NL8900367A - Werkwijze voor het vervaardigen van ingekapselde geleiders. - Google Patents
Werkwijze voor het vervaardigen van ingekapselde geleiders. Download PDFInfo
- Publication number
- NL8900367A NL8900367A NL8900367A NL8900367A NL8900367A NL 8900367 A NL8900367 A NL 8900367A NL 8900367 A NL8900367 A NL 8900367A NL 8900367 A NL8900367 A NL 8900367A NL 8900367 A NL8900367 A NL 8900367A
- Authority
- NL
- Netherlands
- Prior art keywords
- mask
- substrate
- opening
- metal
- metal pattern
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 33
- 239000004020 conductor Substances 0.000 title description 8
- 238000004519 manufacturing process Methods 0.000 title description 6
- 229910052751 metal Inorganic materials 0.000 claims description 38
- 239000002184 metal Substances 0.000 claims description 38
- 238000000151 deposition Methods 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 20
- 230000008021 deposition Effects 0.000 claims description 16
- 238000004544 sputter deposition Methods 0.000 claims description 11
- 238000007740 vapor deposition Methods 0.000 claims description 4
- 239000010953 base metal Substances 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 17
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 8
- 229910052721 tungsten Inorganic materials 0.000 description 7
- 239000010937 tungsten Substances 0.000 description 7
- 150000002739 metals Chemical class 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 5
- 230000000873 masking effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000001465 metallisation Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- -1 for example Chemical group 0.000 description 1
- 239000003102 growth factor Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000001455 metallic ions Chemical group 0.000 description 1
- 239000013528 metallic particle Substances 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011236 particulate material Substances 0.000 description 1
- 230000003711 photoprotective effect Effects 0.000 description 1
- 239000012716 precipitator Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/006—Apparatus or processes for applying terminals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/143—Masks therefor
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Ceramic Capacitors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/209,588 US4830723A (en) | 1988-06-22 | 1988-06-22 | Method of encapsulating conductors |
| US20958888 | 1988-06-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL8900367A true NL8900367A (nl) | 1990-01-16 |
Family
ID=22779385
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL8900367A NL8900367A (nl) | 1988-06-22 | 1989-02-15 | Werkwijze voor het vervaardigen van ingekapselde geleiders. |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US4830723A (fr) |
| JP (1) | JPH01321612A (fr) |
| KR (1) | KR900000499A (fr) |
| BR (1) | BR8901600A (fr) |
| CH (1) | CH678378A5 (fr) |
| DE (1) | DE3906018A1 (fr) |
| ES (1) | ES2010414A6 (fr) |
| FR (1) | FR2633453B1 (fr) |
| GB (1) | GB2220108B (fr) |
| IT (1) | IT1229172B (fr) |
| NL (1) | NL8900367A (fr) |
| SE (1) | SE467811B (fr) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU632307B2 (en) * | 1989-02-23 | 1992-12-24 | Chiyoda Technical & Industrial Co., Ltd. | System for making composite blocks |
| US5223108A (en) * | 1991-12-30 | 1993-06-29 | Materials Research Corporation | Extended lifetime collimator |
| IL102120A (en) * | 1992-06-05 | 1994-08-26 | Persys Technology Ltd | Mask, assembly and method that enable quality control of equipment for the production of semiconductor slice chips |
| US5427983A (en) | 1992-12-29 | 1995-06-27 | International Business Machines Corporation | Process for corrosion free multi-layer metal conductors |
| US5484640A (en) * | 1994-02-16 | 1996-01-16 | Eldim, Inc. | Honeycomb structure having stiffening ribs and method and apparatus for making same |
| US6344234B1 (en) * | 1995-06-07 | 2002-02-05 | International Business Machines Corportion | Method for forming reflowed solder ball with low melting point metal cap |
| US5863396A (en) * | 1996-10-25 | 1999-01-26 | Applied Materials, Inc. | Method and apparatus for fabricating a wafer spacing mask on a substrate support chuck |
| US6153491A (en) * | 1997-05-29 | 2000-11-28 | International Business Machines Corporation | Overhanging separator for self-defining discontinuous film |
| US6000270A (en) * | 1997-06-03 | 1999-12-14 | Sjm Engineering, Inc. | Collimator having tapered edges and method of making the same |
| US6266228B1 (en) | 1997-11-10 | 2001-07-24 | Murata Manufacturing Co., Ltd | Multilayer capacitor |
| JP2991175B2 (ja) | 1997-11-10 | 1999-12-20 | 株式会社村田製作所 | 積層コンデンサ |
| US6266229B1 (en) | 1997-11-10 | 2001-07-24 | Murata Manufacturing Co., Ltd | Multilayer capacitor |
| US6292350B1 (en) | 1997-11-10 | 2001-09-18 | Murata Manufacturing, Co., Ltd | Multilayer capacitor |
| US6549395B1 (en) | 1997-11-14 | 2003-04-15 | Murata Manufacturing Co., Ltd | Multilayer capacitor |
| US6051273A (en) * | 1997-11-18 | 2000-04-18 | International Business Machines Corporation | Method for forming features upon a substrate |
| US6096404A (en) * | 1997-12-05 | 2000-08-01 | Applied Materials, Inc. | Full face mask for capacitance-voltage measurements |
| US6030513A (en) * | 1997-12-05 | 2000-02-29 | Applied Materials, Inc. | Full face mask for capacitance-voltage measurements |
| JP3476127B2 (ja) | 1999-05-10 | 2003-12-10 | 株式会社村田製作所 | 積層コンデンサ |
| JP3548821B2 (ja) | 1999-05-10 | 2004-07-28 | 株式会社村田製作所 | 積層コンデンサ、ならびにこれを用いた電子装置および高周波回路 |
| US6327134B1 (en) | 1999-10-18 | 2001-12-04 | Murata Manufacturing Co., Ltd. | Multi-layer capacitor, wiring board, and high-frequency circuit |
| JP3489729B2 (ja) | 1999-11-19 | 2004-01-26 | 株式会社村田製作所 | 積層コンデンサ、配線基板、デカップリング回路および高周波回路 |
| JP3901122B2 (ja) * | 2003-05-07 | 2007-04-04 | ソニー株式会社 | アルカリ電池の負極カップの製法 |
| EP1653788A1 (fr) * | 2004-10-28 | 2006-05-03 | Delphi Technologies, Inc. | Maske d'ombre pour engendrer un region electroconducteur sur une carte a circuits imprimes a trois dimensions |
| US8242878B2 (en) | 2008-09-05 | 2012-08-14 | Vishay Dale Electronics, Inc. | Resistor and method for making same |
| US9142533B2 (en) * | 2010-05-20 | 2015-09-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Substrate interconnections having different sizes |
| US9425136B2 (en) | 2012-04-17 | 2016-08-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Conical-shaped or tier-shaped pillar connections |
| US9299674B2 (en) | 2012-04-18 | 2016-03-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Bump-on-trace interconnect |
| US9111817B2 (en) | 2012-09-18 | 2015-08-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Bump structure and method of forming same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4024041A (en) * | 1974-12-18 | 1977-05-17 | Hitachi, Ltd. | Method of forming deposition films for use in multi-layer metallization |
| US4561954A (en) * | 1985-01-22 | 1985-12-31 | Avx Corporation | Method of applying terminations to ceramic bodies |
| US4740863A (en) * | 1987-05-15 | 1988-04-26 | Sfe Technologies | Current-limiting thin film termination for capacitors |
| US4741077A (en) * | 1987-05-15 | 1988-05-03 | Sfe Technologies | End terminations for capacitors |
-
1988
- 1988-06-22 US US07/209,588 patent/US4830723A/en not_active Expired - Fee Related
-
1989
- 1989-02-01 GB GB8902168A patent/GB2220108B/en not_active Expired - Lifetime
- 1989-02-07 FR FR8901552A patent/FR2633453B1/fr not_active Expired - Lifetime
- 1989-02-09 CH CH443/89A patent/CH678378A5/fr not_active IP Right Cessation
- 1989-02-13 KR KR1019890001623A patent/KR900000499A/ko not_active Application Discontinuation
- 1989-02-15 NL NL8900367A patent/NL8900367A/nl not_active Application Discontinuation
- 1989-02-20 JP JP1040145A patent/JPH01321612A/ja active Pending
- 1989-02-22 ES ES8900636A patent/ES2010414A6/es not_active Expired
- 1989-02-22 SE SE8900611A patent/SE467811B/sv not_active IP Right Cessation
- 1989-02-27 DE DE3906018A patent/DE3906018A1/de not_active Withdrawn
- 1989-04-05 BR BR898901600A patent/BR8901600A/pt active Search and Examination
- 1989-04-10 IT IT8920087A patent/IT1229172B/it active
Also Published As
| Publication number | Publication date |
|---|---|
| US4830723A (en) | 1989-05-16 |
| SE8900611L (sv) | 1989-12-23 |
| DE3906018A1 (de) | 1989-12-28 |
| CH678378A5 (fr) | 1991-08-30 |
| BR8901600A (pt) | 1990-04-10 |
| GB8902168D0 (en) | 1989-03-22 |
| FR2633453B1 (fr) | 1992-11-06 |
| IT1229172B (it) | 1991-07-22 |
| SE467811B (sv) | 1992-09-14 |
| ES2010414A6 (es) | 1989-11-01 |
| IT8920087A0 (it) | 1989-04-10 |
| JPH01321612A (ja) | 1989-12-27 |
| SE8900611D0 (sv) | 1989-02-22 |
| GB2220108A (en) | 1989-12-28 |
| KR900000499A (ko) | 1990-01-30 |
| FR2633453A1 (fr) | 1989-12-29 |
| GB2220108B (en) | 1992-12-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| BV | The patent application has lapsed |