2012-03-29 | 2013-10-02 | Evonik Industries Ag | Pulvermetallurgische Herstellung eines thermoelektrischen Bauelements |
| WO2013165938A1 (en) | 2012-05-03 | 2013-11-07 | 3M Innovative Properties Company | Durable solar mirror films |
| JP2014007376A (ja) * | 2012-05-30 | 2014-01-16 | Denso Corp | 熱電変換装置 |
| US9620700B2 (en) * | 2013-01-08 | 2017-04-11 | Analog Devices, Inc. | Wafer scale thermoelectric energy harvester |
| DE102014203139A1 (de) | 2014-02-21 | 2015-08-27 | Evonik Degussa Gmbh | Verbesserungen betreffend Kontaktbrücken thermoelektrischer Bauelemente |
-
2013
- 2013-09-27 DE DE102013219541.9A patent/DE102013219541B4/de active Active
-
2014
- 2014-08-14 DK DK14752313.8T patent/DK3050131T3/en active
- 2014-08-14 CN CN201480052965.3A patent/CN105637663B/zh active Active
- 2014-08-14 RU RU2016115811A patent/RU2639615C2/ru active
- 2014-08-14 TR TR2018/06647T patent/TR201806647T4/tr unknown
- 2014-08-14 UA UAA201604512A patent/UA116040C2/uk unknown
- 2014-08-14 EP EP14752313.8A patent/EP3050131B1/de active Active
- 2014-08-14 PL PL14752313T patent/PL3050131T3/pl unknown
- 2014-08-14 US US15/025,162 patent/US9553249B2/en active Active
- 2014-08-14 CA CA2924139A patent/CA2924139C/en active Active
- 2014-08-14 ES ES14752313.8T patent/ES2668691T3/es active Active
- 2014-08-14 WO PCT/EP2014/067387 patent/WO2015043824A1/de active Application Filing
-
2015
- 2015-04-14 NO NO15163554A patent/NO2933810T3/no unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CA2924139A1 (en) | 2015-04-02 |
| CN105637663A (zh) | 2016-06-01 |
| WO2015043824A1 (de) | 2015-04-02 |
| RU2639615C2 (ru) | 2017-12-21 |
| US20160240763A1 (en) | 2016-08-18 |
| DE102013219541A1 (de) | 2015-04-02 |
| PL3050131T3 (pl) | 2018-08-31 |
| EP3050131B1 (de) | 2018-02-14 |
| ES2668691T3 (es) | 2018-05-21 |
| TR201806647T4 (tr) | 2018-06-21 |
| CN105637663B (zh) | 2018-01-12 |
| EP3050131A1 (de) | 2016-08-03 |
| DE102013219541B4 (de) | 2019-05-09 |
| RU2016115811A (ru) | 2017-11-01 |
| UA116040C2 (uk) | 2018-01-25 |
| DK3050131T3 (en) | 2018-05-22 |
| CA2924139C (en) | 2018-11-06 |
| US9553249B2 (en) | 2017-01-24 |